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Apparatus for three dimensional inspection of electronic components 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06K-009/00
출원번호 US-0321838 (1999-05-28)
발명자 / 주소
  • Beaty Elwin M.
  • Mork David P.
출원인 / 주소
  • Beaty
  • Elwin M.
대리인 / 주소
    Leone
인용정보 피인용 횟수 : 20  인용 특허 : 31

초록

A three dimensional inspection apparatus for ball array devices, where the ball array device is positioned in a fixed optical system. An illumination apparatus is positioned for illuminating the ball array device. A first camera is disposed in a fixed focus position relative to the ball array device

대표청구항

[ What is claimed is:] [1.] A three dimensional inspection apparatus for ball array devices having a plurality of balls, wherein the ball array device is positioned in a fixed optical system, the apparatus comprising:a) an illumination apparatus positioned for illuminating the ball array device;b) a

이 특허에 인용된 특허 (31)

  1. Beaty Elwin M. (13529 Arthur St. Minnetonka MN 55305), Apparatus and method for measuring ball grid arrays.
  2. Stern Howard ; Yonescu William E. ; Mauro Alex, Apparatus and method for obtaining three-dimensional data from objects in a contiguous array.
  3. Marrable ; Jr. Walter E. (Gunter TX), Apparatus and method for verifying the coplanarity of a ball grid array.
  4. Kobayashi Shigeki (Kyoto JPX) Tanimura Yasuaki (Kyoto JPX) Yotsuya Teruhisa (Kyoto JPX), Apparatus for inspecting printed circuit boards and the like, and method of operating same.
  5. Yamazaki Nobuto,JPX ; Ogata Yoshiyuki,JPX, Ball detection method and apparatus for wire-bonded parts.
  6. Jackson Robert Lea (Moorpark CA) Boman Robert Cottle (Simi Valley CA), Grid array inspection system and method.
  7. Jackson Robert Lea ; Boman Robert Cottle, Grid array inspection system and method.
  8. Siu Bernard (732 N. Diamond Bar Blvd. Diamond Bar CA 91765), High speed illumination system for microelectronics inspection.
  9. King Steven Joseph ; Ludlow Johathan Edmund ; Schurr George, Inspection method.
  10. Rooks Stephen M. (Willowdale CAX), Inspection system for cross-sectional imaging.
  11. Ohashi Yoshikazu, Machine vision methods and articles of manufacture for determination of convex hull and convex hull angle.
  12. Koljonen Juha (Needham MA) Michael David J. (Newton MA), Method and apparatus for ball bond inspection system.
  13. Ray Rajarshi (Princeton NJ), Method and apparatus for inspection of specular, three-dimensional features.
  14. Chau Henry K. ; Aiyer Arun A., Method and apparatus for macro defect detection using scattered light.
  15. Liu Kuo-Ching ; Liang Chu-Kwo ; Fwu Jong-Kae ; Huang Chung-Po, Method and system for measuring object features.
  16. Svetkoff Donald J. (Ann Arbor MI) Rohrer Donald K. (Whitmore Lake MI) Noblett David A. (Agoura CA) Jackson Robert L. (Moorpark CA), Method and system for triangulation-based, 3-D imaging utilizing an angled scaning beam of radiant energy.
  17. Svetkoff Donald J. ; Rohrer Donald K. ; Noblett David A. ; Jackson Robert L., Method and system for triangulation-based, 3-D imaging utilizing an angled scanning beam of radiant energy.
  18. Bilodeau Steve (Setauket NY) Jacovino Frank (Plainview NY) Cameron Joanne (Oakdale NY) Cain James (Calverton NY), Method for coplanarity inspection of package or substrate warpage for ball grid arrays, column arrays, and similar struc.
  19. Stern Howard (Greenlawn NY) Yonescu William E. (Smithtown NY) Mauro Alex (Holbrook NY), Method for obtaining three-dimensional data from semiconductor devices in a row/column array and control of manufacturin.
  20. Collet-Beillon Olivier (27 Avenue de Brimont 78400-Chatou FRX), Method of inspecting an array of solder ball connections of an integrated circuit module.
  21. Werson Michael J. (Eastleigh GB2), Optical inspection system.
  22. Suda Kyo (Hachioji JPX) Kimura Shigeharu (Kokubunji JPX) Hase Shinobu (Hachioji JPX) Munakata Chusuke (Tokyo JPX) Kinameri Kanji (Tokyo JPX) Ito Yoshitoshi (Ome JPX) Nagatomo Hiroto (Tokyo JPX) Tanig, Pattern defect inspection apparatus.
  23. Pai Deepak K., Process of measuring coplanarity of circuit pads and/or grid arrays.
  24. King Steven Joseph ; Ludlow Jonathan Edmund ; Chouinard Jon ; Schurr George, Ring illumination apparatus for illuminating reflective elements on a generally planar surface.
  25. King Steven Joseph ; Ludlow Jonathan Edmund ; Schurr George, Ring illumination reflective elements on a generally planar surface.
  26. Cohen Donald K. (Tucson AZ) Caber Paul J. (Tucson AZ) Brophy Chris P. (White Bear Township ; Ramsey County MN), Rough surface profiler and method.
  27. Okamoto Shinji (Yawata JPX) Yoshimura Kazunari (Yawata JPX) Nakahara Tomoharu (Nishinomiya JPX), Soldering inspection system and method therefor.
  28. Stern Howard (Greenlawn NY) Yonescu William E. (Smithtown NY), System for inspecting pin grid arrays.
  29. Svetkoff Donald J. ; Rohrer Donald K. ; Kelley Robert W., Triangulation-based 3-D imaging and processing method and system.
  30. Svetkoff Donald J. (Ann Arbor MI) Rohrer Donald K. (Whitmore Lake MI) Kelley Robert W. (Ann Arbor MI), Triangulation-based 3D imaging and processing method and system.
  31. Svetkoff Ronald J. (Ann Arbor MI) Rohrer Donald K. (Whitmore Lake MI) Kelley Robert W. (Ann Arbor MI), Triangulation-based 3D imaging and processing method and system.

