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특허 상세정보

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Photopolymerizable compositions for encapsulating microelectronic devices

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B29B-013/08    B29C-035/08    C08F-004/00    C08J-007/06   
미국특허분류(USC) 26/427.211 ; 26/427.217 ; 26/449.4 ; 26/449.6 ; 42/757.2 ; 42/751.9 ; 52/201.3 ; 52/202.4 ; 52/204.3 ; 52/206.4 ; 52/208.1 ; 52/208.3 ; 52/210.0 ; 52/210.3 ; 52/217.0
출원번호 US-0130672 (1998-08-07)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Harness, Dickey & Pierce, P.L.C.
인용정보 피인용 횟수 : 31  인용 특허 : 24
초록
▼

A novel method for producing thick composite parts based upon photopolymerizable compositions is disclosed. Also disclosed are novel methods for encapsulation of microelectronic devices based upon novel photopolymerizable compositions. The constituents of the photopolymerizable mixture comprise a monomer or monomers capable of polymerizing by free radical or cationic mechanisms, and a photoinitiator system which possesses an absorbance characteristic which is effectively reduced, or self-eliminating, upon initiation of the polymerization reaction. Parts ...

대표
청구항
▼

[ We claim:] [1.] A method for encapsulating a microelectronic device, comprising:(a) placing said microelectronic device into a mold having a cavity, a place for said microelectronic device within said cavity, and at least one side allowing light to penetrate into the cavity;(b) filling said mold with a photopolymerizable composition comprising at least one monomer to be photopolymerized to a polymer, a photoinitiator having a self-eliminating absorbance, and a filler, wherein said monomer does not have unduly facile extractable hydrogens so as to adver...

이 특허에 인용된 특허 (24)

