초록 ▼

A method for positioning a workpiece comprises the steps of providing a pedestal having a chamfered portion and a generally circular portion having a first diameter and providing a table having a hole therein and a chamfered portion, the hole having a second diameter larger than the first diameter.

A method for positioning a workpiece comprises the steps of providing a pedestal having a chamfered portion and a generally circular portion having a first diameter and providing a table having a hole therein and a chamfered portion, the hole having a second diameter larger than the first diameter. The inventive method further includes the steps of supporting the pedestal with the table, the chamfered portion of the table contacting the chamfered portion of the pedestal and placing the workpiece on the pedestal. Next, the chamfered portion of the pedestal is urged away from the table. Subsequent to the step of urging the chamfered portion of the pedestal away from the table, the pedestal is moved in at least one of X-, Y-, and theta directions while the generally circular portion of the pedestal extends into the hole in the table.

대표청구항 ▼

[ What is claimed is:] [1.] A process for transporting and testing an unpackaged semiconductor device comprising the following steps:staging a semiconductor wafer having a plurality of semiconductor devices thereupon;moving one of said semiconductor devices onto a chamfered pedestal of a carousel ta

[ What is claimed is:] [1.] A process for transporting and testing an unpackaged semiconductor device comprising the following steps:staging a semiconductor wafer having a plurality of semiconductor devices thereupon;moving one of said semiconductor devices onto a chamfered pedestal of a carousel table, said carousel table having a chamfered portion, said chamfered pedestal resting against said chamfered portion of said carousel table;positioning said semiconductor device at a test head;lifting said pedestal from said carousel table toward a probe;responsive to a signal from a camera, moving said pedestal in at least one of an X-, Y-, and theta direction to align said semiconductor device with said probe;contacting said probe and said semiconductor device thereby making electrical contact between said semiconductor device and said probe; andtesting said semiconductor device by passing an electrical signal through said probe to said semiconductor device.