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Miniaturizing power supply system for portable computers by improving heat dissipation therein 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0223832 (1999-01-02)
발명자 / 주소
  • Cheng Bruce C. H.,TWX
출원인 / 주소
  • Delta Electronics, Inc., TWX
대리인 / 주소
    Lin
인용정보 피인용 횟수 : 54  인용 특허 : 5

초록

The present invention discloses a power supply for providing power from an external power source to a portable electronic device. The portable power supply system includes electronic circuits including an AC-to-DC converter for converting the power from the external power source for the portable ele

대표청구항

[ I claim:] [1.] A portable power supply system for providing power from an external power source to a portable electronic device comprising:electronic circuits including an AC-to-DC converter for converting said power from said external power source for said portable electronic device;a printed cir

이 특허에 인용된 특허 (5)

  1. Sato Yasue,JPX ; Kawate Shinichi,JPX ; Azuma Hisanobu,JPX, Air cooling for flat panel displays.
  2. Samarov Victor M. (Carlisle MA) Larson ; Jr. Ralph I. (Bolton MA) Doumani George A. (No. Andover MA), Conformal heat sink for electronic module.
  3. Iwatare Misao,JPX, Protective casing structure for electronic apparatus.
  4. Stegenga Jerry A. (Coral Gables FL), Secure housing arrangement for electronic apparatus.
  5. Korinsky George K. (Woodlands TX), Thermal packaging for natural convection cooled electronics.

이 특허를 인용한 특허 (54)

