$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Supercritical phase wafer drying/cleaning system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F26B-003/00
출원번호 US-0023290 (1998-02-13)
발명자 / 주소
  • Farmer Robert B.
  • Jones Bernard D.
  • Gupta Kedar P.
  • Jafri Ijaz H.
  • Dispensa Derek M.
출원인 / 주소
  • G.T. Equipment Technologies, Inc.
대리인 / 주소
    Maine
인용정보 피인용 횟수 : 82  인용 특허 : 0

초록

An apparatus and method for drying a microelectronic structure on wafer substrate using supercritical phase gas techniques and a unique pressure vessel locking mechanism. There is lid and a base with an open cavity to contain at least one microelectronic structure on wafer substrate. Clamping the li

대표청구항

[ What is claimed is:] [1.] An apparatus for drying a microelectronic structure on wafer substrate, comprisinga pressure vessel with a lid and a base with an open cavity, said cavity being of uniform diameter and constant depth sufficient to contain at least one said microelectronic structure on waf

이 특허를 인용한 특허 (82)

  1. Mount, David J., Adding energy to a cleaning process fluid for removing photo resist, residues and particles from semiconductor substrates, photo masks, reticles, disks and flat-panel displays.
  2. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
  3. Shrinivasan,Krishnan; Banerjee,Souvik; Juarez,Francisco; Reinhardt,Karen A.; Gopinath,Sanjay, Apparatus and methods for processing semiconductor substrates using supercritical fluids.
  4. Lee, Hyosan; Ko, Yongsun; Kim, Kyongseob; Kim, Kwangsu; Kim, SeokHoon; Lee, Kuntack; Jun, Yongmyung; Cho, Yong-Jhin, Apparatus and methods for treating a substrate.
  5. Kholodenko, Arnold V.; Bachrach, Robert Z.; Mandelboym, Mark, Apparatus for fabricating large-surface area polycrystalline silicon sheets for solar cell application.
  6. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  7. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  8. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  9. Arena Foster,Chantal J.; Awtrey,Allan Wendell; Ryza,Nicholas Alan; Schilling,Paul, Developing photoresist with supercritical fluid and developer.
  10. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Developing photoresist with supercritical fluid and developer.
  11. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Drying resist with a solvent bath and supercritical CO2.
  12. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  13. Aoki, Shigeki; Sakai, Yuichi; Yamashita, Mitsuo; Shinya, Hiroshi, Heat processing apparatus and heat processing method.
  14. Aoki, Shigeki; Sakai, Yuichi; Yamashita, Mitsuo; Shinya, Hiroshi, Heat processing apparatus and heat processing method.
  15. Fukuoka, Tetsuo; Akimoto, Masami; Kitano, Takahiro; Kimura, Yoshio; Hayashi, Shinichi; Ito, Hikaru, Heating apparatus, and coating and developing apparatus.
  16. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.
  17. Luetge,Christoph; Kurtz,Hans Ottomar, High pressure device and method for clean room applications.
  18. Jones, William D., High pressure fourier transform infrared cell.
  19. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  20. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  21. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  22. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  23. Tousimis, Anastasios J.; Tousimis, Chris; Tousimis, Yianni, Holder for use in semiconductor device manufacturing and bio-medical sample processing.
  24. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  25. DeSimone, Joseph M.; DeYoung, James P.; McClain, James B., Method and apparatus for cleaning substrates using liquid carbon dioxide.
  26. Nobuyuki Kawakami JP; Yoshito Fukumoto JP; Kenichi Inoue JP; Kohei Suzuki JP; Takashi Kinoshita JP; Katsuhiro Uehara JP, Method and apparatus for making aerogel film.
  27. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  28. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  29. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  30. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  31. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  32. Reid, Jason S.; Viswanathan, Nungavaram S., Method for removing a sacrificial material with a compressed fluid.
  33. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  34. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  35. Elliott, David J.; Millman, Jr., Ronald P.; Tardif, Murray; Aiello, Krista, Method for surface cleaning.
  36. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  37. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  38. Hillman,Joseph, Method of inhibiting copper corrosion during supercritical COcleaning.
  39. Toma,Dorel Ioan; Schilling,Paul, Method of passivating of low dielectric materials in wafer processing.
  40. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  41. Schilling,Paul, Method of treating a composite spin-on glass/anti-reflective material prior to cleaning.
