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Substrate edge seal and clamp for low-pressure processing equipment 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/00
출원번호 US-0977822 (1997-11-25)
발명자 / 주소
  • Moslehi Mehrdad M.
  • Davis Cecil J.
출원인 / 주소
  • CVC Products, Inc.
대리인 / 주소
    Eugene Stephens & Associates
인용정보 피인용 횟수 : 24  인용 특허 : 23

초록

A low-pressure processor for processing substrates includes a chuck that engages the substrates' peripheries for purposes of clamping, sealing, and centering the substrates on chuck bodies. For accomplishing all three purposes, a mechanical clamp can be arranged with two sealing regions. One of the

대표청구항

[ We claim:] [1.] A chuck for low-pressure processing equipment comprising:a chuck body that supports a substrate for processing within an evacuatable space of a low-pressure processing chamber;the substrate having a front surface, a back surface, and a peripheral edge surface interconnecting the fr

이 특허에 인용된 특허 (23)

  1. Wang David N. (Saratoga CA) Lei Lawrence C. (Cupertino CA) Chang Mei (Cupertino CA) Leung Cissy (Fremont CA), Apparatus for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials.
  2. Sherstinsky Semyon (San Francisco CA) Harris Charles C. (Los Gatos CA) Chang Mei (Cupertino CA) Du Bois Dale R. (Los Gatos CA) Roberts James F. (Campbell CA) Telford Susan (Cupertino CA) Rose Ronald , Clamping ring and susceptor therefor.
  3. Selbrede Steven C. (San Jose CA), Differential pressure CVD chuck.
  4. Hardy Walter N. (The University of British Columbia Office of Research Services and Industry Liaison ; 2194 Health Sciences Mall ; Room 331 ; I.R.C. Building Vancouver ; British Columbia CAX) Ma Qiyu, Differentially pumped temperature controller for low pressure thin film fabrication process.
  5. Saito Tadashi (Tochigi-ken JPX) Sato Atsushi (Tochigi-ken JPX) Misumi Hisashi (Tochigi-ken JPX), Electroplating apparatus.
  6. Horwitz Christopher M. (Summer Hill AUX) Boronkay Stephen (Bondi AUX), Electrostatic chuck using A.C. field excitation.
  7. Horwitz Christopher M. (New South Wales AUX), Electrostatic chuck with improved release.
  8. Maraschin Robert ; Shufflebotham Paul Kevin ; Barnes Michael Scott, Electrostatic clamp with lip seal for clamping substrates.
  9. Jones Addison B. (La Mirada CA) Wittry David B. (Pasadena CA), Mask apparatus for fine-line lithography.
  10. Cathey ; Jr. David A. (Boise ID), Method and apparatus useful in the plasma etching of semiconductor materials.
  11. DeBusk Damon K. ; Pickelsimer Bruce L., Method for forming active devices on and in exposed surfaces of both sides of a silicon wafer.
  12. Gardner Lawrence R. (Chandler AZ) Norman Michael P. (Chandler AZ) Griffith ; Jr. Robert W. (Mesa AZ), Method for mounting a wafer to a submount.
  13. Suzuki Masaki,JPX ; Yamamoto Shigeyuki,JPX, Plasma processing apparatus and method.
  14. Gomi Hisashi,JPX ; Itoh Masahide,JPX ; Jinnouchi Shimpei,JPX ; Ikeda Towl,JPX, Process gas supply apparatus.
  15. Hayes Bruce L. ; Montanino Greg, Spin coating bowl.
  16. Ishikawa Kenji (Sagamihara JPX) Komino Mitsuaki (Tokyo JPX) Mitui Tadashi (Yamanashi JPX) Iwata Teruo (Nirasaki JPX) Arai Izumi (Yokohama JPX) Tahara Yoshifumi (Tokyo JPX), Stage having electrostatic chuck and plasma processing apparatus using same.
  17. Wada Yuichi (Kofu JPX), Substrate processing apparatus.
  18. Camerson John Field, Substrate support having improved heat transfer.
  19. Heimanson Dorian ; Omstead Thomas R., Temperature controlled chuck for vacuum processing.
  20. Moslehi Mehrdad M., Thermally conductive chuck for vacuum processor.
  21. Morley Morgan J. (Menlo Park CA), Wafer chuck.
  22. Tracy David H. (Norwalk CT) Saviano Paul G. (Norwalk CT), Wafer cooling and temperature control for a plasma etching system.
  23. Wagner Rudolf (Fontnas CHX) Hirscher Hans (Bad Ragaz CHX), Workpiece carrier with suction slot for a disk-shaped workpiece.

