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Free standing, three dimensional, multi-chip, carrier package with air flow baffle 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/11
  • H05K-001/14
출원번호 US-0010667 (1998-01-22)
발명자 / 주소
  • Ingraham Anthony P.
  • Kehley Glenn L.
  • Sathe Sanjeev B.
  • Slack John R.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Whitham, Curtis & Whitham
인용정보 피인용 횟수 : 55  인용 특허 : 12

초록 ▼

An efficient cooling mechanism for a multi-chip carrier can be provided while conserving board surface area. Flexible circuitized material is used to form multi-chip carriers with air baffle capability. The flex is folded or curved into the desired shape and held in position with a support structure

대표청구항 ▼

[ We claim:] [1.] A circuitized chip carrier comprising:a circuitized substrate composed of a flexible material formed into a predetermined shape which functions as an air flow baffle;a means for holding said circuitized flexible material in the predetermined shape, wherein said means for holding is

이 특허에 인용된 특허 (12)

  1. Kato Miki,JPX ; Tamano Yukinori,JPX ; Kobayashi Katsumi,JPX ; Noba Michiyuki,JPX, Coil-shaped flexible printed circuit board.
    상세보기
  2. Kornrumpf William P. (Albany NY), Compact high density interconnected microwave system.
    상세보기
  3. Eichelberger Charles W. (Schenectady NY) Kornrumpf William P. (Albany NY) Wojnarowski Robert J. (Ballston Lake NY), Flexible high density interconnect structure and flexibly interconnected system.
    상세보기
  4. Fujii Masahiro (Tokyo JPX), Folded printed wiring board structure with electromagnetic shield.
    상세보기
  5. Kuhl Virgil F. (Lauderhill FL) Ruiz Jose A. (Tamarac FL) Lipinski Richard D. (Coral Springs FL) Noll Guenter (Ft. Lauderdale FL), Header for an electronic circuit.
    상세보기
  6. Denes Oscar L. (Greendale WI), Injection molded printed circuits.
    상세보기
  7. Ocken Alfred G. (Palatine IL) Unterman Nathan A. (Chicago IL) Fisher Timothy S. (Chicago IL) Petrites Michael I. (Schaumburg IL), Laminated electronic module assembly.
    상세보기
  8. Paurus Floyd G. (Boulder CO) Szerlip Stanley R. (Longmont CO), Memory stack with an integrated interconnect and mounting structure.
    상세보기
  9. Inoue Akira (Itami JPX), Packaged microwave semiconductor device.
    상세보기
  10. Akami Noboru (Yokohama JPX), Printed circuit board.
    상세보기
  11. Kane Milburn H. (Austin TX) Roby John G. (Cedar Park TX) Schrottke Gustav (Austin TX), Stacked DCA memory chips.
    상세보기
  12. Henle Robert A. (Clinton Corners NY) Johnson Alfred H. (Poughkeepsie NY), Vertical semiconductor integrated circuit chip packaging.
    상세보기

이 특허를 인용한 특허 (55)

