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Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F28D-015/00
출원번호 US-0205093 (1998-12-03)
우선권정보 JP-0183563 (1998-06-30)
발명자 / 주소
  • Kobayashi Takashi,JPX
출원인 / 주소
  • Mitsubishi Denki Kabushiki Kaisha, JPX
대리인 / 주소
    Burns, Doane, Swecker & Mathis, LLP
인용정보 피인용 횟수 : 37  인용 특허 : 13

초록

The present invention aims to reduce as much as possible the weight of the thermo-siphon being used in spreading heat of the mobile information processing apparatus. The heat spreading board 5 and the thermo-siphon 6 is installed at the lid 51 of the notebook type personal computer, and the heat fro

대표청구항

[ What is claimed is:] [1.] A thermo-siphon, comprising:a heat spreading board; anda flow channel for circulating a working fluid;wherein the heat spreading board includes a thick part and a thin part, andthe heat spreading board is a combined plate of a first plate and a second plate, rein the firs

이 특허에 인용된 특허 (13)

  1. Haley Kevin (San Jose CA) Aghazadeh Mostafa (Chandler AZ) Xie Hong (Chandler AZ), Apparatus for dissipating heat in a hinged computing device.
  2. Mittal, Faquir C.; Solis, Charles R., Apparatus for use in cooling integrated circuit chips.
  3. Kikuchi Shunichi (Yokohama JPX) Matsunaga Haruyuki (Atsugi JPX) Katsumi Hideo (Sagamihara JPX) Katsuyama Koji (Yokohama JPX), Cooling system for electronic circuit components.
  4. O'Connor Michael ; Haley Kevin ; Bhatia Rakesh ; Adams Daniel Thomas ; Kast Michael Andrew, Cooling system for thin profile electronic and computer devices.
  5. Ohashi Shigeo,JPX ; Hatada Toshio,JPX ; Tanaka Shinji,JPX, Cooling unit for electronic equipment.
  6. Xie Hong (Chandler AZ) Aghazadeh Mostafa (Chandler AZ) Turturro Gregory (Chandler AZ) Chiu Chia-Pin (Chandler AZ), Dissipation of heat through keyboard using a heat pipe.
  7. Mecredy ; III Henry E., Heat dissipating lid hinge structure with laterally offset heat pipe end portions.
  8. Bhatia Rakesh (Sunnyvale CA) Haley Kevin (San Jose CA), Heat pipe exchanger system for cooling a hinged computing device.
  9. Garner Scott D. ; Meyer ; IV George A. ; Toth Jerome E. ; Longsderff Richard W., Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices.
  10. Ishida Yoshio (Osaka JPX), Heat radiating apparatus.
  11. Aguilera Rafael E. (Simpsonville SC), Passive CPU cooling and LCD heating for a laptop computer.
  12. Progl Curtis L. ; Tracy Mark S. ; Moore David A., System and method for transferring heat between movable portions of a computer.
  13. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for a laptop computer lid.

이 특허를 인용한 특허 (37)

  1. Senyk, Borys S.; Moresco, Larry L., Apparatus for cooling a computer.
  2. Broder Damon ; Hood ; III Charles D., Apparatus for cooling a heat generating component in a computer.
  3. Uttam Shyamalindu Ghoshal, Apparatus for dense chip packaging using heat pipes and thermoelectric coolers.
  4. Steenwyk, Meredith Marie; Coxon, Danny Weldon; Streyle, John Jay; Vander Ploeg, Benjamin Jon, Avionics chassis.
  5. Streyle, John Jay; Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon, Avionics chassis.
  6. Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon; Horton, Paul James; Streyle, John Jay, Avionics chassis.
  7. Cottet, Didier; Agostini, Francesco; Gradinger, Thomas; Vögeli, Andreas, Cabinet with modules having a thermosiphon cooler arrangement.
  8. Wang, Hwai-Ming; Chiang, Wei-Chieh; Liu, Hsien-Tsang, Cooling system for hinged portable computing device.
  9. Ishikawa, Kenichi; Hisano, Katsumi, Cooling unit including radiator for radiating heat of heat generating component, and electronic apparatus including the cooling unit.
  10. Kondo, Yoshihiro; Matsushita, Shinji; Ohashi, Shigeo; Naganawa, Takashi; Minamitani, Rintaro; Nakagawa, Tsuyoshi; Yoshitomi, Yuuji; Nakanishi, Masato; Katou, Hajime, Electronic apparatus.
  11. Kondo, Yoshihiro; Matsushita, Shinji; Ohashi, Shigeo; Naganawa, Takashi; Minamitani, Rintaro; Nakagawa, Tsuyoshi; Yoshitomi, Yuuji; Nakanishi, Masato; Katou, Hajime, Electronic apparatus.
  12. Kusaka, Hiroyuki; Tomioka, Kentaro; Tanimoto, Mitsuyoshi, Electronic apparatus having a plurality of radiators in which liquid coolant flows.
  13. De Troz, Vincent, Evaporator with simplified assembly for diphasic loop.
  14. Koichi Inoue JP; Chiyoshi Sasaki JP, Heat conducting apparatus and electronic apparatus having the same.
  15. Chun, Dexter T.; Chiriac, Victor A.; Thompson, James H.; Molloy, Stephen A., Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features.
  16. Andre Ali, Heat exchanger having phase change material for a portable computing device.
  17. Xia,Wan Lin; Li,Tao; Xiao,Min Qi; Zhong,Yong, Heat sink.
  18. Furukawa Yuichi,JPX ; Sumitani Mitsugu,JPX ; Ito Tomio,JPX, Heat sink for portable electronic devices.
  19. Tsoi, Vadim; Henningsson, Uno; Hong, Yuping; Peng, Feng; Yang, Hua; Li, Haipeng, Heat spreading device and method with sectioning forming multiple chambers.
  20. Hamman,Brian A., Liquid cooling system.
  21. Kitano,Makoto; Naganawa,Takashi; Yoshitomi,Yuji; Minamitani,Rintaro; Ohashi,Shigeo; Ashiwake,Noriyuki; Kondo,Yoshihiro; Nakagawa,Tsuyoshi, Liquid cooling system and personal computer using thereof.
  22. Huang,Hsin Sheng; Chi,Yen Shu, Liquid-cooling heat dissipating device for dissipating heat by a casing.
  23. Senyk, Borys S.; Moresco, Larry L., Method and an apparatus for cooling a computer.
  24. Senyk, Borys S.; Moresco, Larry L., Method and an apparatus for cooling a computer.
  25. Senyk,Borys S.; Moresco,Larry L., Method and an apparatus for cooling a computer.
  26. Senyk,Borys S.; Moresco,Larry L., Method and an apparatus for cooling a computer.
  27. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  28. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  29. Chase, Jeffrey S.; Doyle, Ronald P.; Kaminsky, David L.; Ogle, David M.; Telford, Richard D., Resource-aware system, method and program product for managing request traffic based on a management policy.
  30. Chase, Jeffrey S.; Doyle, Ronald P.; Kaminsky, David L.; Ogle, David M.; Telford, Richard D., Resource-aware system, method and program product for managing request traffic based on a management policy.
  31. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  32. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  33. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  34. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  35. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  36. Cottet, Didier; Agostini, Francesco; Gradinger, Thomas; Vögeli, Andreas, Thermosiphon cooler arrangement in modules with electric and/or electronic components.
  37. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
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