  1. Bachmann Andrew G. (Harwinton CT) Cantor Stephen E. (Cheshire CT). Actinic radiation-curable formulation. USP1997105677362.
  2. Hull Charles W. (Arcadia CA). Apparatus for production of three-dimensional objects by stereolithography. USP1986034575330.
  3. Bachmann Andrew G. (Harwinton CT) Cantor Stephen E. (Cheshire CT). Coating method using actinic radiation-curable formulation. USP1997095672393.
  4. Drain Kieran F. (Meriden CT) Nativi Larry A. (Rocky Hill CT). Dual cure method for making a rotted electrical/mechanical device. USP1990084952342.
  5. Goff David L. (Springfield PA) Yuan Edward L. (Philadelphia PA) Proskow Stephen (Wilmington DE). Electrical device formed from polymeric heat resistant photopolymerizable composition. USP1983104410612.
  6. Pennisi Robert W. (Boca Raton FL) Gold Glenn E. (Coconut Creek FL) Juskey Frank J. (Coral Springs FL) Urbish Glenn F. (Coral Springs FL). Encapsulated electronic package. USP1994055313365.
  7. Nakata Yoshihiro,JPX ; Takigawa Yukio,JPX ; Yagi Shigeaki,JPX ; Sawatari Norio,JPX. Epoxy resin composition for encapsulating semiconductor. USP1998065763540.
  8. Noren Gerry K. (Hoffman Estates IL) Krajewski John J. (Wheeling IL) Shama Sami A. (Hoffman Estates IL) Zimmerman John M. (Hoffman Estates IL) Thompson Danny C. (Schaumburg IL) Vandeberg John T. (Barr. Free-radical curable compositions comprising vinyl ether and urethane malenate compounds. USP1994085340653.
  9. McShane Michael B. (Austin TX) Woosley Alan H. (Austin TX) Primeaux Francis (Austin TX). Method for encapsulating semiconductor devices with package bodies. USP1994095344600.
  10. Kinsman Larry D. (Boise ID). Method for packaging a semiconductor die. USP1997125696033.
  11. Otsuki ; Akira ; Nishino ; Makoto. Method of resin encapsulating electrical parts with UV curing of fire retardant resin. USP1978024073835.
  12. Primeaux William F. (Austin TX). Molded plastic package with wire protection. USP1994075331205.
  13. Goldberg Monroe B. (Huntington Station NY) Voorhis William B. (Levittown NY). Passivated and encapsulated semiconductors and method of making same. USP1976123996602.
  14. Sasaki Isao (Hiroshima JPX) Mukai Nobuhiro (Hiroshima JPX) Ige Hitoshi (Ohtake JPX). Photopolymerizable dental composition. USP1990064933376.
  15. Sasaki Isao (Hiroshima JPX) Mukai Nobuhiro (Hiroshima JPX) Ige Hitoshi (Ohtake JPX). Photopolymerizable dental composition. USP1990124977197.
  16. Sasaki Isao (Saeki JPX) Mukai Nobuhiro (Hiroshima JPX) Ige Hitoshi (Ohtake JPX). Photopolymerizable dental composition containing a hexafunctional urethane methacrylate based on isocyanuric acid. USP1988084762863.
  17. Hayase Rumiko (Kawasaki JPX) Oba Masayuki (Yokohama JPX) Kihara Naoko (Matsudo JPX) Mikogami Yukihiro (Yokohama JPX). Photosensitive composition and resin-encapsulated semiconductor device. USP1994085340684.
  18. Ohta Hideo (Tokyo JPX) Okuyama Tetsuo (Yokohama JPX) Fujieda Shinetsu (Kawasaki JPX) Kajiura Sadao (Kanagawa-ken JPX) Yoshizumi Akira (Yokohama JPX). Plastic-encapsulated semiconductor device. USP1997065641997.
  19. Goff David L. (Springfield PA) Yuan Edward L. (Philadelphia PA) Proskow Stephen (Wilmington DE). Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors. USP1982054329419.
  20. Neckers Douglas C. (Perrysburg OH) Valdes-Aguilera Oscar (Bowling Green OH) Raghuveer Krishan S. (Bartlesville OK) Watson Darrell G. (Flint MI). Production of three dimensional bodies by photopolymerization. USP1992085137800.
  21. Sagami Yosuke (Yokohama JPX) Yamamoto Akira (Yachiyo JPX) Watanabe Shoji (Otake JPX) Isobe Tomohisa (Iwakuni JPX) Funato Susumu (Otake JPX). Resin composition to seal electronic device. USP1987104703338.
  22. Ikeya Hirotoshi (Yokosuka JPX) Higashi Michiya (Kawasaki JPX). Resin encapsulation type semiconductor device by use of epoxy resin composition. USP1987124710796.
  23. Asano Eiichi,JPX ; Aoki Takayuki,JPX ; Shiobara Toshio,JPX ; Flury Peter,CHX ; Scharf Wolfgang,DEX ; Okada Tadashi,CHX. Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith. USP1998045739187.
  24. Gilmore Peter B. (Plantation FL) Thompson Kenneth R. (Sunrise FL). Shielded semiconductor device package. USP1996095557142.

