초록 ▼

A conditioning wafer for conditioning a polishing pad employed in chemical-mechanical polishing of an integrated circuit substrate is described. The conditioning wafer includes a disk having a conditioning surface and a plurality of abrasive particles secured on the conditioning surface of the disk.

A conditioning wafer for conditioning a polishing pad employed in chemical-mechanical polishing of an integrated circuit substrate is described. The conditioning wafer includes a disk having a conditioning surface and a plurality of abrasive particles secured on the conditioning surface of the disk. Furthermore, the abrasive particles engage with the polishing pad when the conditioning wafer contacts the polishing pad during conditioning of the polishing pad.

대표청구항 ▼

[ What is claimed is:] [1.] A conditioning wafer for conditioning a polishing pad employed in chemical-mechanical polishing of an integrated circuit substrate, comprising:a disk having a conditioning surface; andan adhesive strip that includes abrasive particles on a first surface and adheres to the

[ What is claimed is:] [1.] A conditioning wafer for conditioning a polishing pad employed in chemical-mechanical polishing of an integrated circuit substrate, comprising:a disk having a conditioning surface; andan adhesive strip that includes abrasive particles on a first surface and adheres to the conditioning surface of the disk at a second surface, wherein said abrasive particles engage with the polishing pad when said conditioning wafer contacts said polishing pad during conditioning of said polishing pad.