  42. Schilling,Paul, Method of treatment of porous dielectric films to reduce damage during cleaning.
  43. DeYoung, James; McClain, James B.; Cole, Michael E.; Worm, Steven Lee; Brainard, David, Methods and apparatus for cleaning and/or treating a substrate using CO2.
  44. Worm, Steven Lee, Methods and apparatus for holding a substrate in a pressure chamber.
  45. DeYoung, James P.; McClain, James B.; Gross, Stephen M.; DeSimone, Joseph M., Methods for cleaning microelectronic structures with aqueous carbon dioxide systems.
  46. DeYoung, James; McClain, James B.; Cole, Michael E.; Brainard, David, Methods for cleaning microelectronic structures with cyclical phase modulation.
  47. DeYoung, James P.; McClain, James B.; Gross, Stephen M., Methods for removing particles from microelectronic structures.
  48. DeYoung, James P.; McClain, James B.; Gross, Stephen M., Methods for the control of contaminants following carbon dioxide cleaning of microelectronic structures.
  49. DeYoung, James P.; McClain, James B.; Gross, Stephen M.; Wagner, Mark I., Methods for transferring supercritical fluids in microelectronic and other industrial processes.
  50. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  51. Namatsu, Hideo, Pattern formation method and apparatus.
  52. Worm, Steven Lee, Pressure chamber assembly including non-mechanical drive means.
  53. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  54. Hansen,Brian Nils; Crouch,Samuel Wesley; Hybertson,Brooks Michael, Pressure processing apparatus with improved heating and closure system.
  55. Ryza, Nicholas A.; Awtrey, Allan W., Process and apparatus for removing a contaminant from a substrate.
  56. Wuester,Christopher D., Process flow thermocouple.
  57. John Michael Cotte ; Dario L. Goldfarb ; Kenneth John McCullough ; Wayne Martin Moreau ; Keith R. Pope ; John P. Simons ; Charles J. Taft, Process of drying semiconductor wafers using liquid or supercritical carbon dioxide.
  58. DeYoung, James P.; McClain, James B.; Gross, Stephen M., Processes for cleaning and drying microelectronic structures using liquid or supercritical carbon dioxide.
  59. Mullee,William H.; de Leeuwe,Marc; Roberson, Jr.,Glenn A.; Palmer,Bentley J., Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process.
  60. Bertram, Ronald Thomas; Scott, Douglas Michael, Removal of contaminants from a fluid.
  61. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  62. Worm, Steven Lee; Cole, Michael E., Spray member and method for using the same.
  63. Worm, Steven Lee; Cole, Michael E., Spray member and method for using the same.
  64. Doley, Allan; Goodwin, Dennis; O'Neill, Kenneth; Vrijburg, Gerben; Rodriguez, David; Aggarwal, Ravinder, Substrate handling chamber.
  65. Dickinson, C. John; Jansen, Frank; Murphy, Daimhin P., Substrate processing apparatus and related systems and methods.
  66. Ching, Gil; Perrut, Vincent; Ruch, Vincent; Fresquet, Gilles, Substrate processing apparatus for processing substrates using dense phase gas and sonic waves.
  67. Hayashi, Hidekazu; Sato, Yohei; Okuchi, Hisashi; Tomita, Hiroshi; Mitsuoka, Kazuyuki; You, Gen; Ohno, Hiroki; Orii, Takehiko; Toshima, Takayuki, Substrate processing method and storage medium.
  68. Nishimura, Hideki; Nakashima, Mikio, Substrate processing method, and program storage medium therefor.
  69. Nishimura, Hideki; Nakashima, Mikio, Substrate processing method, substrate processing apparatus, and program storage medium.
  70. Namatsu, Hideo, Supercritical drying method and supercritical drying apparatus.
  71. Costantini, Michael A.; Chandra, Mohan; Moritz, Heiko D.; Jafri, Ijaz H.; Mount, David J.; Heathwaite, Rick M., Supercritical fluid delivery and recovery system for semiconductor wafer processing.
  72. Basceri,Cem; Sandhu,Gurtej S., Supercritical fluid technology for cleaning processing chambers and systems.
  73. Tousimis, Anastasios J.; Tousimis, Chris, Supercritical point drying apparatus for semiconductor device manufacturing and bio-medical sample processing.
  74. Tousimis, Anastasios; Tousimis, Chris, Supercritical point drying apparatus for semiconductor device manufacturing and bio-medical sample processing.
  75. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  76. Doley Allan ; Goodwin Dennis ; O'Neill Kenneth ; Vrijburg Gerben ; Rodriguez David, System and method for reducing particles in epitaxial reactors.
  77. Simons, John P.; McCullough, Kenneth J.; Moreau, Wayne M.; Taft, Charles J., Topcoat process to prevent image collapse.
  78. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  79. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  80. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
  81. Parks,John, Wafer clamping apparatus and method for operating the same.
  82. Beulens Sjaak Jacobus Johannes,NLX, Wafer rack provided with a gas distribution device.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로