  1. Hae-woon Cho KR, Apparatus for shielding a plasma display panel.
  2. Ryu,Ho Chul; Bae,Sung Won, Case for covering electronic parts and display apparatus including the same.
  3. Sakamoto, Hideyuki; Saito, Hidefumi; Koike, Yasuhiro; Tsukizawa, Masao, Circuit device.
  4. Sakamoto, Hideyuki; Saito, Hidefumi; Koike, Yasuhiro; Tsukizawa, Masao, Circuit device and method of manufacturing the same.
  5. Sakamoto, Hideyuki; Saito, Hidefumi; Koike, Yasuhiro; Tsukizawa, Masao, Circuit device and method of manufacturing the same.
  6. Sakamoto, Hideyuki; Saito, Hidefumi; Koike, Yasuhiro; Tsukizawa, Masao, Circuit module.
  7. Meyer,Andreas A.; Radosevich,Lawrence D.; Beihoff,Bruce C.; Kehl,Dennis L.; Kannenberg,Daniel G., Compact vehicle drive module having improved thermal control.
  8. Barr,Gordon O.; Choinski,Ted; Gray,Bruce, Controlled height and flow rework nozzle.
  9. Beihoff,Bruce C.; Radosevich,Lawrence D.; Phillips,Mark G.; Kehl,Dennis L.; Kaishian,Steven C.; Kannenberg,Daniel G., Cooled electrical terminal assembly and device incorporating same.
  10. Tung,Kung Chao; Tung,Po Cheng, Cooling function power adapter.
  11. Schwab,Markus, Electric device with improved cooling and casing therefor.
  12. Beihoff,Bruce C.; Radosevich,Lawrence D.; Meyer,Andreas A.; Gollhardt,Neil; Kannenberg,Daniel G., Electrical power converter method and system employing multiple output converters.
  13. Beihoff,Bruce C.; Radosevich,Lawrence D.; Meyer,Andreas A.; Gollhardt,Neil; Kannenberg,Daniel G., Electrical power converter method and system employing multiple-output converters.
  14. Nakamura, Shinichi; Kakiuchi, Kouji; Mukai, Tatsuya; Mori, Shiro; Watanabe, Hirotoshi; Fukuo, Naoki; Minami, Yoji; Kondou, Kazuhiro, Electricity feeding control device.
  15. Chang,Yung Cheng; Chen,Yin Yuan; Chuang,Chien Feng, Electronic device with waterproof and heat-dissipating structure.
  16. David H. Houston, Electronic power supply for personal computer and method.
  17. Gurin,Michael H, Enhanced energy concentrator composition.
  18. Kim,Myoung Kon; Kim,Ki Jung; Bang,Won Kyu, Filter holder and display apparatus including the same.
  19. Peng, Xue Wen; Chen, Bing, Heat dissipation device.
  20. Sygulla, John Michael; Ramakrishnan, Arun; Slowiak, Greg, Hierarchical system manager rollback.
  21. Fong, Chee K.; Tin, Suet F.; Manfrini, Vinicio; Egner, J. David; Hiett, Michael; Singh, Harjit, Liquid resistant A/C adaptor.
  22. Sagneri, Anthony; Green, Vanessa, Method and apparatus for controlling heat in power conversion systems.
  23. Dubrule, Craig Donald; Ho, Phong Hoang, Method and apparatus for ventilating a computerized device.
  24. Marchand, Roger, Method for cooling a static electronic power converter device and corresponding device.
  25. Beihoff, Bruce C.; Radosevich, Lawrence D.; Meyer, Andreas A.; Gollhardt, Neil; Kannenberg, Daniel G., Modular power converter having fluid cooled support.
  26. Hideo Ikeda JP, Motor driving inverter.
  27. Lee, Kyung-Sup, Portable computer with power adapter unit provided and cooling fan external and adjacent to main housing.
  28. Lanni,Thomas W, Power adapter with fan assembly.
  29. Lanni,Thomas W, Power adapter with fan assembly and control circuit.
  30. Beihoff,Bruce C.; Kehl,Dennis L.; Gettelfinger,Lee A.; Kaishian,Steven C.; Phillips,Mark G.; Radosevich,Lawrence D., Power converter connection configuration.
  31. Beihoff,Bruce C.; Kehl,Dennis L.; Gettelfinger,Lee A.; Kaishian,Steven C.; Phillips,Mark G.; Radosevich,Lawrence D., Power converter having improved EMI shielding.
  32. Meyer,Andreas A.; Radosevich,Lawrence D.; Beihoff,Bruce C.; Kehl,Dennis L.; Kannenberg,Daniel G., Power converter having improved fluid cooling.
  33. Radosevich,Lawrence D.; Kannenberg,Daniel G.; Phillips,Mark G.; Kaishian,Steven C., Power converter having improved terminal structure.
  34. Loth, Michael William, Power electronic module cooling system and method.
  35. Seibold, Lawrence B., Power supply cooling system.
  36. Il Yeul Lee KR, Power supply device for remote controller.
  37. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  38. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  39. Lineal, Kara; Born, Joe, Shielded heat-dissipating lap cushion.
  40. Lineal, Kara; Born, Joe, Shielded heat-dissipating lap cushion.
  41. Huang,Ming Ho, Structure for cooling a power adapter.
  42. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.
  43. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.
  44. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.
  45. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.
  46. Pruszenski, Anthony S., Techniques which involve solar shielding an electronic device.
  47. Wei,Wen, Telecom equipment chassis using modular air cooling system.
  48. Pirillis, Alexandros, Thermal management for electronic device housing.
  49. Fong,Chee Kiong; Neal,Daniel LaMotte; Egner, Jr.,J. David; Askeland,Roy James, Two-compartment AC adaptor.
  50. Beihoff,Bruce C.; Kehl,Dennis L.; Gettelfinger,Lee A.; Kaishian,Steven C.; Phillips,Mark G.; Radosevich,Lawrence D., Vehicle drive module having improved EMI shielding.
  51. Radosevich,Lawrence D.; Meyer,Andreas A.; Kannenberg,Daniel G.; Kaishian,Steven C.; Beihoff,Bruce C., Vehicle drive module having improved cooling configuration.
  52. Beihoff,Bruce C.; Radosevich,Lawrence D.; Phillips,Mark G.; Kehl,Dennis L.; Kaishian,Steven C.; Kannenberg,Daniel G., Vehicle drive module having improved terminal design.
  53. Lu, Yi-Jen; Lin, Shu-Hsien, Waterproof and heat-dissipating module mounted for an electronic device.
  54. Lee, Po-Sheng, Waterproof casing for a power supply.
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