초록 ▼

A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the groups from adjacent columns, and a portion of eac

A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the groups from adjacent columns, and a portion of each group overlaps into an adjacent row or an adjacent column of the groups of the array; a semiconductor die; and structure for providing electrical connection between the semiconductor die and the conductive contacts. A semiconductor die carrier may also include an insulative substrate; a plurality of leads each having an external portion extending out of the semiconductor die. carrier from a lower surface of the insulative substrate and an internal portion located within the semiconductor die carrier at an upper surface of the insulative substrate; a semiconductor die; and a layer of conductive material in contact with conductive portions of the semiconductor die and also in contact with the internal portions of the leads.

대표청구항 ▼

[ What is claimed is:] [1.] A semiconductor die carrier comprising:a semiconductor die;a die carrier housing comprising an interior space for receiving said semiconductor die;a plurality of electrically-conductive leads extending through said die carrier housing, each of said plurality of leads comp

[ What is claimed is:] [1.] A semiconductor die carrier comprising:a semiconductor die;a die carrier housing comprising an interior space for receiving said semiconductor die;a plurality of electrically-conductive leads extending through said die carrier housing, each of said plurality of leads comprising an L-shaped outer portion extending from an outer side surface of said die carrier housing and an inner portion extending within said die carrier housing;an electrically-conductive material forming at least part of an electrical path between said electrically-conductive leads and said semiconductor die; andan electrical interconnect component on an outer surface of said die carrier housing, said electrical interconnect component comprising an insulative member having an end joined to said die carrier housing and side surfaces projecting from an outer surface of said die carrier housing and a plurality of electrically-conductive contacts extending along the side surfaces of said insulative member.