$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Substrate processing apparatus with a processing chamber, transfer chamber, intermediate holding chamber, and an atmospheric pressure section 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/00
  • B65G-049/07
출원번호 US-0692461 (1996-08-05)
우선권정보 JP-0219769 (1995-08-05)
발명자 / 주소
  • Yonemitsu Shuji,JPX
  • Karino Toshikazu,JPX
  • Yoshida Hisashi,JPX
  • Watahiki Shinichiro,JPX
  • Yoshida Yuji,JPX
  • Shimura Hideo,JPX
  • Sugimoto Takeshi,JPX
  • Aburatani Yukinori,JPX
  • Ikeda Kazuhito,JPX
출원인 / 주소
  • Kokusai Electric Co., Ltd., JPX
인용정보 피인용 횟수 : 46  인용 특허 : 28

초록

A substrate processing apparatus comprises a substrate transfer chamber; a substrate processing chamber disposed on a first side wall of the substrate transfer chamber; an intermediate substrate holding chamber disposed on a second side wall of the substrate transfer chamber; a first substrate holde

대표청구항

[ What is claimed is:] [14.] A substrate processing apparatus, comprising:a substrate transfer chamber;a plurality of substrate processing chambers disposed on a side wall of said substrate transfer chamber, said plurality of substrate processing chambers being stacked in the vertical direction, bei

이 특허에 인용된 특허 (28)

  1. Prentakis Antonios E. (Cambridge MA), Apparatus and method for loading and unloading wafers.
  2. Bean John C. (New Providence NJ), Apparatus for simultaneous molecular beam deposition on a plurality of substrates.
  3. Muka Richard S. (Topsfield MA) Pippins Michael W. (Hamilton MA) Drew Mitchell A. (Portsmouth NH), Cluster tool batchloader of substrate carrier.
  4. Shiraiwa Hirotsugu (Hino JPX), Conveyor apparatus.
  5. Ishii Katsumi (Kanagawa-ken JPX) Kikuchi Hisashi (Esashi JPX), Device for transferring plate-like objects.
  6. Kyogoku Mitsusuke (Tama JPX), Load lock chamber for vertical type heat treatment apparatus.
  7. Nakagawa Yoshinori (Numazu JPX) Mitani Shinichi (Numazu JPX) Kobayashi Takehiko (Mishima JPX) Honda Takaaki (Yokohama JPX), Method for multichamber sheet-after-sheet type treatment.
  8. Akimoto Masami (Kumamoto JPX) Yoshioka Kazutoshi (Kumamoto JPX) Iida Naruaki (Kumamoto JPX), Method for processing wafer-shaped substrates.
  9. Vowles E. John (Deering NH) Maher Joseph A. (Wenham MA) Napoli Joseph D. (Windham NH), Modular vapor processor system.
  10. Ozawa Masahito (Yamanashi JPX) Mizukami Masami (Yamanashi JPX) Kanazashi Masanobu (Kofu JPX) Takasoe Toshihiko (Yamanashi JPX) Narushima Masaki (Yamanashi JPX) Kubodera Masao (Yamanashi JPX), Multi-chamber system provided with carrier units.
  11. Turlot Emmanuel (Verrires le Buisson FRX) Emeraud Thierry (Bures sur Yvettes FRX) Schmitt Jacques (La Ville du Bois FRX), Plasma treatment apparatus and method for operating same.
  12. Iwabuchi Katsuhiko (Sagamihara JPX), Processing apparatus.
  13. Ban Vladimir S. (Hopewell NJ), Radiation heated reactor for chemical vapor deposition on substrates.
  14. Kumagai Hiromi (Tokyo JPX), Semiconductor manufacturing apparatus with a spare vacuum chamber.
  15. Imahashi Issei (Yamanashi-ken JPX), Semiconductor processing system.
  16. Araki Shinichiro (Kumamoto JPX), Semiconductor treatment system and method for exchanging and treating substrate.
  17. Tepman Avi (Cupertino CA) Grunes Howard (Santa Cruz CA) Somekh Sasson (Los Altos Hills CA) Maydan Dan (Los Altos Hills CA), Staged-vacuum wafer processing system and method.
  18. Yonemitsu Shuji,JPX ; Karino Toshikazu,JPX ; Yoshida Hisashi,JPX ; Watahiki Shinichiro,JPX ; Yoshida Yuji,JPX ; Shimura Hideo,JPX ; Sugimoto Takeshi,JPX ; Aburatani Yukinori,JPX ; Ikeda Kazuhito,JPX, Substrate processing apparatus.
  19. Kondo Hiroshi (Tokyo JPX) Tachibana Mitsuhiro (Yamanashi JPX), System for continuously washing and film-forming a semiconductor wafer.
  20. Iwai Hiroyuki (Sagamihara JPX) Tanifuji Tamotsu (Yamato JPX) Asano Takanobu (Yokohama JPX) Okura Ryoichi (Kanagawa-ken JPX), Treatment apparatus.
  21. Fukasawa Yoshio (Kofu JPX) Hosoda Shozo (Yamanashi-ken JPX) Nakagome Tatsuya (Yamanashi-ken JPX) Tozawa Takashi (Yamanashi-ken JPX) Suzuki Koji (Yamanashi-ken JPX) Ishihara Yasumasa (Kofu JPX) Aoyagi, Vacuum process apparatus and vacuum processing method.
  22. Kato Susumu (Isawa-Cho JPX) Yamaguchi Hirofumi (Sudama-Cho JPX), Vacuum process apparaus.
  23. Kato Shigekazu (Kudamatsu JPX) Nishihata Kouji (Tokuyama JPX) Tsubone Tsunehiko (Hikari JPX) Itou Atsushi (Kudamatsu JPX), Vacuum processing apparatus and operating method therefor.
  24. Turner Norman L. (Mountain View CA) White John M. (Hayward CA), Vacuum processing apparatus having improved throughput.
  25. Lee Hideki (Nirasaki JPX), Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus.
  26. Williams Owen P. (Phoenix AZ), Vacuum wafer transport and processing system and method using a plurality of wafer transport arms.
  27. Koons John J. (Georgetown TX), Vertical boat for holding semiconductor wafers.
  28. Gadgil Prasad N. ; Seidel Thomas E., Vertically-stacked process reactor and cluster tool system for atomic layer deposition.