이 특허를 인용한 특허 피인용횟수: 31

  1. Havens, John R.; Onofrey, Thomas J.; Greef, Charles H.; Kevorkian, Gregory J.; Krotz, Jain; Lykstad, Kristie L.; Raymond, Daniel E.; Reese, Howard R.; Rooney, Regina; Scott, John J.. Biomolecular attachment sites on microelectronic arrays and methods thereof. USP2012108288155.
  2. Light, II, James P.; Nguyen, Kenny V.. Compositions and methods for preserving permeation layers for use on active electronic matrix devices. USP2010037687103.
  3. Ishigaki, Toshimasa; Sonoda, Daisuke; Ide, Tatsuya; Ishizaki, Koji; Watanabe, Yoshihiro; Kurasawa, Hayato; Ikeda, Masanobu. Display device and manufacturing method thereof. USP2018049933646.
  4. Ishigaki, Toshimasa; Sonoda, Daisuke; Ide, Tatsuya; Ishizaki, Koji; Watanabe, Yoshihiro; Kurasawa, Hayato; Ikeda, Masanobu. Display device and manufacturing method thereof. USP2017079696575.
  5. Liu, Lung-Chang; Chung, Ming-Hua; Chen, Jen-Hao. Encapsulant composition and method for fabricating encapsulant material. USP2015049018276.
  6. Liu, Lung-Chang; Chung, Ming-Hua; Hsu, Tsung-Ju; Chang, Chih-Fen; Chen, Jen-Hao. Encapsulant compositions and method for fabricating encapsulant materials. USP2013028367768.
  7. Shin, Kyungjae; Kim, Kiwoong. Integrated silicone for protecting electronic devices, circuit module using the same and manufacturing method of circuit module. USP2017129834686.
  8. Thompson, D. Scott; Boardman, Larry D.; Leatherdale, Catherine A.. Light emitting device with multilayer silicon-containing encapsulant. USP2016049308680.
  9. Krotz, Jainamma; Smolko, Daniel; Reese, Howard R.; Onofrey, Thomas J.; Wang, Daguang; Winger, Theodore M.; Havens, John R.. Mesoporous permeation layers for use on active electronic matrix devices. USP2009107597932.
  10. Krotz, Jainamma; Smolko, Daniel; Reese, Howard R.; Onofrey, Thomas J.; Wang, Daguang; Winger, Theodore M.; Havens, John R.. Mesoporous permeation layers for use on active electronic matrix devices. USP2005116960298.
  11. Krotz,Jainamma; Smolko,Daniel J.; Reese,Howard R.; Onofrey,Thomas J.; Wang,Daguang; Winger,Theodore M.; Havens,John R.. Mesoporous permeation layers for use on active electronic matrix devices. USP2007097270850.
  12. Thompson, D. Scott; Boardman, Larry D.; Leatherdale, Catherine A.. Method of making a light emitting device having a molded encapsulant. USP2012118303878.
  13. Thompson, D. Scott; Boardman, Larry D.; Leatherdale, Catherine A.. Method of making a light emitting device having a molded encapsulant. USP2012018092735.
  14. Thompson, D. Scott; Leatherdale, Catherine A.; Boardman, Larry D.; Ouderkirk, Andrew J.; Kecman, Fedja. Method of making light emitting device having a molded encapsulant. USP2009097595515.
  15. Thompson, D. Scott; Boardman, Larry D.; Leatherdale, Catherine A.. Method of making light emitting device with multilayer silicon-containing encapsulant. USP2010027655486.
  16. Boardman,Larry D.; Thompson,D. Scott; Leatherdale,Catherine A.. Method of making light emitting device with silicon-containing encapsulant. USP2008097427523.
  17. Boardman,Larry D.; Thompson,D. Scott; Leatherdale,Catherine A.; Ouderkirk,Andrew J.. Method of making light emitting device with silicon-containing encapsulant. USP2008017314770.
  18. Karmaker, Ajit; Karlak, Mike; Jia, Weitao. Method of manufacturing high strength dental restorations. USP2011087998375.
  19. John, Havens R.; Smolko, Dan; Krotz, Jain; Scott, John J.. Methods for molding and grafting highly uniform polymer layers onto electronic microchips. USP2003026524517.
  20. Wood, Alan G.; Farnworth, Warren M.; Watkins, Charles M.; Benson, Peter A.. Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material. USP2009047521296.
  21. Wood,Alan G.; Farnworth,Warren M.; Watkins,Charles M.; Benson,Peter A.. Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials. USP2008107442643.
  22. Wood,Alan G.; Farnworth,Warren M.; Watkins,Charles M.; Benson,Peter A.. Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same. USP2009027488618.
  23. John, Havens R.; Winger, Theodore M.; Krotz, Jain; Dan, Smolko; Onofrey, Thomas J.. Platinum silicide permeation layer device with microlocaions. USP2005016838053.
  24. Ellis,Thomas S.; Novak,Glen E.; Myers,Bruce A.; Brandenburg,Scott D.; Tsai,Jeenhuei S.. Polymer encapsulated electrical devices. USP2008047352070.
  25. Hembree,David R.; Farnworth,Warren M.. Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material. USP2007107282806.
  26. Bulluck, John W.. Ultraviolet light curing compositions for composite repair. USP2016029248468.
  27. Bulluck,John W.; Rix,Brad A.. Ultraviolet light curing compositions for composite repair. USP2007117291656.
  28. Bulluck,John W.; Rix,Brad A.. Ultraviolet light curing compositions for composite repair. USP2007107276542.
  29. Bulluck,John W.; Rix,Brad A.. Ultraviolet light curing compositions for composite repair. USP2007117291657.
  30. Bulluck,John W.; Rix,Brad A.. Ultraviolet light curing compositions for composite repair. USP2006127144544.
  31. Hembree, David R.; Farnworth, Warren M.. Underfill and encapsulation of semiconductor assemblies with materials having differing properties. USP2009067547978.

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