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특허 상세정보

Image sensor cover with integral light shield

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01J-040/14    H01L-031/0232   
미국특허분류(USC) 250/208.1 ; 250/237R ; 250/239 ; 257/434 ; 257/435
출원번호 US-0124666 (1998-07-29)
발명자 / 주소
출원인 / 주소
대리인 / 주소
인용정보 피인용 횟수 : 25  인용 특허 : 5

An image sensor package cover with an opaque epoxy silk-screened into it. This epoxy is patterned to the appropriate size, for a particular sensor, to form an integral light shield on the cover, while simultaneously covering to the package. This masks the internal light reflections as well as the prior art methods of using a separate light shield, but eliminates a separate component and the costly labor required to assemble such a product. Such a configuration can be applied to a linear or area type image sensor.


[ What is claimed is:] [1.] An assembly for an image sensor comprising:an image sensor package having an internal cavity;an image sensor contained within the internal cavity that is electrically coupled to a plurality of connector pads within the internal cavity;a plurality of photodetectors contained on the image sensor; anda transparent cover for the image sensor package, the cover having an integrated light shield formed from an opaque material silk-screened on the cover such that there is an aperture within the light shield over at least the photodet...

이 특허를 인용한 특허 피인용횟수: 25

  1. Prabhu,Ashok; Lee,Shaw Wei. Apparatus and method for packaging image sensing semiconductor chips. USP2007047205095.
  2. Prabhu, Ashok; Lee, Shaw Wei. Apparatus and method for wafer level packaging of optical imaging semiconductor devices. USP2005036873024.
  3. Oh, Hyun Ah; Jeong, Youn Baek; Lee, Se Jin. Camera module. USP2015119197796.
  4. Oh, Hyun Ah; Jeong, Youn Baek; Lee, Se Jin. Camera module. USP2016129531933.
  5. Tam, Terence N.; Gleason, Jeffrey N.. Cover for image sensor assembly with light absorbing layer and alignment features. USP2015018932895.
  6. Waitl, Gunter; Brunner, Herbert. Diode housing. USP2010047696590.
  7. Waitl, Gunther; Brunner, Herbert. Diode housing. USP2003096624491.
  8. Waitl,Gunther; Brunner,Herbert. Diode housing. USP2008057368329.
  9. Waitl,Gunther; Brunner,Herbert. Diode housing. USP2006117138301.
  10. Waitl,Gunther; Brunner,Herbert. Diode housing. USP2006097105862.
  11. Kitani, Masashi. Electronic device with encapsulant of photo-set resin and production process of same. USP2004086784409.
  12. Iguchi, Yasuhiro; Inada, Hiroshi; Migita, Masaki. Image sensor. USP2015099123605.
  13. Fujimoto,Hisayoshi; Onishi,Hiroaki. Image sensor module with light-shielding diaphragm made of ink, and method of making the same. USP2008067391457.
  14. Hunter, Andrew Arthur; Schuder, Ray; Yu, Park-Kee; Chang, James-Yu. Image sensor packaging with package cavity sealed by the imaging optics. USP2004016683298.
  15. Zivkovic, Zoran; Tak, Coenraad Cornelis. Integrated sensor chip package with directional light sensor, apparatus including such a package and method of manufacturing such an integrated sensor chip package. USP2017059666637.
  16. Waldman,Jaime I.; Ciminelli,Mario J.; Marcus,Michael A.. Large area flat image sensor assembly. USP2007107276394.
  17. Shiraishi, Akinori. Light transmissive cover, device provided with same and methods for manufacturing them. USP2011098017443.
  18. Shiraishi,Akinori. Light transmissive cover, device provided with same and methods for manufacturing them. USP2007097274096.
  19. Lee, Ji Soo; Mckee, Jeff A.; Mouli, Chandra. Method and apparatus providing an optical guide in image sensor devices. USP2012118304707.
  20. Lee,Ji Soo; Mckee,Jeff A.; Mouli,Chandra. Method and apparatus providing and optical guide in image sensor devices. USP2009037511257.
  21. Glenn, Thomas P.; Webster, Steven; Hollaway, Roy Dale. Method for forming an image sensor package with vision die in lens housing. USP2004056734419.
  22. Yamauchi,Kouichi; Minamio,Masanori; Shimizu,Katsutoshi; Nagata,Haruto. Method for manufacturing solid-state imaging devices. USP2007077247509.
  23. Ong,King Hoo; Khor,Lily; Liew,Boon Pek; Thong,Kai Choh. Method of manufacturing a cavity package. USP2007097273767.
  24. Minamio,Masanori; Yamauchi,Kouichi. Solid-state imaging device and method for producing the same. USP2007097273765.
  25. Flanders,Dale C.; Atia,Walid; Fitch,Eric E.; Le,Minh Van; Murdza,Randal A.; Payer,Robert L.; Korn,Jeffrey A.; Wang,Xiaomei; Buchwald,Walter R.; Newman, III,L. James. Stray light insensitive detector system and amplifier. USP2008117450862.