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Continuous mode solder jet apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-001/00
  • B23K-031/02
  • B23K-035/12
  • B41J-002/09
  • B05B-001/08
출원번호 US-0388032 (1999-09-01)
발명자 / 주소
  • Farnworth Warren M.
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    Trask, Britt & Rossa
인용정보 피인용 횟수 : 26  인용 특허 : 22

초록

A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane

대표청구항

[ What is claimed is:] [1.] A solder jet apparatus depositing a stream of liquid metal droplets on a substrate having a surface having a plurality of locations thereon extending throughout said surface, each location of said plurality of locations on said surface having a start point and an endpoint

이 특허에 인용된 특허 (22)

  1. Smith ; Jr. Charles Vincent ; Priest John William ; DuBois Patrick Neil, Apparatus and method for generation of microspheres of metals and other materials.
  2. Kawashima Yasuji (Ibaraki JPX) Nishibori Kazuo (Toyonaka JPX) Morita Yasuhiro (Nagaokakyo JPX) Hayama Sachiho (Osaka JPX), Automatic jet soldering apparatus.
  3. Gaynes Michael A. (Vestal NY) Oxx George D. (Endicott NY) Pierson Mark V. (Binghamton NY) Zalesinski Jerzy (Essex Jet VT), Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical.
  4. Wallace David B. (Dallas TX) Marusak Ronald E. (Richardson TX), Controlling depoling and aging of piezoelectric transducers.
  5. Smith Ted M. (Austin TX) Winstead Russell E. (Raleigh NC), Electrodynamic pump for dispensing molten solder.
  6. Smith Charles V. (Pantego TX) Priest John W. (Dallas TX) DuBois Patrick N. (Argyle TX), Heat-resistant broad-bandwidth liquid droplet generators.
  7. Muntz Eric Phillip ; Orme-Marmarelis Melissa E. ; Pham-Van-Diep Gerald C. ; Balog Robert J., High speed jet soldering system.
  8. Keeling Michael R. (Cambridge GB2) Weinberg Hillar (Cambridge GB2), Ink jet printer with control.
  9. Orme-Marmarelis Melissa E. ; Muntz Eric Phillip, Jet soldering system and method.
  10. Orme-Marmarelis Melissa E. ; Muntz Eric Phillip, Jet soldering system and method.
  11. Watts ; Jr. Hal G. ; Balog Robert J. ; Freeman Gary T., Jet soldering system and method.
  12. Hayes Donald J. ; Hartnett Mary W., Manufacture of coated spheres.
  13. Smith James C. ; Hogan Patrick T. ; Saidman Laurence B., Method and apparatus for dispensing small amounts of liquid material.
  14. Yost Frederick G. ; Frear Darrel R. ; Schmale David T., Method and apparatus for jetting, manufacturing and attaching uniform solder balls.
  15. Melton Cynthia M. (Bolingbrook IL) Pfahl Robert (Glen Ellyn IL), Method for forming a solder bump by solder-jetting or the like.
  16. Baker Jay D. (West Bloomfield MI) Lemecha Myron (Dearborn MI) McMillan ; II Richard K. (Dearborn MI) Salisbury Kenneth A. (Livonia MI) Stevenson Paul E. (Colorado Springs CO) Merala Thomas B. (Canton, Micro soldering system for electronic components.
  17. Keeling Michael R. (Cambridge GB2) Weinberg Hillar (Cambridge GB2), Modulation signal amplitude adjustment for an ink jet printer.
  18. Ayers Scott D. ; Hayes Donald J. ; Boldman Michael T. ; Wallace David B., Printhead for liquid metals and method of use.
  19. Hayes Donald J. (Plano TX), Solder compositions and methods of making same.
  20. Tsung Pan Alfred I. ; Allen Ross R. ; Hanson Eric G., Solder jet printhead.
  21. Van Schaik Michiel J. (Breda NLX), Soldering apparatus with improved configuration of solder streams.
  22. Kolesar Michael J. (Derry NH) Bois Philip J. (Manchester NH), Surface mount technology repair station and method for repair of surface mount technology circuit boards.

이 특허를 인용한 특허 (26)

  1. Hembree, David R., Assembly for testing silicon wafers which have a through-via.
  2. Farnworth Warren M., Continuous mode solder jet apparatus.
  3. Farnworth, Warren M., Continuous mode solder jet apparatus.
  4. Farnworth,Warren M., Continuous mode solder jet apparatus.
  5. Warren M. Farnworth, Continuous mode solder jet apparatus.
  6. Farnworth, Warren M., Continuous mode solder jet method.
  7. Ciardella, Robert L.; La, Duong; Chin, Wai Ching Bessie, Control method and apparatus for dispensing high-quality drops of high-viscosity material.
  8. Ciardella, Robert L.; La, Duong; Chin, Wai Ching Bessie, Control method and apparatus for dispensing high-quality drops of high-viscosity materials.
  9. Orme-Marmerelis, Melissa; Smith, Robert F., High-speed direct writing with metallic microspheres.
  10. Orme Marmerelis,Melissa; Smith,Robert F., High-speed fabrication of highly uniform metallic microspheres.
  11. Orme-Marmerelis, Melissa; Smith, Robert F., High-speed fabrication of highly uniform metallic microspheres.
  12. Melissa Orme-Marmerelis ; Robert F. Smith, High-speed fabrication of highly uniform ultra-small metallic microspheres.
  13. Kimino, Kazunari, Laser trimming problem suppressing semiconductor device manufacturing apparatus and method.
  14. Kimino,Kazunari, Laser trimming problem suppressing semiconductor device manufacturing apparatus and method.
  15. Farnworth, Warren M., Method for continuous mode solder jet apparatus.
  16. Akram,Salman; Farnworth,Warren M.; Wood,Alan G., Method for fabricating semiconductor components by forming conductive members using solder.
  17. Hembree, David R., Method for filling a wafer through-via with a conductive material.
  18. Warren M. Farnworth, Method for generating continuous stream of liquid metal droplets.
  19. Dando, Ross S.; Oliver, Steven; Borthakur, Swarnal; Hutto, Kevin, Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum.
  20. Aguilar, Stanley Cruz; Ahmadi, Mani; des Jardins, Stephen Russell; Fiske, Erik; Meier, Mark; Quinones, Horatio; Ratledge, Thomas L.; Wright, Robert James, Modular jetting devices.
  21. Aguilar, Stanley Cruz; Ahmadi, Mani; des Jardins, Stephen Russell; Fiske, Erik; Meier, Mark; Quinones, Horatio; Ratledge, Thomas L.; Wright, Robert James, Modular jetting devices.
  22. Aguilar, Stanley Cruz; Ahmadi, Mani; des Jardins, Stephen Russell; Fiske, Erik; Meier, Mark; Quinones, Horatio; Ratledge, Thomas; Wright, Robert James, Modular jetting devices.
  23. Akram, Salman; Farnworth, Warren M.; Wood, Alan G., Semiconductor package having interconnect with conductive members.
  24. Chhajed, Parag K., Vacuum nozzle having back-pressure release hole.
  25. Ciardella, Robert L.; La, Duong; Chin, Wai Ching Bessie, Viscous non-contact jetting method and apparatus.
  26. Ciardella, Robert L; La, Duong; Chin, Wai Ching Bessie, Viscous non-contact jetting method and apparatus.
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