이 특허를 인용한 특허 (46)

  1. Ostermann,Rainer; Buechel,Arthur; Elyaakoubi,Mustapha, Apparatus for vacuum treating two dimensionally extended substrates and method for manufacturing such substrates.
  2. Sandhu, Gurtej S.; Doan, Trung Tri, Atomic layer deposition methods and atomic layer deposition tools.
  3. Sandhu,Gurtej S.; Doan,Trung Tri, Atomic layer deposition methods and atomic layer deposition tools.
  4. Webb, Aaron; Brailove, Adam; Yudovsky, Joseph; Merry, Nir; Constant, Andrew; Quiles, Efrain; Rice, Michael R.; Rosen, Gary J.; Shah, Vinay K., Batch processing platform for ALD and CVD.
  5. Hwang, Chul Ju; Lee, Sung Weon, Cluster tool for fabricating semiconductor device.
  6. Ogliari, Vincenzo; Pozzetti, Vittorio; Preti, Franco, Device and method for handling substrates by means of a self-leveling vacuum system in epitaxial induction.
  7. Daniel Zucker, Heater block cooling system for wafer processing apparatus.
  8. Meulen, Peter van der, Linear semiconductor processing facilities.
  9. van der Meulen, Peter, Linear semiconductor processing facilities.
  10. Holtkamp, William; Kremerman, Izya; Hofmeister, Christopher; Pickreign, Richard, Linearly distributed semiconductor workpiece processing tool.
  11. Condrashoff, Robert Sergel; Fazio, James Patrick; Hoffman, David Eugene; Tyler, James Scott, Material handling system and methods for a multichamber plasma treatment system.
  12. Mitchell, Robert J. C.; Relleen, Keith D.; Ruffell, John, Method and apparatus for processing wafers.
  13. Robert J. C. Mitchell GB; Keith D. Relleen GB; John Ruffell, Method and apparatus for processing wafers.
  14. Ozaki, Takashi; Suzaki, Kenichi; Mizuno, Norikazu, Method for fabricating a semiconductor device and a substrate processing apparatus.
  15. van der Meulen, Peter, Mid-entry load lock for semiconductor handling system.
  16. Siniaguine,Oleg, Plasma processing methods and apparatus.
  17. Marxer, Alexander; Meyerhans, Andreas; Zuend, Fredy, Plasma treatment apparatus and method for operating same.
  18. Marxer Alexander,LIX ; Meyerhans Andreas,LIX ; Zuend Fredy,CHX, Plasma treatment apparatus and method for operation same.
  19. van der Meulen, Peter, Semiconductor manufacturing systems.
  20. van der Meulen, Peter; Kiley, Christopher C; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling and transport.
  21. van der Meulen, Peter; Kiley, Christopher C; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling and transport.
  22. van der Meulen, Peter; Kiley, Christopher C.; Pannese, Patrick D.; Ritter, Raymond S.; Schaefer, Thomas A., Semiconductor wafer handling transport.
  23. van der Meulen, Peter, Stacked process modules for a semiconductor handling system.
  24. van der Meulen,Peter, Stacked process modules for a semiconductor handling system.
  25. Thomas W. Aswad, Substrate cooling system.
  26. Aswad, Thomas W., Substrate cooling system and method.
  27. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  28. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  29. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  30. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  31. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  32. Hosek, Martin; Hofmeister, Christopher; Krupyshev, Alexander, Substrate processing apparatus.
  33. Nishimura, Kazuhiro; Nakamura, Yasushi; Kawamatsu, Yasuo; Chikamori, Ryuichi, Substrate processing apparatus.
  34. Kurokawa, Harushige, Substrate processing apparatus and reaction tube for processing substrate.
  35. Inagaki, Yukihiko; Onishi, Kensaku; Yamamoto, Jun, Substrate processing apparatus, storage device, and method of transporting substrate storing container.
  36. Inagaki, Yukihiko; Onishi, Kensaku; Yamamoto, Jun, Substrate processing apparatus, storage device, and method of transporting substrate storing container.
  37. Koyama Yasufumi,JPX, Substrate transport method and apparatus.
  38. Sakamoto,Koichi; Tonegawa,Yamato; Fujita,Takehiko, System and method for performing semiconductor processing on substrate being processed.
  39. Sakamoto, Koichi; Tonegawa, Yamato; Fujita, Takehiko, System and method for performing semiconductor processing on target substrate.
  40. Schuegraf, Klaus F., System for fabricating a bipolar transistor.
  41. Suzuki,Tomohiro; Koshimizu,Chishio, Temperature measuring apparatus, temperature measurement method, temperature measurement system, control system and control method.
  42. Kroeker Tony R., Three chamber load lock apparatus.
  43. Tony R. Kroeker, Three chamber load lock apparatus.
  44. Schaller, Jason, Transfer chamber with vacuum extension for shutter disks.
  45. Roman Schertler AT, Vacuum treatment equipment.
  46. Schertler Roman,ATX, Vacuum treatment equipment.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로