이 특허를 인용한 특허 (20)

  1. Nakamura,Takayuki, Apparatus for generating three-dimensional model data.
  2. Deng, Jiangwen; Zhang, Zhuanyun; Chen, Fang Han; Sze, Wui Fung, Chromatic confocal scanning apparatus.
  3. Beaty,Elwin M.; Mork,David P., Electronic component products and method of manufacturing electronic component products.
  4. Grumbine, Michael T., Enhanced projector system for machine vision.
  5. Kujacznski, Nathan Andrew-Paul; St. Onge, James W.; Nygaard, Michael G., High speed method and system for inspecting a stream of parts.
  6. Ikeda, Yasuyuki; Fujieda, Shiro, Image processing device and image processing method for performing three dimensional measurements.
  7. Toh Peng Seng,SGX, Measurement and inspection of leads on integrated circuit packages.
  8. Smets, Carl; Van Gils, Karel; Van Der Burgt, Maarten, Measuring positions of coplanarity of contract elements of an electronic component with a flat illumination and two cameras.
  9. Smets,Carl; Van Gils,Karel; Zabolitsky,John; Everaerts,Jurgen, Method and an apparatus for measuring positions of contact elements of an electronic component.
  10. Puah, Yong Joo; Tang, Hak Wee; Teo, Soon Poo, Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components.
  11. Carpenter, Michael D.; Dunn, Morgan; Mampe, John J., Method and apparatus for detecting doubles in a singulated stream of flat articles.
  12. Tang, Hak Wee; Yang, Xulei; Thant, Zin Oo; Cao, Ruini, Method and apparatus for determining coplanarity in integrated circuit packages.
  13. Beaty, Elwin M.; Mork, David P., Method and apparatus for three dimensional inspection of electronic components.
  14. Beaty, Elwin M.; Mork, David P., Method and apparatus for three dimensional inspection of electronic components.
  15. Offenborn, Robert Joseph; Alexander, Christopher Michael; Nygaard, Gregory Martin; Nygaard, Michael George, Method and system for optically inspecting headed manufactured parts.
  16. Offenborn, Robert Joseph; Alexander, Christopher Michael; Nygaard, Gregory Martin; Nygaard, Michael George, Method and system for optically inspecting headed manufactured parts.
  17. Doany, Fuad E.; Perez, Andrew D.; Ruiz, Niranjana; Turlapati, Lavanya, Optical alignment module utilizing transparent reticle to facilitate tool calibration during high temperature process.
  18. Doany, Fuad E.; Perez, Andrew D.; Ruiz, Niranjana; Turlapati, Lavanya, Optical alignment module utilizing transparent reticle to facilitate tool calibration during high temperature process.
  19. Snow, Donald B.; Strom, John T.; Kraft, Raymond H., Stereoscopic three-dimensional metrology system and method.
  20. Snow,Donald B.; Kraft,Raymond H.; Strom,John T., Stereoscopic three-dimensional metrology system and method.
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