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Prepreg of reinforcing fibers, epoxy resins, crosslinked rubber particles and curing agent

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-027/04
  • C08K-007/02
  • C08L-063/02
  • C08L-063/04
출원번호 US-0644025 (1996-05-09)
우선권정보 JP-0110888 (1995-05-09)
발명자 / 주소
  • Oosedo Hiroki,JPX
  • Noda Shunsaku,JPX
출원인 / 주소
  • Toray Industries, Inc., JPX
대리인 / 주소
    Morrison & Foerster LLP
인용정보 피인용 횟수 : 40  인용 특허 : 25

초록 ▼

Disclosed are epoxy resin compositions for fiber-reinforced composite materials, comprising an epoxy resin containing 70 parts by weight or more, per 100 parts by weight of the epoxy resin, of a bi-functional epoxy resin, fine particles comprising a rubber phase and substantially insoluble in epoxy

대표청구항 ▼

[ What is claimed is:] [1.] A prepreg, comprising:reinforcing fibers and a resin composition, said resin composition comprising:an epoxy resin containing 70 parts by weight or more, per 100 parts by weight of said epoxy resin, of a bi-functional epoxy resin;fine particles which comprise a crosslinke

이 특허에 인용된 특허 (25)

  1. Maranci Artun (Westport CT) Peake Steven L. (Ridgefield CT) Kaminski Stanley S. (Stamford CT), Advance composites with thermoplastic particles at the interface between layers.
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  2. Adam Randall E. (Woodbury MN) Schultz William J. (Vadnais Heights MN), Curable epoxy compositions and cured resins obtained therefrom.
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  3. Gawin Irena (Sandy UT), Damage tolerant composites containing infusible particles.
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  4. Gawin Irena (Sandy UT), Damage tolerant composites containing infusible particles.
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  5. Gawin Irena (Sandy UT) Swetlin Brian J. (Wilmington DE), Damage tolerant composites containing infusible particles.
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  6. Ashida Tadashi (Yokohama JPX) Ohnishi Masahiko (Yokosuka JPX) Nagase Toshio (Ibaragi JPX) Nakayama Akira (Yokosuka JPX), Epoxy resin adhesive composition.
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  7. Minamisawa Tsuyoshi (Shizuoka JPX) Kogo Yasuo (Shizuoka JPX) Nagata Yasuhisa (Shizuoka JPX), Epoxy resin composition.
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  8. Pottick, Lorelle A.; Modic, Michael J., Epoxy resin composition.
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  9. Wykowski Paul L. (Lake Jackson TX) Puckett Paul M. (Lake Jackson TX), Epoxy resin compositions for use in low temperature curing applications.
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  10. Gardner Hugh C. (Somerville NJ) Newman-Evans Richard H. (Somerville NJ), Exopy resin with aromatic oligomer and rubber particles.
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  11. Boyd Jack D. (Westminster CA) Mead William T. (Irvine CA) Biermann Theodore F. (Mission Viejo CA), Extreme damage tolerant graphite composites and method of making same.
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  12. Odagiri Nobuyuki (Shiga JPX) Suzue Shigeru (Aichi JPX) Kishi Hajime (Kyoto JPX) Nakae Takeji (Otsu JPX) Matsusaki Akimitsu (Shiga JPX), Fiber reinforced composite materials having resin practice inter-layer zones.
    상세보기
  13. Qureshi Shahid P. (Piscataway NJ) Newman-Evans Richard H. (Hillsborough NJ) Gardner Hugh C. (Hillsborough NJ), Fiber-reinforced composites toughened with resin particles.
    상세보기
  14. Browne James M. (21 Pillon Real Pleasant Hill CA 94523) Steiner Paul A. (732 San Juan Ct. Concord CA 94518), Impact enhanced prepregs and formulations.
    상세보기
  15. Kim Yang S. (Seoul CA KRX) Steiner Paul A. (Concord CA), Inorganic whisker containing impact enhanced prepregs and formulations formulations.
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  16. Tanaka Hideho (Hirakata JPX) Fujii Kazuyoshi (Hirakata JPX) Nishimura Kazuo (Hirakata JPX), Interleaf-containing, fiber-reinforced epoxy resin prepreg.
    상세보기
  17. Henton David E. (Midland MI) O\Brien Teresa M. (Midland MI), Particle agglomeration in rubber latices.
    상세보기