이 특허를 인용한 특허 (24)

  1. Leung, Samuel; Cho, Su Ho; Bagley, William Allan, Active cooling substrate support.
  2. Ito,Takayuki; Suguro,Kyoichi, Annealing apparatus, annealing method, and manufacturing method of a semiconductor device.
  3. Johnson, Hale; George, Gregory; Brennen, Michael, Apparatus and method for aligning and centering wafers.
  4. Rinaldi, Kenneth James, Apparatus and method for forming reflective layer of optical disc.
  5. Johnson, Hale; George, Gregory; Brennen, Michael, Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing.
  6. Palagashvili, David; Willwerth, Michael D.; Liu, Jingbao, Apparatus for controlling the flow of a gas in a process chamber.
  7. Omstead, Thomas R.; Wongsenakhum, Panya; Messner, William J.; Nagy, Edward J.; Starks, William; Moslehi, Mehrdad M., Apparatus for dispensing gas for fabricating substrates.
  8. Lee, Young Jong; Choi, Jun Young; Jo, Saeng Hyun; Yoon, Byung-Oh; Kim, Gyeong-Hoon; Jeong, Hong-Gi, Apparatus for manufacturing flat-panel display.
  9. Omstead, Thomas R.; Wongsenakhum, Panya; Messner, William J.; Nagy, Edward J.; Starks, William; Moslehi, Mehrdad M., Apparatus for supporting a substrate in a reaction chamber.
  10. Fink,Steven T., Cylinder-based plasma processing system.
  11. Chu, Ron-Fu, Exhausting method and means in a dry etching apparatus.
  12. Kellerman,Peter L.; Benveniste,Victor M.; Carlson,Frederick M., Gas-cooled clamp for RTP.
  13. Hong Shih ; Joe Sommers ; Diana Ma, Method for monitoring the quality of a protective coating in a reactor chamber.
  14. Povolny, Henry S., Methods of dechucking and system thereof.
  15. Kenney, Mark D., Perimeter seal for backside cooling of substrates.
  16. Tsukamoto, Yuji; Hamelin, Thomas; Kudo, Yasuhisa, Post-etch treatment system for removing residue on a substrate.
  17. Titel, Don; Wheatley, Wayne W.; Sharpe, Todd W., Sealable surface method and device.
  18. Kisaichi, Takashi, Semiconductor manufacturing apparatus, and positioning jig used for same.
  19. Datta, Amitava; Amos, Peter G.; More, Dominick G.; Cornett, Kenneth W.; Payne, Jeremy, Semiconductor process chamber.
  20. Du Bois, Dale R.; Ayoub, Mohamad A.; Kim, Robert; Bansal, Amit; Fodor, Mark; Nguyen, Binh; Cheng, Siu F.; Yu, Hang; Chan, Chiu; Balasubramanian, Ganesh; Padhi, Deenesh; Rocha, Juan Carlos, Shadow ring for modifying wafer edge and bevel deposition.
  21. Bedell, Stephen W.; Fogel, Keith E.; Lauro, Paul A.; Sadana, Devendra K., Substrate holder assembly for controlled layer transfer.
  22. Bowman, Don; Coppola, Stephen; Cornett, Kenneth W.; Funke, Dan; Kamibayashiyama, Julian; Navarro, Jeff; Payne, Jeremy M.; Peterson, Donald J.; Schenk, Douglas C., Substrate processing apparatus with composite seal.
  23. Katsuoka, Seiji; Sekimoto, Masahiko; Yokoyama, Toshio; Watanabe, Teruyuki; Ogawa, Takahiro; Kobayashi, Kenichi; Miyazaki, Mitsuru; Motojima, Yasuyuki, Substrate processing method and apparatus.
  24. Omstead, Thomas R.; Wongsenakhum, Panya; Messner, William J.; Nagy, Edward J.; Starks, William E; Moslehi, Mehrdad M., System for fabricating a device on a substrate with a process gas.
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