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Method and apparatus for three dimensional inspection of electronic components

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06K-009/00
출원번호 US-0008243 (1998-01-16)
발명자 / 주소
  • Beaty Elwin M.
  • Mork David P.
대리인 / 주소
    Moffa & Sun, P.A.Sun
인용정보 피인용 횟수 : 40  인용 특허 : 50

초록

A calibration and part inspection method and apparatus for the inspection of ball grid array, BGA, devices. Two cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead l

대표청구항

[ What is claimed is:] [1.] An apparatus for inspecting a ball grid array, wherein the apparatus is calibrated using a precision pattern mask with dot patterns deposited on a calibration transparent reticle, the apparatus for inspecting a ball grid array comprising:a) a means for mounting the ball g

이 특허에 인용된 특허 (50)

  1. Beaty Elwin M. (13529 Arthur St. Minnetonka MN 55305), Apparatus and method for measuring ball grid arrays.
  2. Stern Howard ; Yonescu William E. ; Mauro Alex, Apparatus and method for obtaining three-dimensional data from objects in a contiguous array.
  3. Marrable ; Jr. Walter E. (Gunter TX), Apparatus and method for verifying the coplanarity of a ball grid array.
  4. Kobayashi Shigeki (Kyoto JPX) Tanimura Yasuaki (Kyoto JPX) Yotsuya Teruhisa (Kyoto JPX), Apparatus for inspecting printed circuit boards and the like, and method of operating same.
  5. Merryman Jerry D. (Dallas TX) Porter Vernon R. (Plano TX), Autofocus system for scanning laser inspector or writer.
  6. Emery David G. (San Jose CA) Saidin Zain K. (Sunnyvale CA) Wihl Mark J. (Tracy CA) Fu Tao-Yi (Fremont CA) Zywno Marek (San Jose CA) Kvamme Damon F. (Ann Arbor MI) Fein Michael E. (Mountain View CA), Automated photomask inspection apparatus and method.
  7. Yamazaki Nobuto,JPX ; Ogata Yoshiyuki,JPX, Ball detection method and apparatus for wire-bonded parts.
  8. Kobayashi Katsuyoshi (Kawasaki JPX), Calibration of semiconductor pattern inspection device and a fabrication process of a semiconductor device using such an.
  9. Breton Bernard C. (Great Shelford GBX) Thong John T. L. (Leckampton GBX) Nixon William C. (Cambridge GBX), Charged particle beam scanning apparatus.
  10. Manns William G. (Dallas TX) Wood Anthony B. (Dallas TX), Color overlay of scanned and reference images for display.
  11. Kawaguchi Shintaro (Fukuoka JPX), Electric component observation system.
  12. Jackson Robert Lea (Moorpark CA) Boman Robert Cottle (Simi Valley CA), Grid array inspection system and method.
  13. Jackson Robert Lea ; Boman Robert Cottle, Grid array inspection system and method.
  14. Siu Bernard (732 N. Diamond Bar Blvd. Diamond Bar CA 91765), High speed illumination system for microelectronics inspection.
  15. Tomiya Hiroshi (Tokyo JPX), Image inspection apparatus and method.
  16. Rooks Stephen M. (Willowdale CAX), Inspection system for cross-sectional imaging.
  17. Lebeau Christopher J. (Tempe AZ) Hopkins James E. (Mesa AZ), Lead coplanarity inspection apparatus and method thereof.
  18. Ohashi Yoshikazu, Machine vision methods and articles of manufacture for determination of convex hull and convex hull angle.
  19. Koljonen Juha (Needham MA) Michael David J. (Newton MA), Method and apparatus for ball bond inspection system.
  20. Ray Rajarshi (Princeton NJ), Method and apparatus for inspection of specular, three-dimensional features.
  21. Nishimura Hidetoshi,JPX ; Shirouchi Yuichi,JPX, Method and apparatus for inspection of the appearance of bumps.
  22. Chau Henry K. ; Aiyer Arun A., Method and apparatus for macro defect detection using scattered light.
  23. Hiroi Takashi (Yokohama JPX) Kubota Hitoshi (Fujisawa JPX) Maeda Shunji (Yokohama JPX) Makihira Hiroshi (Yokohama JPX) Isobe Mitsunobu (Machida JPX), Method and apparatus for pattern detection.
  24. Palm Steven G. (13529 Arthur St. Minneapolis MN) Beaty Elwin M. (13529 Arthur St. Minnetonka MN 55305), Method and apparatus for zero force part placement.