  18. Khasat Nitya P. (Newark DE) Leach Douglas (Wilmington DE), Polydicyclopentadiene having improved stability and toughened with polymeric particles.
    상세보기
  19. Eldin Sameer H. (Courtepin CHX) Peyer Robert P. (Lausen CHX) Setiabudi Frans (Bad Krozingen DEX), Preparing suspension of epoxy resin hardener and toughener.
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  20. Turpin Russell L. (Canyon Country CA), Production of thermoset composites containing thermoplastic fillers.
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  21. Eldin Sameer H. (Courtepin CHX) Peyer Robert P. (Lausen CHX) Setiabudi Frans (Bad Krozingen DEX), Storage-stable suspension of tougheners in epoxy resin hardeners.
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  22. Evans Robert E. (Trumbull CT) Hirschbuehler Kevin R. (Bel Air MD), Thermoplastic interleafed resin matrix composites with improved impact strength and toughness.
    상세보기
  23. Buyny Robert A. (Clayton CA) Olesen Karen A. (Pleasanton CA), Toughened resin systems for composite applications.
    상세보기
  24. Boyd Jack D. (Westminster CA), Toughened thermosetting structural materials.
    상세보기
  25. Folda Thomas (Neuleiningen CA DEX) Boyd Jack D. (Westminster CA) Tesch Helmut (Birkenheide DEX) Weber Thomas (Ludwigshafen CA DEX) Recker Hans G. (Irvine CA), Toughened thermosetting structural materials.
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  1. Brandys, Frank A.; Irwin, Michael J.; Tarbutton, Kent S., Ambient-temperature-stable, one-part curable epoxy adhesive.
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  2. DiMascio, II, Ramon Joseph; Schisler, Robert Charles, Aramid cord treatment.
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  3. Strange, Andrew C.; McGuire, Jr., James E., Braid-reinforced composites and processes for their preparation.
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  4. Wadahara,Eisuke; Nishimura,Akira; Horibe,Ikuo, Carbon fiber reinforced base material, preform and composite material comprising the same.
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  5. Liang, Jeng-Li; Agarawal, Rajat K.; Ferguson, Gregory A.; Lammerschop, Olaf; Dittrich, Frank; Schoenfeld, Rainer, Curable epoxy resin-based adhesive compositions.
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  6. Oohori, Kenichi; Nakamura, Yoshihiro; Murai, Hikari; Takeda, Yoshiyuki; Hirai, Yasuyuki; Kamoshida, Shinichi; Kakitani, Minoru; Abe, Norihiro; Numata, Syunichi; Aizawa, Teruki; Nanaumi, Ken, Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin.
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  7. Habibi, Hamid; Gallas, Michael L., Electro-optic mirror element and process of making same.
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  8. Habibi, Hamid; Gallas, Michael L., Electro-optic mirror element and process of making same.
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  9. Tonar, William L.; Stray, Joel A.; Veenman, Steven J.; Kloeppner, Leroy J.; Poll, David L.; Dozeman, Gary J.; Menon, Nalini C., Electrochromic device having an improved fill port plug.
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  10. Veenman, Steven J.; Tonar, William L.; Stray, Joel A.; Kloeppner, Leroy J.; Poll, David L.; Dozeman, Gary J.; Menon, Nalini C.; Ash, Kevin L., Electrochromic device having an improved fill port plug.
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  11. Veenman, Steven J.; Tonar, William L.; Stray, Joel A.; Kloeppner, Leroy J.; Poll, David L.; Dozeman, Gary J.; Menon, Nalini C.; Ash, Kevin L., Electrochromic device having an improved fill port plug.
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  12. Veenman, Steven J.; Tonar, William L.; Stray, Joel A.; Kloeppner, Leroy J.; Poll, David L; Dozeman, Gary J.; Menon, Nalini C.; Ash, Kevin L., Electrochromic device having an improved fill port plug.
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  13. Chen, Chunfu, Electrochromic device with composition of epoxy resin, toughener and latent curative.
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  14. Tsuchida, Satoru; Osaka, Masahiko; Ogata, Masatsugu, Encapsulant of epoxy resin and liquid aromatic amine curing agent.
