초록 ▼

A wafer cutting chuck for reducing wear and damage to a cutting blade. The chuck has a surface for supporting a wafer. The chuck also has a plurality of recesses in its surface to accommodate a cutting blade of a wafer spindle and blade assembly. The recesses are at least as wide as the cutting blad

A wafer cutting chuck for reducing wear and damage to a cutting blade. The chuck has a surface for supporting a wafer. The chuck also has a plurality of recesses in its surface to accommodate a cutting blade of a wafer spindle and blade assembly. The recesses are at least as wide as the cutting blade and they correspond to street indices on the wafer. Preferably, the chuck is constructed of a metal, a ceramic, or silicon. In a most preferred embodiment of the present invention, the recesses include ports which are connected to a vacuum pump. The ports allow a vacuum, created by the vacuum pump, to pull an adhesive tape from the wafer, so that the cutting blade of the wafer spindle and blade assembly does not contact the adhesive tape.

대표청구항 ▼

[ What is claimed is:] [1.] A method of cutting a semiconductor wafer into dice, comprising:providing a wafer having a circuit side, an underside, and a plurality of street indices which define the dice;supporting the wafer on a chuck having a surface for supporting the wafer at the underside of the

[ What is claimed is:] [1.] A method of cutting a semiconductor wafer into dice, comprising:providing a wafer having a circuit side, an underside, and a plurality of street indices which define the dice;supporting the wafer on a chuck having a surface for supporting the wafer at the underside of the wafer, and having a plurality of recesses in said surface, said recesses being at least as wide as a cutting blade and said recesses corresponding to street indices of the wafer; andcutting the wafer into dice along the street indices using the cutting blade.