초록 ▼

A system for automatically calibrating a semiconductor wafer handling robot so that the robot will move wafers into and out of precise locations within enclosures that form process stations or storage cassettes is disclosed. The system comprises a controller having memory and logic sections connecte

A system for automatically calibrating a semiconductor wafer handling robot so that the robot will move wafers into and out of precise locations within enclosures that form process stations or storage cassettes is disclosed. The system comprises a controller having memory and logic sections connected to a robot having an articulated arm that is movable in vertical (Z), horizontal (.theta.), and radial (R) directions and having a wafer retaining wand at the end of the arm. Dimensional characteristics of the robot wand and the enclosures are stored in the controller memory. Sensors are provided at each enclosure and/or the robot wand which are activated and provide signals to the controller that are relative to the wand position. The robot is programmed to execute a series of progressive movements at each enclosure location which are controlled by a combination of sensor response signals and the appropriate dimensional characteristics. At the end of the programmed movements, the robot wand is positioned within a process station or cassette so that it can engage for removal or release a wafer therein at a precise predetermined location.

대표청구항 ▼

[ What is claimed is:] [1.] In combination with a robot having an arm with a wafer holding wand at its outer end, motor means for moving said arm vertically in a Z axis, rotatably about the Z axis in an angle .theta. and for extending said wand radially along an R axis, a system for automatically co

[ What is claimed is:] [1.] In combination with a robot having an arm with a wafer holding wand at its outer end, motor means for moving said arm vertically in a Z axis, rotatably about the Z axis in an angle .theta. and for extending said wand radially along an R axis, a system for automatically controlling said robot to cause said wand to be positioned precisely within the opening of a fixed enclosure near said robot so that it can repetitively place a semiconductor wafer within or remove it from said enclosure, said system comprising;a machine controller having a memory and logic circuitry and connected to said robot, said controller having stored dimensional characteristics of said wand and said enclosure;an I/O component and a motor amplifier connected to said machine controller;first sensor means for producing signals to said controller for causing said robot wand to be moved to a vertical Z axis position relative to said enclosure opening; andsecond sensor means within said fixed enclosure for producing signals to said controller that cause said robot wand to move automatically in .theta. and R directions so as to arrive at a precise position within said fixed enclosure to thereby enable said wand to pick up or drop off a wafer at said precise position.