초록 ▼

The proposed process for bonding together two substrates with an anhydrous or low-water-content partially crystalline adhesive which is solid at room temperature is characterized in that the adhesive is first activated by internal and/or external friction. The substrates are then joined together wit

The proposed process for bonding together two substrates with an anhydrous or low-water-content partially crystalline adhesive which is solid at room temperature is characterized in that the adhesive is first activated by internal and/or external friction. The substrates are then joined together with the adhesive between them. When allowed to stand, the structure attains its final strength after a period of between a few seconds to a few days. The friction destroys the crystalline structure and causes the adhesive to become gluey, and re-crystallization gives it its final strength and eliminates the gluey quality. The adhesive is based preferably on polyester or polyurethane and used preferably in the form of a gum stick without impermeable packaging. It is especially suitable for bonding paper, since it does not cause corrugation.

대표청구항 ▼

[ What is claimed:] [1.] A process for bonding substrates at ambiant temperature with a non-reactive, substantially water-free, partly crystalline adhesive, solid at room temperature, which comprises:rubbing the solid adhesive against at least one of the substrates to be bonded to form a tacky film

[ What is claimed:] [1.] A process for bonding substrates at ambiant temperature with a non-reactive, substantially water-free, partly crystalline adhesive, solid at room temperature, which comprises:rubbing the solid adhesive against at least one of the substrates to be bonded to form a tacky film of adhesive on the substrate wherein at least a portion of the crystalline adhesive in the film is converted to an amorpheous form;joining the substrates with the tacky film of adhesive, located in between said substrates; andallowing said tacky adhesive to crystallize whereby a bond is formed between said substrates.