초록 ▼

An air intake apparatus for semiconductor fabricating equipment reduces the inflow of chemical contaminants, such as ozone (O.sub.3), into the equipment. The air intake apparatus includes a fan as an air intake device, and a chemical filter containing activated carbon to remove the chemical contamin

An air intake apparatus for semiconductor fabricating equipment reduces the inflow of chemical contaminants, such as ozone (O.sub.3), into the equipment. The air intake apparatus includes a fan as an air intake device, and a chemical filter containing activated carbon to remove the chemical contaminants from air drawn in from outside the equipment. The air intake apparatus may further include first and second filters for removing particulate contaminants from the air. By applying the air intake apparatus to chemical vapor deposition (CVD) equipment used to carry out a process for forming hemispherical grains (HSGs), which is sensitive to a native oxide layer, the ozone density inside the CVD equipment is decreased. Accordingly, the semiconductor device produced has a higher capacitance and enhanced performance.

대표청구항 ▼

[ What is claimed is:] [1.] An air intake apparatus of chemical vapor deposition equipment, comprising:an air intake means for drawing in air from a location outside of the equipment;an ozone filter for removing chemical contaminants from the air passing through the air intake means, the ozone filte

[ What is claimed is:] [1.] An air intake apparatus of chemical vapor deposition equipment, comprising:an air intake means for drawing in air from a location outside of the equipment;an ozone filter for removing chemical contaminants from the air passing through the air intake means, the ozone filter comprising activated carbon for use in removing ozone (O.sub.3) from the air that has passed through the air intake means;a first filter disposed upstream of the air intake means, for use in removing particulate contaminants;a second filter disposed downstream of the air intake means, for use in removing particulate contaminants, wherein air intake holes of the first filter are larger than air intake holes of the second filter; anda fan disposed between the ozone filter and the second filter, for use in offsetting a drop in air pressure. [6.] A method of removing chemical contaminants, comprising steps of:drawing in air from outside of chemical vapor deposition equipment using an air intake means, wherein particulate contaminants are removed from the air using a first filter;filtering chemical contaminants from the drawn in air using an ozone filter which employs a chemical reaction in which activated carbon on a surface of the ozone filter absorbs ozone from the air;offsetting a drop in air pressure using a fan disposed between the ozone filter and a second filter; andremoving particulate contaminants from the air using the second filter, wherein the first filter removes larger particulate contaminants than the second filter.