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Cooling device for notebook personal computer

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/20
  • H05K-007/20
출원번호 US-0911056 (1997-08-14)
발명자 / 주소
  • Goto Kazuhiko,JPX
  • Mashiko Koichi,JPX
  • Saito Yuji,JPX
  • Nguyen Thang Toan,JPX
  • Mochizuki Masataka,JPX
  • Eguchi Katsuo,JPX
  • Hasegawa Hitoshi,JPX
출원인 / 주소
  • Fujikura Ltd., JPX
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보 피인용 횟수 : 41  인용 특허 : 17

초록

A cooling device for a notebook personal computer which has a personal computer body accommodating an exothermic electronic element and a display hinged in an openable/closable manner to the personal computer body through a hinge mechanism, including a first heat pipe having a first end portion arra

대표청구항

[ What is claimed is:] [13.] A cooling device for a notebook personal computer which has a personal computer body accommodating an exothermic electronic element and a display hinged in an openable/closable manner to said personal computer body, comprising:a first heat pipe having a first end portion

이 특허에 인용된 특허 (17)

  1. Hilbrink Johan O. (Cincinnati OH), Apparatus for cooling electronic devices.
  2. Haley Kevin (San Jose CA) Aghazadeh Mostafa (Chandler AZ) Xie Hong (Chandler AZ), Apparatus for dissipating heat in a hinged computing device.
  3. Mecredy ; III Henry E., Heat dissipating lid hinge structure with laterally offset heat pipe end portions.
  4. Ma Hsi-Kuang,TWX, Heat dissipating structure of a notebook computer.
  5. Anderson ; John H. ; Waters ; Elmer D., Heat pipe assembly.
  6. Bhatia Rakesh (Sunnyvale CA) Haley Kevin (San Jose CA), Heat pipe exchanger system for cooling a hinged computing device.
  7. Garner Scott D. ; Meyer ; IV George A. ; Toth Jerome E. ; Longsderff Richard W., Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices.
  8. Ishida Yoshio (Osaka JPX), Heat radiating apparatus.
  9. Donahoe Daniel N. ; Gill Michael T., Liquid cooled computer apparatus and associated methods.
  10. Kikinis Dan (20264 Ljepava Dr. Satatoga CA 95070), Microprocessor cooling in a portable computer.
  11. Hatada Toshio (Tsuchiura JPX) Inouye Hiroshi (Ibaraki JPX) Ohba Takao (Hadano JPX) Iwai Susumu (Hadano JPX), Packaging structure of small-sized computer.
  12. Aguilera Rafael E. (Simpsonville SC), Passive CPU cooling and LCD heating for a laptop computer.
  13. Lowry David A. ; Novin Eugene, Rotatable heat transfer coupling.
  14. Mok Lawrence Shungwei, Rotational joint for hinged heat pipe cooling of a computer.
  15. Progl Curtis L. ; Tracy Mark S. ; Moore David A., System and method for transferring heat between movable portions of a computer.
  16. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for a laptop computer lid.
  17. Larson Ralph I. (Bolton MA) Phillips Richard L. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for laptop computers.

이 특허를 인용한 특허 (41)

  1. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
  2. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
  3. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
  4. Senyk, Borys S.; Moresco, Larry L., Apparatus for cooling a computer.
  5. Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.
  6. Tracy, Mark S.; Yin, Memphis-Zhihong, Computer thermal dissipation system and method.
  7. Seitz, Reinhold; Schindler, Dominic, Control console for a numerically controlled machine tool.
  8. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; McKeever, Eric J.; Simons, Robert E., Coolant manifold with separately rotatable manifold section(s).
  9. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; McKeever, Eric J.; Simons, Robert E., Coolant manifold with separately rotatable manifold section(s).
  10. Lōcker,Jury Peter, Cooled computer casing display frame.
  11. Ishikawa, Kenichi, Cooling device for cooling a heat-generating component, and electronic apparatus having the cooling device.
  12. Ishikawa,Kenichi, Cooling device for cooling a heat-generating component, and electronic apparatus having the cooling device.
  13. Park,Jong Hoon, Cooling device for folder type portable wireless terminal.
  14. Yoshio Ishida JP; Akimi Shutou JP; Takao Terasaka JP, Cooling module.
  15. Ishinabe,Minoru; Uchida,Hiroki; Tokuhira,Hideshi; Date,Hiroaki; Tanaka,Wataru, Cooling structure for electronic equipment.
  16. Sarraf, David B.; DeHoff, Robert E.; Hartenstine, John; Todd, Jr., John J., Cooling system for electronics with improved thermal interface.
  17. Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.
  18. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  19. Tanaka, Makoto, Electronic apparatus.
  20. Tsai,Kuo Ying; Ku,Shih Chang, Electronic apparatus and thermal dissipating module thereof.
  21. MacDonald, Mark; Nishi, Yoshifumi Yoshi, Electronic device having a passive heat exchange device.
  22. Nishi, Yoshifumi; MacDonald, Mark; Heymann, Douglas, Electronic device having passive cooling.
  23. Mitchell Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
  24. Quesada Saborio, Carlos, Flexible refrigeration platform.
  25. Senatori, Mark David, Flow diversion apparatuses and methods.
  26. Chang,Ray, Handle arrangement with integrated heat pipe.
  27. Andre Ali, Heat exchanger having phase change material for a portable computing device.
  28. Tamaoka, Takehito; Fukushima, Kazuhiko; Hatanaka, Koji, Heat module.
  29. Jacqu?,Bernard; Texier,Emmanuel; Cluzet,G?rard; Tjiptahardja,Tisna; Amidieu,Marcel, Heat transfer system for a satellite including an evaporator.
  30. Moore, David A.; Tracy, Mark S., Hinge connector with liquid coolant path.
  31. Lin, Kuo-Len; Lin, Chen-Hsiang; Hsu, Ken; Cheng, Chih-Hung, Integrated heat-dissipating device for portable electronic product.
  32. Upadhya, Girish; Munch, Mark; Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  33. Attlesey, Chad Daniel; Klum, R. Daren; Berning, Allen James, Liquid submersion cooling system.
  34. Attlesey,Chad Daniel; Klum,R. Daren; Berning,Allen James, Liquid submersion cooling system.
  35. Himanshu Pokharna ; Eric DiStefano, Method and apparatus for external cooling an electronic component of a mobile hardware product, particularly a notebook computer, at a docking station having a thermoelectric cooler.
  36. Agata, Hiroaki; Jamal-Eddine, Tarek J.; Mok, Lawrence S., Method and arrangement for enhancing the cooling capacity of portable computers.
  37. Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
  38. Winkler, David A.; Bowers, Morris B.; Sehmbey, Maninder S., Mobile computing device dock station with headset jack heat pipe interface.
  39. Harvilchuck, Laurence A.; Worrall, Alex Carl, Modular cooling system.
  40. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  41. Moriguchi Tetsuo,JPX ; Hara Kazuhiko,JPX, Water vaporization type cooling apparatus for heat-generating unit.
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