  25. Liu Kuo-Ching ; Liang Chu-Kwo ; Fwu Jong-Kae ; Huang Chung-Po, Method and system for measuring object features.
  26. Svetkoff Donald J. (Ann Arbor MI) Rohrer Donald K. (Whitmore Lake MI) Noblett David A. (Agoura CA) Jackson Robert L. (Moorpark CA), Method and system for triangulation-based, 3-D imaging utilizing an angled scaning beam of radiant energy.
  27. Svetkoff Donald J. ; Rohrer Donald K. ; Noblett David A. ; Jackson Robert L., Method and system for triangulation-based, 3-D imaging utilizing an angled scanning beam of radiant energy.
  28. Bilodeau Steve (Setauket NY) Jacovino Frank (Plainview NY) Cameron Joanne (Oakdale NY) Cain James (Calverton NY), Method for coplanarity inspection of package or substrate warpage for ball grid arrays, column arrays, and similar struc.
  29. Stern Howard (Greenlawn NY) Yonescu William E. (Smithtown NY) Mauro Alex (Holbrook NY), Method for obtaining three-dimensional data from semiconductor devices in a row/column array and control of manufacturin.
  30. Collet-Beillon Olivier (27 Avenue de Brimont 78400-Chatou FRX), Method of inspecting an array of solder ball connections of an integrated circuit module.
  31. Werson Michael J. (Eastleigh GB2), Optical inspection system.
  32. van Rosmalen Gerard E. (Eindhoven NLX), Optical scanning unit comprising a translational-position and angular-position detection system for an electro-magnetica.
  33. Hidese Wataru (Chikushino JPX), Outer lead bonding head and method of bonding outer lead.
  34. Izumi Yasuo (Ikoma JPX) Yasutake Masanori (Hirakata JPX), Part mounting apparatus with single viewing camera viewing part from different directions.
  35. Suda Kyo (Hachioji JPX) Kimura Shigeharu (Kokubunji JPX) Hase Shinobu (Hachioji JPX) Munakata Chusuke (Tokyo JPX) Kinameri Kanji (Tokyo JPX) Ito Yoshitoshi (Ome JPX) Nagatomo Hiroto (Tokyo JPX) Tanig, Pattern defect inspection apparatus.
  36. Pai Deepak K., Process of measuring coplanarity of circuit pads and/or grid arrays.
  37. King Steven Joseph ; Ludlow Jonathan Edmund ; Chouinard Jon ; Schurr George, Ring illumination apparatus for illuminating reflective elements on a generally planar surface.
  38. King Steven Joseph ; Ludlow Jonathan Edmund ; Schurr George, Ring illumination reflective elements on a generally planar surface.
  39. Cohen Donald K. (Tucson AZ) Caber Paul J. (Tucson AZ) Brophy Chris P. (White Bear Township ; Ramsey County MN), Rough surface profiler and method.
  40. Cohen Donald K. (Tucson AZ) Caber Paul J. (Tucson AZ) Brophy Chris P. (White Bear Township ; Ramsey County MN), Rough surface profiler and method.
  41. Cohen Donald K. (Tucson) Caber Paul J. (Tucson AZ) Brophy Chris P. (White Bear Township MN), Rough surface profiler and method.
  42. Okamoto Shinji (Yawata JPX) Yoshimura Kazunari (Yawata JPX) Nakahara Tomoharu (Nishinomiya JPX), Soldering inspection system and method therefor.
  43. Stern Howard (Greenlawn NY) Yonescu William E. (Smithtown NY), System for inspecting pin grid arrays.
  44. Palm Steven G. (2119 Pillsbury Ave. S. Minneapolis MN 55404) Beaty Elwin M. (13529 Arthur St. Minnetonka MN 55343), Three dimensional scanning system.
  45. Palm Steven G. (Minneapolis MN) Beaty Elwin M. (Minnetonka MN), Three dimensional scanning system.
  46. Svetkoff Donald J. ; Rohrer Donald K. ; Kelley Robert W., Triangulation-based 3-D imaging and processing method and system.
  47. Svetkoff Donald J. (Ann Arbor MI) Rohrer Donald K. (Whitmore Lake MI) Kelley Robert W. (Ann Arbor MI), Triangulation-based 3D imaging and processing method and system.
  48. Svetkoff Ronald J. (Ann Arbor MI) Rohrer Donald K. (Whitmore Lake MI) Kelley Robert W. (Ann Arbor MI), Triangulation-based 3D imaging and processing method and system.
  49. Michael David J. (124 Cabot St. Newton MA 02158) Koljonen Juha (65 Powers St. Needham MA 02192) Garakani Arman (12 Chauncey St. Apartment 2 Cambridge MA 02138), Using cone shaped search models to locate ball bonds on wire bonded devices.
  50. Beamish Jerald K. (Fort Worth TX) Foster H. Dell (San Antonio TX), Vision metrology system.

