초록 ▼

Electroless plating of very thin metal films, such as copper, is accomplished with a spray processor. Atomized droplets or a continuous stream of an electroless plating solution are sprayed on a substrate. The electroless plating solution may be prepared by mixing a reducing solution and a metal sto

Electroless plating of very thin metal films, such as copper, is accomplished with a spray processor. Atomized droplets or a continuous stream of an electroless plating solution are sprayed on a substrate. The electroless plating solution may be prepared by mixing a reducing solution and a metal stock solution immediately prior to the spraying. The deposition process may be carried out in an apparatus which includes metal stock solution and reducing reservoirs, a mixing chamber for forming the plating solution, optionally an inert gas or air (oxygen) source, a process chamber in which the solution is sprayed on the substrate and a control system for providing solutions to the mixing chamber and the process chamber in accordance with a predetermined program for automated mixing and spraying of the plating solution. The process can be used to form metal films as thin as 100 .ANG. and these films have low resistivity values approaching bulk values, low surface roughness, excellent electrical and thickness uniformity and mirror-like surface. Low temperature annealing may be used to further improve electrical characteristics of the deposited films. The thin metal films produced by the disclosed process can be used in semiconductor wafer fabrication and assembly, and in preparation of thin film discs, thin film heads, optical storage devices, sensor devices, microelectromachined sensors (MEMS) and actuators, and optical filters.

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus for deposition of a metal film onto a substrate, the apparatus comprising:a) a first reservoir containing a metal stock solution comprising a solution of the metal to be deposited;b) a second reservoir containing a reducing solution; the metal stock solution

[ What is claimed is:] [1.] An apparatus for deposition of a metal film onto a substrate, the apparatus comprising:a) a first reservoir containing a metal stock solution comprising a solution of the metal to be deposited;b) a second reservoir containing a reducing solution; the metal stock solution and reducing solution, when mixed in predetermined proportions forming an electroless plating solution,c) a mixing chamber for mixing said metal stock solution and said reducing solution to thereby provide said electroless plating solution;d) first and second lines, respectively connecting the first and second reservoirs to the mixing chamber, said first and second lines including respective first and second controllable valves therein whereby predetermined quantities of the solutions in the respective reservoirs may be provided to the mixing chamber at selected times;e) a process chamber for holding the substrate on which the metal film is to be deposited;f) a supply line connecting the mixing chamber and the process chamber so as to allow for delivery of said electroless plating solution to said process chamber;g) at least one spray post in the process chamber connected to the supply line for providing a spray of electroless plating solution on said substrate; andh) a controller in electrical communication with said first and second controllable valves, the controller including a computing unit having a control program installed therein, the controller operable to control said first and second controllable valves according to said control program so as toi) provide the metal stock solution and the reducing solution to the mixing chamber in said predetermined proportions to thereby form said electroless plating solution, andii) provide said electroless plating solution to said spray head post so as to cause the substrate to be sprayed with said electroless plating solution.