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Multiple-component clamp and related method for attaching multiple heat-generating components to a heatsink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0281848 (1999-03-31)
발명자 / 주소
  • Rearick Donald P.
출원인 / 주소
  • Lucent Technologies, Inc.
인용정보 피인용 횟수 : 25  인용 특허 : 9

초록

The present invention provides a multiple-component clamp for use with multiple, heat-generating components and a heatsink. In one embodiment, the multiple-component clamp comprises a clamp body having first and second regions, and a deformable region positioned between the first and second regions.

대표청구항

[ What is claimed is:] [1.] For mounting multiple heat-generating components to a heatsink, a multiple-component clamp, comprising:a clamp body having first and second regions, said clamp body being an essentially rectangular plate having first and second long edges with first and second midpoints,

이 특허에 인용된 특허 (9)

  1. Thurston Mark Edward,JPX ; Xie Hong, Apparatus for attaching a heat sink to a PCB mounted semiconductor package.
  2. Bosli Hans Ludwig (Schwerzenbach CHX), Attachment device for semiconductor circuit elements.
  3. Wekell William O. (Renton WA), Heat sink and transistor retaining assembly.
  4. Tsui Jonathan H. K.,HKX, Heat sink spring clip.
  5. Rio Pascal (Bois Colombes FRX) Magnenet Patrick (Thorigny-sur-Marne FRX), Heatsink for contact with multiple electronic components mounted on a circuit board.
  6. Bartlow Howard Dwight, Low thermal resistance semiconductor package and mounting structure.
  7. Blickhan Joseph D. (Quincy IL) Bonds David K. (Quincy IL) Crockett Robert J. (Quincy IL) Mazurek James E. (Quincy IL) Milfs Dennis J. (Quincy IL), Means for clamping a semi-conductor to a support.
  8. Berg William E. (Portland OR), Mounting an integrated circuit chip to an etched circuit board.
  9. Romano\ Luigi (Monza ITX), Semiconductor device mounted in a highly flexible, segmented package, provided with heat sink.

이 특허를 인용한 특허 (25)

  1. Kirstine, Rodney L., Assemblies including heat sink elements and methods of assembling.
  2. Carney,Allen, Boost spring holder for securing a power device to a heatsink.
  3. Bax, Randall L.; Elayed, Karim; Medina, Paul, Bus bar interconnection techniques.
  4. Boyce, Martin J., Circuit board assembly for welding power supply.
  5. Negrut, Florin, Clamp for electrical devices.
  6. Mei, Youping; Stover, Lance Eugene; Zhu, Jianxin, Compliant clamping mechanism for accurate alignment of a group of miniature parts.
  7. Fattal, Souren G.; Peterson, Mitchell E., Distinguishing between different transient conditions for an electric power generation system.
  8. Bax, Randall L.; Peterson, Mitchell E.; Naden, Mark, Electric power generation system with current-controlled power boost.
  9. Peterson, Mitchell E.; Kunin, Sergey, Electric power generation system with multiple alternators driven by a common prime mover.
  10. Fattal, Souren G., Electric power generation system with multiple inverters.
  11. Tanaka, Makoto, Electronic device.
  12. Kirstine, Rodney L., Heat-dissipating assemblies and methods of assembling heat-dissipating assemblies.
  13. Bream Jeffrey L. ; Ferranti Stephen A. ; Ganesa-Pillai Madhu ; Klafter Leon ; Lyons Alan M. ; Mello John Paul ; Vargo Steven J., Heatsink with high thermal conductivity dielectric.
  14. Poidl, Jurgen, Housing with thermal bridge.
  15. Fattal, Souren G., Large transient detection for electric power generation.
  16. Bax, Randall; Peterson, Mitchell E., Management of an electric power generation and storage system.
  17. Peterson, Mitchell E.; Bax, Randall, Management of an electric power generation and storage system.
  18. Ross, Stanton W., Mounting system for high-voltage semiconductor device.
  19. Koike, Tatsuo; Somaki, Motoaki; Hayasaka, Masashi; Matsusaka, Shigeharu; Nagasawa, Kazuya, Power drive unit including a heat sink and a fastener.
  20. Ogawa, Takeshi, Power semiconductor device.
  21. Pan, Lifeng; Li, Hongming, Semiconductor switch insulation protection device and power supply assembly.
  22. Ayana, Elias; Peterson, Mitchell E.; Marlenee, Alyssa, Shore power transfer switch.
  23. Dubovsky, Stephen M.; Mellema, William, Spring spacer assemblies for maintaining electrical components in contact with thermal transfer surfaces.
  24. Murray, Jerry; Carney, Allen B.; Bax, Randall L.; Ayana, Elias; Pautzke, Roger; McCarthy, John, Transfer switch assembly.
  25. Murray, Jerry; Carney, Allen B.; Bax, Randall L.; Ayana, Elias; Pautzke, Roger; McCarthy, John, Transfer switch assembly and method.
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