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  1. Joshua J. Hackney ; John Ma ; Arye Malek ; Matthew M. McPherson ; Xin Shi, 3D scanner and method for measuring heights and angles of manufactured parts.
  2. Reich, David; Durden, Kenneth; Shay, Randall, All surface data for use in substrate inspection.
  3. Reich, David; Durden, Kenneth; Shay, Randall, All surface data for use in substrate inspection.
  4. Hemar,Shirley; Goldenshtein,Alex; Greenberg,Gadi; Friedman,Mula; Kenan,Boaz, Alternating phase-shift mask inspection method and apparatus.
  5. Akiyama, Yoshihiro; Yang, Yong; Akiyama, Sakie, Apparatus for inspecting appearance of inspection piece.
  6. Ulrich, Franz W.; Ma, John; Hart, Darcy J., Binary optical grating and method for generating a moire pattern for 3D imaging.
  7. Mitsuharu Ohki JP, Calibration method and device, device for generating calibration data and a method thereof, and information providing medium.
  8. Ulrich, Franz W.; Bourn, Charles T.; Tonkin, Steven W., Circuit for machine-vision system.
  9. Paulsen, Mark T.; Ulrich, Franz W., Combined 3D- and 2D-scanning machine-vision system and method.
  10. Choi, Jong-Ju; Jang, Dong-Sik, Electronic component lead inspection device.
  11. Beaty,Elwin M.; Mork,David P., Electronic component products and method of manufacturing electronic component products.
  12. Beaty,Elwin M.; Mork,David P., Electronic component products made according to a process that includes a method for three dimensional inspection.
  13. Chow, Hon Yean; Luo, De Yong; Li, Jia Ju, Grid array inspection system and method.
  14. Kirk,Richard Antony; Lyons,Alexander Ralph; Baumberg,Adam Michael; Taylor,Richard Ian; Kotcheff,Aaron William Christopher, Image processing apparatus.
  15. Ulrich, Franz W.; Bieman, Leonard H., Imaging for a machine-vision system.
  16. Smets, Carl; Van Gils, Karel; Van Der Burgt, Maarten, Measuring positions of coplanarity of contract elements of an electronic component with a flat illumination and two cameras.
  17. Smets,Carl; Van Gils,Karel; Zabolitsky,John; Everaerts,Jurgen, Method and an apparatus for measuring positions of contact elements of an electronic component.
  18. Puah, Yong Joo; Tang, Hak Wee; Teo, Soon Poo, Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components.
  19. Lebens,Gary A., Method and apparatus for adjusting illumination angle.
  20. Lebens, Gary A., Method and apparatus for auto-adjusting illumination.
  21. Kiest, Cary S.; Lenzke, Jr., William F., Method and apparatus for illuminating projecting features on the surface of a semiconductor wafer.
  22. Hackney, Joshua J.; Malek, Arye; Ulrich, Franz W.; Estridge, John B., Method and apparatus for parts manipulation, inspection, and replacement.
  23. Kenan,Boaz; Eran,Yair; Karpol,Avner; Elyasaf,Emanuel; Tirosh,Ehud, Method and apparatus for reticle inspection using aerial imaging.
  24. Beaty, Elwin M.; Mork, David P., Method and apparatus for three dimensional inspection of electronic components.
  25. Beaty, Elwin M.; Mork, David P., Method and apparatus for three dimensional inspection of electronic components.
  26. Beaty, Elwin M.; Mork, David P., Method and apparatus for three dimensional inspection of electronic components.
  27. Vernackt, Marc, Method and apparatus of registering a printed circuit board.
  28. Arnz, Michael, Method and device for determining the position of an edge of a marker structure with subpixel accuracy in an image, having a plurality of pixels, of the marker structure.
  29. Beaty,Elwin M.; Mork,David P., Method of manufacturing electronic components including a method for three dimensional inspection.
  30. Doany, Fuad E.; Perez, Andrew D.; Ruiz, Niranjana; Turlapati, Lavanya, Optical alignment module utilizing transparent reticle to facilitate tool calibration during high temperature process.
  31. Doany, Fuad E.; Perez, Andrew D.; Ruiz, Niranjana; Turlapati, Lavanya, Optical alignment module utilizing transparent reticle to facilitate tool calibration during high temperature process.
  32. Malek, Arye; Hackney, Joshua J.; Ulrich, Franz W., Parts manipulation, inspection, and replacement.
  33. Hackney, Joshua J.; Malek, Arye; Ulrich, Franz W.; Estridge, John B., Parts manipulation, inspection, and replacement system and method.
  34. Malek, Arye; Hackney, Joshua J.; Ulrich, Franz W., Parts manipulation, inspection, and replacement system and method.
  35. Henry V. Holec, Precision 3D scanner base and method for measuring manufactured parts.
  36. Harding, Kevin George, Side lit, 3D edge location method.
  37. Gross, William; Lee, Philip; Hickerson, Kevin; Owens, Dylan; Polidoro, Peter, Solar concentrator with camera alignment and tracking.
  38. Lai, Ken, System and method for sequencing rotatable images.
  39. Katayama, Yasuhiro, Transparent camera calibration tool for camera calibration and calibration method thereof.
  40. Malek, Arye; Hackney, Joshua J.; Ulrich, Franz W., Tray flipper, tray, and method for parts inspection.
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