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Copper etching compositions and method for etching copper 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23F-001/00
출원번호 US-0260169 (1999-03-01)
발명자 / 주소
  • Bishop Craig V.
  • Kochilla John R.
  • Durante Robert J.
  • Bokisa George S.
출원인 / 주소
  • McGean-Rohco, Inc.
대리인 / 주소
    Renner, Otto, Boiselle & Sklar
인용정보 피인용 횟수 : 25  인용 특허 : 11

초록

The invention also relates to a process for etching metallic copper comprising contacting the surface of a copper substrate with the aqueous etching compositions of the invention. A method of regenerating a spent aqueous etching composition of the invention which has been used for etching metallic c

대표청구항

[ What is claimed is:] [30.] A method of regenerating a spent aqueous etching composition used for etching metallic copper comprising:(a) an acid,(b) a copper complex,(c) a metal capable of having a multiplicity of oxidation states and which is present in the composition in one of its higher positiv

이 특허에 인용된 특허 (11)

  1. Bokisa George S. (North Olmsted OH) Willis William J. (North Royalton OH), Aqueous electroless plating solutions.
  2. Elias Moenes L. (Canfield OH) Burger Walter L. (Salem OH), Dissolution of metals utilizing tungsten.
  3. Courduvelis Constantine I. (Orange CT), Metal dissolution process using H2O2-H2SO4 etchant.
  4. Hillis, Maurice R., Method and apparatus for etching copper.
  5. Narisawa Toshio (Aichi JPX) Kato Ryohei (Aichi JPX) Nakamura Masanori (Nara JPX) Yamaguchi Hitoyoshi (Osaka JPX), Method for concurrent production of copper powder and a metal chloride.
  6. Wong Kwee C. (Orange County CA), Method for etching copper and composition useful therein.
  7. Sutcliffe Gary R. (Kensington CT) Conrod Jay B. (Cheshire CT), Method for manufacture of printed circuit boards.
  8. Kukanskis Peter (Woodbury CT) Grunwald John J. (New Haven CT), Method for the manufacture of printed circuit boards.
  9. Konstantouros Efthimios (Munich DEX), Method of regenerating ammoniacal etching solutions useful for etching metallic copper.
  10. Nelson Norvell J. (Palo Alto CA), Process for etching copper.
  11. Larson Gary B., Process for the manufacture of printed circuit boards.

이 특허를 인용한 특허 (25)

  1. Whitney, Jr., Dickson L.; Bokisa, George S.; Bishop, Craig V.; Vitale, Americus C., Adhesion of polymeric materials to metal surfaces.
  2. Chen, Philip S. H.; Hunks, William; Chen, Tianniu; Stender, Matthias; Xu, Chongying; Roeder, Jeffrey F.; Li, Weimin, Amorphous Ge/Te deposition process.
  3. Hunks, William; Chen, Tianniu; Xu, Chongying; Roeder, Jeffrey F.; Baum, Thomas H.; Stender, Matthias; Chen, Philip S. H.; Stauf, Gregory T.; Hendrix, Bryan C., Antimony and germanium complexes useful for CVD/ALD of metal thin films.
  4. Hunks, William; Chen, Tianniu; Xu, Chongying; Roeder, Jeffrey F.; Baum, Thomas H.; Stender, Matthias; Chen, Philip S. H.; Stauf, Gregory T.; Hendrix, Bryan C., Antimony and germanium complexes useful for CVD/ALD of metal thin films.
  5. Hunks, William; Chen, Tianniu; Xu, Chongying; Roeder, Jeffrey F.; Baum, Thomas H.; Stender, Matthias; Chen, Philip S. H.; Stauf, Gregory T.; Hendrix, Bryan C., Antimony and germanium complexes useful for CVD/ALD of metal thin films.
  6. Xu, Chongying; Borovik, Alexander S.; Baum, Thomas H., Copper (I) compounds useful as deposition precursors of copper thin films.
  7. Xu,Chongying; Borovik,Alexander; Baum,Thomas H., Copper (I) compounds useful as deposition precursors of copper thin films.
  8. Zheng, Jun-Fei, Double self-aligned phase change memory device structure.
  9. Kim, Bong-Kyun; Choung, Jong-Hyun; Lee, Byeong-Jin; Hong, Sun-Young; Park, Hong-Sick; Kim, Shi-Yul; Lee, Ki-Beom; Cho, Sam-Young; Kim, Sang-Woo; Shin, Hyun-Cheol; Seo, Won-Guk, Etchant and method of manufacturing an array substrate using the same.
  10. Zheng, Jun-Fei, Germanium antimony telluride materials and devices incorporating same.
  11. Zheng, Jun-Fei, Germanium antimony telluride materials and devices incorporating same.
  12. Zheng, Jun-Fei; Roeder, Jeffrey F.; Li, Weimin; Chen, Philip S. H., High concentration nitrogen-containing germanium telluride based memory devices and processes of making.
  13. Roeder, Jeffrey F.; Baum, Thomas H.; Hendrix, Bryan C.; Stauf, Gregory T.; Xu, Chongying; Hunks, William; Chen, Tianniu; Stender, Matthias, Low temperature deposition of phase change memory materials.
  14. Ottertun, Harald, Method for etching copper and recovery of the spent etching solution.
  15. Jang, Eun Joo; Son, Seung Uk, Method for preparing nanoparticles using carbene derivatives.
  16. Bae, Byoung-Jae; Cho, Sung-Lae; Lee, Jin-Il; Park, Hye-Young; Kim, Do-Hyung, Method of forming phase change material layer using Ge(II) source, and method of fabricating phase change memory device.
  17. Bae, Byoung-jae; Cho, Sung-lae; Lee, Jin-il; Park, Hye-young; Kim, Do-hyung, Method of forming phase change material layer using Ge(II) source, and method of fabricating phase change memory device.
  18. Feng, Kesheng; Kapadia, Nilesh; Castaldi, Steven A., Microetching composition and method of using the same.
  19. Feng,Kesheng; Kapadia,Nilesh; Castaldi,Steven A., Microetching composition and method of using the same.
  20. Kurii, Masayo; Tai, Kiyoto; Nakamura, Mami, Microetching solution for copper, replenishment solution therefor and method for production of wiring board.
  21. Kurii, Masayo; Tai, Kiyoto; Nakamura, Mami, Microetching solution for copper, replenishment solution therefor and method for production of wiring board.
  22. Ohto, Masaru; Matsunaga, Hiroshi; Yamada, Kenji, Processing liquid for suppressing pattern collapse of fine metal structure and method for producing fine metal structure using same.
  23. Chen, Tianniu; Xu, Chongying; Roeder, Jeffrey F.; Baum, Thomas H., Tantalum amido-complexes with chelate ligands useful for CVD and ALD of TaN and Ta0thin films.
  24. Chen, Tianniu; Xu, Chongying; Roeder, Jeffrey F.; Baum, Thomas H., Tantalum amido-complexes with chelate ligands useful for CVD and ALD of TaN and Ta205 thin films.
  25. Stender, Matthias; Xu, Chongying; Chen, Tianniu; Hunks, William; Chen, Philip S. H.; Roeder, Jeffrey F.; Baum, Thomas H., Tellurium compounds useful for deposition of tellurium containing materials.

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