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Integral heat pipe enclosure

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0176564 (1998-10-21)
발명자 / 주소
  • Austin Thomas A.
  • Greer Stephen
  • Low Andrew
출원인 / 주소
  • Alcatel USA Sourcing, L.P.
대리인 / 주소
    Fliesler, Dubb, Meyer & Lovejoy LLP
인용정보 피인용 횟수 : 30  인용 특허 : 21

초록

A passive cooling system for cooling an enclosure containing electronic components. A hollowed portion of the enclosure is formed as an integral heat pipe containing a working fluid. The hollowed portion has an evaporator section located at the top and a condenser section located at the bottom. The

대표청구항

[ What is claimed is:] [1.] A cooling system for cooling heat generating components comprising:(a) a plurality of walls forming an enclosure for mounting heat generating components within, at least one of said walls including a hollowed portion;(b) a loop incorporated into said hollowed portion, sai

이 특허에 인용된 특허 (21)

  1. Bennett Ronald E. (Conover NC), Attachment of heat pipes to electrical apparatus.
  2. Barban Reno L., Biothermal and geothermal heat exchange apparatus for a ground source heat pump.
  3. Edelstein Fred (Hauppauge NY) Haslett Robert A. (Dix Hills NY) Kosson Robert L. (Massapequa NY) Harwell William (Coram NY), Capillary-pumped heat transfer panel and system.
  4. Phillips Richard J. (Alachua FL) Larson Ralph I. (Bolton MA), Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in sec.
  5. Miyazaki Yoshiro (Tokyo JPX) Yasunaga Toshio (Yokohama JPX) Sasaki Tomiya (Yokohama JPX), Cooling apparatus for a closed housing.
  6. Rauth Erich (Auenwald DEX) Form Ernst (Sulzbach DEX), Cooling system for communications devices with high power losses.
  7. Ghiraldi Alberto (Via Palatino 8 Milan 20148 ITX), Device for the protection and thermal conditioning of apparatus in particular electronic apparatus generating heat.
  8. Waldon Paul L. (Hickory NC) Bennett Ronald E. (Hickory NC), Electrical apparatus with heat pipe cooling.
  9. Leland John E. (Loudonville OH), Ferrofluid piston pump for use with heat pipes or the like.
  10. Noren Don W. (846 Blandford Blvd. Redwood City CA 94062), Heat exchanger.
  11. Wahle Harold W. ; Giammaruti Robert J., Heat pipe heat exchanger for cooling or heating high temperature/high-pressure sub-sea well streams.
  12. Toth Jerome E. (Hatboro PA) Ernst Donald M. (Leola PA), Heat pipe with temperature gradient.
  13. Hara Toshitsugu (Tokyo JA) Uchida Motokazu (Tokyo JA) Yanadori Michio (Hachioji JA) Kashiwabara Yasushige (Musashino JA), Heat transfer device.
  14. Austin Thomas A. ; Greer Stephen ; Low Andrew, Integral heat pipe enclosure.
  15. Durian Stewart W. ; Durian Stephen, Liquid filled cooling fin with reinforcing ribs.
  16. Cornog David G. ; Choo Robert R., Mechanically pumped heat pipe.
  17. Giammaruti Robert J. (North Canton OH), Passive cooling of enclosures using heat pipes.
  18. Christopher Nicholas S. (56 Page Farm Rd. Sherborn MA 01748), Passive cooling system.
  19. Ghiraldi Alberto (Via Palatino 8 Milan 20148 ITX), Shelter device for the production and thermal conditioning of apparatus, in particular electronic apparatus generating h.
  20. Bottum Edward W. (9357 Spencer Road Brighton MI 48116), Solar assisted heat pump system.
  21. Cady Edwin C. (Orange CA), Three-way heat pipe.

이 특허를 인용한 특허 (30)

  1. Rosenfeld,John H.; Minnerly,Kenneth G., Brazed wick for a heat transfer device.
  2. Pal, Debabrata, Controller cooling arrangement.
  3. Sarraf, David B.; DeHoff, Robert E.; Hartenstine, John; Todd, Jr., John J., Cooling system for electronics with improved thermal interface.
  4. Jones, Alan R., Cooling systems.
  5. Bilski, W. John, Electronics cabinet and rack cooling system and method.
  6. Zuo, Jon, Electronics package with specific areas having low coefficient of thermal expansion.
  7. Phillips,Alfred L.; Khrustalev,Dmitry K.; Wert,Kevin L.; Wilson,Michael J.; Wattelet,Jonathan P.; Broadbent,John, Flexible loop thermosyphon.
  8. Phillips,Alfred L.; Khrustalev,Dmitry K.; Wert,Kevin L.; Wilson,Michael J.; Wattelet,Jonathan P.; Broadbent,John, Flexible loop thermosyphon.
  9. Douglas J. Snyder ; Liang Tang, HV connector with heat transfer device for X-ray tube.
  10. Mast, Brian E.; Gernert, Nelson J.; Lindemuth, James E., Heat pipe system for cooling flywheel energy storage systems.
  11. Thayer, John Gilbert; Schaeffer, Clark Scott; Apicelli, Samuel W., Heat pipe with axial and lateral flexibility.
  12. Thayer, John Gilbert; Schaeffer, Clark Scott; Apicelli, Samuel W., Heat pipe with axial and lateral flexibility.
  13. Rosenfeld,John H.; Ernst,Donald M., Heat transfer device and method of making same.
  14. Wert, Kevin L., Hybrid loop heat pipe.
  15. Wert,Kevin L., Hybrid loop heat pipe.
  16. Elias,J. Michael; Cepas,Bruce M.; Korn,James A., Integrated power and cooling architecture.
  17. Wang, Sean Xiaolu, LED lighting fixture.
  18. Garrett, Gerald Bruce, Liquid storage and cooling computer case.
  19. Elias, J. Michael; Cepas, Bruce M., Method and apparatus for absorbing thermal energy.
  20. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  21. Zuo, Jon, Method of making electronics package with specific areas having low coefficient of thermal expansion.
  22. Phillips, Fred A. L., Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator.
  23. Malone,Christopher Gregory; Simon,Glenn Cochran, One or more heat exchanger components in major part operably locatable outside computer chassis.
  24. James, Sean M; Rubenstein, Brandon Aaron, Renewable energy based datacenter cooling.
  25. Holighaus, Heiko; Nicolai, Walter, Switchgear cabinet with an air-conditioning device.
  26. Khrustalev, Dmitry; Zuo, Jon, Thermal bus for cabinets housing high power electronics equipment.
  27. Phillips, Alfred L.; Khrustalev, Dmitry K.; Wert, Kevin L.; Wilson, Michael J.; Wattelet, Jonathan P.; Broadbent, John, Thermal bus for electronics systems.
  28. James Carl Canfield ; Michael L. Dougherty, Sr. ; James Allen Beyer ; Dale Linwood Sleep, Thermal management system for positive crankcase ventilation system.
  29. Sone,Kazuya, Thermosiphon.
  30. Pal, Debabrata, Two-phase electronic component cooling arrangement.
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