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Cooling device with heat pipe 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0023372 (1998-02-13)
우선권정보 JP-0263586 (1997-09-29)
발명자 / 주소
  • Yamamoto Masaaki,JPX
  • Niekawa Jun,JPX
  • Ueki Tatuhiko,JPX
  • Ikeda Masami,JPX
  • Sasaki Ken,JPX
출원인 / 주소
  • The Furukawa Electric Co., Ltd., JPX
대리인 / 주소
    Thorp Reed & Armstrong, LLP
인용정보 피인용 횟수 : 103  인용 특허 : 19

초록

The invention provides a cooling device with a heat pipe, which is capable of effectively radiating heat from electronic equipment such as a small-sized computer. The cooling device with the heat pipe comprises a plate-like container made of heat transferring metal for containing a working fluid, an

대표청구항

[ We claim:] [1.] A cooling device with a heat pipe comprising:a plate-like container made of heat transferring metal for containing a working fluid and having a heat absorbing wall and a heat radiating wall, wherein said heat absorbing wall has a large heat absorbing surface corresponding to a plur

이 특허에 인용된 특허 (19)

  1. Berenholz Jack (Lexington MA) Bowman John K. (Brighton MA), Air cooled heat exchanger for multi-chip assemblies.
  2. Novotny Shlomo D. (Wayland MA), Closed-cycle expansion-valve impingement cooling system.
  3. Osakabe Hiroyuki,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Sugito Hajime,JPX ; Kobayashi Kazuo,JPX ; Kadota Shigeru,JPX, Cooling apparatus using boiling and condensing refrigerant.
  4. Cook Alex (Rockford IL) Lents Charles E. (Rockford IL), Cooling technique for compact electronics inverter.
  5. Dietzsch Claudius R. (Stein am Rhein CHX), Device for transferring heat energy by capillary forces.
  6. Arnold Allen J. (La Grangeville NY) Courtney Mark G. (Poughkeepsie NY) Kirby Diane N. (Poughkeepsie NY) Mis Katherine H. (Poughkeepsie NY) Sutton Kerry L. (Wappingers Falls NY), Environmentally secure and thermally efficient heat sink assembly.
  7. Marcus Bruce D. (Los Angeles CA) Fleischman George L. (Inglewood CA), Flat-plate heat pipe.
  8. Larson Ralph (Bolton MA) Phillips Richard J. (Alachua FL), Flexible heat pipe for integrated circuit cooling apparatus.
  9. Eastman George Y. (Lancaster PA), Heat pipe.
  10. Itoh Satomi (14-2-306 Asahigaoka-machi ; Ashiya-shi ; Hyogo JPX), Heat pipe.
  11. Mochizuki Masataka (Tokyo JPX) Ono Motoyuki (Tokyo JPX) Mashiko Koichi (Tokyo JPX) Saito Yuji (Tokyo JPX) Hasegawa Masashi (Tokyo JPX) Nagata Masakatsu (Tokyo JPX), Heat pipe and process for manufacturing the same.
  12. Beam Jerry E. (Dayton OH), Heat pipe wick.
  13. Adkins Douglas Ray ; Shen David S. ; Tuck Melanie R. ; Palmer David W. ; Grafe V. Gerald, Heat pipe with embedded wick structure.
  14. Itoh Satomi (Hyogo JPX), Heat radiating device.
  15. Sun Jyi-Yu (Hsinchu TWX) Chian Tao (Hsinchu TWX) Shih Di-Kon (Hsinchu TWX) Wang Chih-Yao (Hsinchu TWX), High-efficiency isothermal heat pipe.
  16. Yao Akira,JPX ; Seko Hiromi,JPX, Honeycomb sandwich panel with built in heat pipes.
  17. Token Kenneth H. (St. Charles MO) Garner Edward C. (University City MO), Plated heat pipe.
  18. Sekhon Kalwant S. (Fullerton CA) Nelson Lloyd A. (Villa Park CA) Fritz ; Jr. John E. (Anaheim CA), Transistor cooling by heat pipes having a wick of dielectric powder.
  19. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL), Two-phase component cooler.

이 특허를 인용한 특허 (103)

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