초록 ▼

An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconduc

An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the continuous moving cathode during electrochemical reaction.

대표청구항 ▼

[ What is claimed is:] [30.] A method of inducing an electrochemical reaction on at least one semiconductor substrate, comprising:providing a hollow first electrode, and a second electrode;attaching at least one semiconductor substrate to one of said hollow first electrode and said second electrode;

[ What is claimed is:] [30.] A method of inducing an electrochemical reaction on at least one semiconductor substrate, comprising:providing a hollow first electrode, and a second electrode;attaching at least one semiconductor substrate to one of said hollow first electrode and said second electrode;inserting said second electrode into said hollow first electrode and immersing both electrodes in a reaction solution;inducing an electrical charge between said hollow first electrode and said second electrode; androtating at least one of said hollow first electrode and said second electrode with respect to another of said hollow first electrode and said second electrode.