초록 ▼

A thermally enhanced semiconductor package includes a sheet metal cap having flexible flanges provided with solder contacts for reliable attachment to a circuit board. The package assembly further includes a semiconductor chip with a contact-bearing front surface facing forwardly, and chip bonding c

A thermally enhanced semiconductor package includes a sheet metal cap having flexible flanges provided with solder contacts for reliable attachment to a circuit board. The package assembly further includes a semiconductor chip with a contact-bearing front surface facing forwardly, and chip bonding contacts overlying the front face of the chip. The flange bonding contacts are coplanar with the chip bonding contacts, or can be brought into coplanar alignment by flexure of the cap. The package can be surface-mounted to a circuit board by placing the package onto pads of solder paste, and then heating the assembly to melt the solder paste in order to join the bonding contacts on the chip and on the flange to corresponding contacts on the circuit board.

대표청구항 ▼

[ What is claimed is:] [1.] A packaged semiconductor chip assembly for mounting on a substrate, said assembly comprising:(a) a metallic cap defining a rear wall, at least one side wall projecting forwardly from the rear wall and at least one flange projecting from said at least one side wall at a fo

[ What is claimed is:] [1.] A packaged semiconductor chip assembly for mounting on a substrate, said assembly comprising:(a) a metallic cap defining a rear wall, at least one side wall projecting forwardly from the rear wall and at least one flange projecting from said at least one side wall at a forward edge thereof remote from the rear wall, at least part of said cap being flexible so that said at least one flange is movable with respect to said rear wall;(b) a semiconductor chip mounted to said cap, said chip having a rear surface bonded to said rear wall and a front surface facing away from said rear wall;(c) chip bonding contacts overlying said front surface of said chip and electrically connected to circuits on said chip; and(d) flange bonding contacts on said at least one flange, said flange bonding contacts being coplanar with said chip bonding contacts in at least one position of said at least one flange, whereby said chip bonding contacts and said flange bonding contacts can be bonded simultaneously to a planar substrate to thereby electrically connect the chip to the substrate and mechanically and thermally connect the cap to the substrate.