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  15. Wei, Yi; Baidak, Alexandre A.; Senger, James, Engineered cross-linked thermoplastic particles for interlaminar toughening.
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  16. Taguchi, Masato; Koba, Hisao; Yamaguchi, Yutaka, Epoxy resin composition, prepreg, and roll made of resin reinforced with reinforcing fibers.
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  17. Brown,James E.; Natsume,Norimitsu; Odagiri,Nobuyuki; Hawkey,Jeffrey J.; Hayes,Brian S., Epoxy resin for fiber reinforced composite materials.
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  18. Choate, Martin; Sharma, Jyoti; Peters, Steve; Rafferty, Kevin, Epoxy resin, SMA copolymer and bis-maleimidetriazine resin.
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  19. Veenman, Steven J.; Kloeppner, Leroy J., Fill port plugs for electrochromic devices.
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  20. Goldsmith, Edward M.; DeLap, Christopher K., Hockey stick.
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  21. Goldsmith, Edward M.; DeLap, Christopher K., Hockey stick.
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  22. Goldsmith,Edward M.; DeLap,Christopher K., Hockey stick.
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  23. Goldsmith,Edward M; Easton,James L., Hockey stick.
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  24. Goldsmith,Edward M; Easton,James L., Hockey stick.
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  25. Halko, Roman D.; Ghassemi, Homayun; Goldsmith, Edward M., Hockey stick.
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  26. Halko,Roman D.; Ghassemi,Homayun; Goldsmith,Edward M., Hockey stick.
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  27. McGrath, Michael J.; Halko, Roman D.; Goldsmith, Edward M., Hockey stick.
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  28. McGrath, Michael J.; Halko, Roman D.; Goldsmith, Edward M., Hockey stick.
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  29. Choate,Martin; Libke,Gregory J.; Conn,Peggy; Peters,Steve, Laminate composition.
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  30. Strange, Andrew C.; McGuire, Jr., James E., Linerless prepregs, composite articles therefrom, and related methods.
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  31. Shigetsugu Hayashi JP; Masahiro Sugimori JP; Tomowo Sano JP; Tadashi Yokochi JP; Masayuki Fukumoto JP; Yasushi Suzumura JP; Hideo Konishi JP; Toshikazu Aoki JP; Mikio Takasu JP, Method of repairing/reinforcing existing structures and anisotropic woven fabrics used therefor.
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  32. Choate, Martin; Sharma, Jyoti; Peters, Steve; Rafferty, Kevin, Prepreg and laminate of epoxy resin, styrene-maleic anhydride copolymer and bis-maleimidetriazine.
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  33. Spyrou, Emmanouil; Loesch, Holger; Kreischer, Susanne; Thesing, Andrea, Process for the production of storage-stable epoxy prepregs, and composites produced therefrom, based on epoxides and acids amenable to free-radical polymerisation.
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  34. Lammerschop, Olaf; Hartsell, Scott; Agarwal, Rajat K., Pumpable epoxy paste adhesives resistant to wash-off.
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  35. Mortimer, Stephen; Stevens, Scott, Resin composition and composite structure containing resin.
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  36. Hsieh, Chen-Yu, Resin composition, prepreg, laminate and printed circuit board using the same.
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  37. Hsu Patrick C. T.,TWX, Shaft of golf club.
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  38. Collins, Andrew; Cheng, Chih-Min, Thermal interface material.
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  39. Choate, Martin; Sharma, Jyoti; Peters, Steve; Rafferty, Kevin, Thermosetting resin composition for high performance laminates.
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  40. Sharma,Jyoti; Choate,Martin; Peters,Steve; Rafferty,Kevin, Thermosetting resin composition for high performance laminates.
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