  1. Dupriest, Charles Donald, Cable and method.
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  2. Huang, Shuai-Hui; Guo, Ru-Yang; Zhu, Qing-Man; Wu, Jerry, Cable connector assembly with a shorter size and method of assembling the same.
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  3. Gordon Mark G., Chip stack with active cooling system.
    상세보기
  4. Bruce, Ted; Forthun, John A., Chip stack with differing chip package types.
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  5. Bolognia, David, Compact device package.
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  6. Bolognia, David, Compact device package.
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  7. Bolognia, David Frank, Compact wearable biological sensor modules.
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  8. Bolognia, David Frank, Compact wearable biological sensor modules.
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  9. Dean, David L.; Bennett, Dennis; Ellis, Robert W., Electronic assembly with thermal channel and method of manufacture thereof.
    상세보기
  10. Dean, David Lee; Bennett, Dennis; Ellis, Robert W., Electronic assembly with thermal channel and method of manufacture thereof.
    상세보기
  11. Umematsu, Misao, Electronic device.
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  12. Dean, David Lee; Ellis, Robert W., Electronic system with heat extraction and method of manufacture thereof.
    상세보기
  13. Husser, Jon; Dixler, Keith E.; Baker, Thomas M.; Sychra, Robert R., Electronics component packaging for power converter.
    상세보기
  14. Haba, Belgacem; Kubota, Yoichi; Kang, Teck-Gyu; Park, Jae M., Fine pitch microcontacts and method for forming thereof.
    상세보기
  15. Wehrly, Jr., James Douglas; Goodwin, Paul; Rapport, Russell, Flex circuit constructions for high capacity circuit module systems and methods.
    상세보기
  16. Peterson, Eric C.; Belady, Christian L., Flexible midplane and architecture for a multi-processor computer system.
    상세보기
  17. Kwon, Jinsu, Flip chip interconnection with double post.
    상세보기
  18. Wright, David A.; Dean, David; Ellis, Robert W., Heat dissipation for substrate assemblies.
    상세보기
  19. Wright, David A.; Dean, David; Ellis, Robert W., Heat dissipation for substrate assemblies.
    상세보기
  20. Wehrly, Jr., James Douglas; Wilder, James; Goodwin, Paul; Wolfe, Mark, Heat sink for a high capacity thin module system.
    상세보기
  21. Watson, Edwin George, High density packaging of electronic components.
    상세보기
  22. Akram, Salman, High density stackable and flexible substrate-based devices and systems and methods of fabricating.
    상세보기
  23. Salman Akram, High density stackable and flexible substrate-based devices and systems and methods of fabricating.
    상세보기
  24. Akram, Salman, High density stackable and flexible substrate-based semiconductor device modules.
    상세보기
  25. Gupta, Debabrata; Hashimoto, Yukio; Mohammed, Ilyas; Mirkarimi, Laura Wills; Katkar, Rajesh, Interconnect structure.
    상세보기
  26. Gupta, Debabrata; Hashimoto, Yukio; Mohammed, Ilyas; Mirkarimi, Laura; Katkar, Rajesh, Interconnect structure.
    상세보기
  27. Okamoto, Chikashi; Takaragi, Kazuo; Tsuji, Kazutaka; Usami, Mitsuo; Yasunobu, Chizuko; Sobe, Asahiko; Tsunemi, Yasuhiro; Yagi, Hiroyuki, Method for mounting electronic circuit chip.
    상세보기
  28. Kubota, Yoichi; Kang, Teck-Gyu; Park, Jae M.; Haba, Belgacem, Method of making a connection component with posts and pads.
    상세보기
  29. Okamoto, Chikashi; Takaragi, Kazuo; Tsuji, Kazutaka; Usami, Mitsuo; Yasunobu, Chizuko; Sobe, Asahiko; Tsunemi, Yasuhiro; Yagi, Hiroyuki, Method of mounting electronic circuit chip.
    상세보기
  30. Damberg, Philip; Haba, Belgacem; Tuckerman, David B.; Kang, Teck-Gyu, Micro pin grid array with pin motion isolation.
    상세보기
  31. Haba, Belgacem, Microelectronic packages with dual or multiple-etched flip-chip connectors.
    상세보기
  32. Haba, Belgacem, Microelectronic packages with nanoparticle joining.
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  33. Haba, Belgacem, Microelectronic packages with nanoparticle joining.
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  34. Haba, Belgacem, Microelectronic packages with nanoparticle joining.
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  35. Quan, Clifton; Kim, Hee Kyung; Yang, Fangchou; Rolston, Kevin C.; Jackson, Edward Marsh, Multi-layer microwave corrugated printed circuit board and method.
    상세보기
  36. Bolognia, David; Venkatadri, Vikram, Multi-port device package.
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  37. Shim, Il Kwon; DiCaprio, Vincent, Multi-stacked memory package.
    상세보기
  38. Wehrly, Jr., James Douglas; Wolfe, Mark; Goodwin, Paul, Optimized mounting area circuit module system and method.
    상세보기
  39. Houston, Robert B., Perimeter beam tower.
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  40. Viscarra, Alberto F.; Winslow, David T.; Ables, Billy D.; Ketola, Kurt S.; Krause, Kurt J.; Rolston, Kevin C.; Sauer, Rohn; Chow, James R., Process for fabricating a three dimensional molded feed structure.
    상세보기
  41. Viscarra, Alberto F.; Heinrich, Ethan S.; Campbell, Melvin S.; Winslow, David T.; Rolston, Kevin C.; Vidaurri, Rosalio S., Process for forming channels in a flexible circuit substrate using an elongated wedge and a channel shaped receptacle.
    상세보기
  42. Quan, Clifton; Yang, Fangchou; Kim, Hee Kyung; Viscarra, Alberto F., RF transition with 3-dimensional molded RF structure.
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  43. Dean, David; Ellis, Robert W., Self-supporting thermal tube structure for electronic assemblies.
    상세보기
  44. Ichinose, Michihiko; Takizawa, Tomoko, Semiconductor device and semiconductor module using the same.
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  45. Stephen G. Gonya, Signal cross-over interconnect for a double-sided circuit card assembly.
    상세보기
  46. Houston, Robert, Solar powered security system.
    상세보기
  47. Warner,Michael; Damberg,Philip; Riley,John B.; Gibson,David; Kim,Young Gon; Haba,Belgacem; Solberg,Vernon, Stacked microelectronic assemblies.
    상세보기
  48. Uzoh, Cyprian Emeka, Structures and methods for low temperature bonding using nanoparticles.
    상세보기
  49. Uzoh, Cyprian Emeka, Structures and methods for low temperature bonding using nanoparticles.
    상세보기
  50. Dean, David; Ellis, Robert, System and method for heat dissipation.
    상세보기
  51. Ellis, Robert W.; Dean, David, System and method for redirecting airflow across an electronic assembly.
    상세보기
  52. Dean, David Lee; Ellis, Robert W.; Harrow, Scott, Test system with localized heating and method of manufacture thereof.
    상세보기
  53. Dean, David; Ellis, Robert W., Thermal isolation techniques.
    상세보기
  54. Ellis, Robert W.; Dean, David, Thermal tube assembly structures.
    상세보기
  55. Jang Kyung-Woo,KRX, Three dimensional composite circuit board.
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