$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Photopolymerizable compositions for encapsulating microelectronic devices

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B29B-013/08
  • B29C-035/08
  • C08F-004/00
  • C08J-007/06
출원번호 US-0130672 (1998-08-07)
발명자 / 주소
  • Scranton Alec B.
  • Rangarajan Bharath
  • Baikerikar Kiran K.
출원인 / 주소
  • Board of Trustees Operating Michigan State University
대리인 / 주소
    Harness, Dickey & Pierce, P.L.C.
인용정보 피인용 횟수 : 31  인용 특허 : 24

초록

A novel method for producing thick composite parts based upon photopolymerizable compositions is disclosed. Also disclosed are novel methods for encapsulation of microelectronic devices based upon novel photopolymerizable compositions. The constituents of the photopolymerizable mixture comprise a mo

대표청구항

[ We claim:] [1.] A method for encapsulating a microelectronic device, comprising:(a) placing said microelectronic device into a mold having a cavity, a place for said microelectronic device within said cavity, and at least one side allowing light to penetrate into the cavity;(b) filling said mold w

이 특허에 인용된 특허 (24)

  1. Bachmann Andrew G. (Harwinton CT) Cantor Stephen E. (Cheshire CT), Actinic radiation-curable formulation.
  2. Hull Charles W. (Arcadia CA), Apparatus for production of three-dimensional objects by stereolithography.
  3. Bachmann Andrew G. (Harwinton CT) Cantor Stephen E. (Cheshire CT), Coating method using actinic radiation-curable formulation.
  4. Drain Kieran F. (Meriden CT) Nativi Larry A. (Rocky Hill CT), Dual cure method for making a rotted electrical/mechanical device.
  5. Goff David L. (Springfield PA) Yuan Edward L. (Philadelphia PA) Proskow Stephen (Wilmington DE), Electrical device formed from polymeric heat resistant photopolymerizable composition.
  6. Pennisi Robert W. (Boca Raton FL) Gold Glenn E. (Coconut Creek FL) Juskey Frank J. (Coral Springs FL) Urbish Glenn F. (Coral Springs FL), Encapsulated electronic package.
  7. Nakata Yoshihiro,JPX ; Takigawa Yukio,JPX ; Yagi Shigeaki,JPX ; Sawatari Norio,JPX, Epoxy resin composition for encapsulating semiconductor.
  8. Noren Gerry K. (Hoffman Estates IL) Krajewski John J. (Wheeling IL) Shama Sami A. (Hoffman Estates IL) Zimmerman John M. (Hoffman Estates IL) Thompson Danny C. (Schaumburg IL) Vandeberg John T. (Barr, Free-radical curable compositions comprising vinyl ether and urethane malenate compounds.
  9. McShane Michael B. (Austin TX) Woosley Alan H. (Austin TX) Primeaux Francis (Austin TX), Method for encapsulating semiconductor devices with package bodies.
  10. Kinsman Larry D. (Boise ID), Method for packaging a semiconductor die.
  11. Otsuki ; Akira ; Nishino ; Makoto, Method of resin encapsulating electrical parts with UV curing of fire retardant resin.
  12. Primeaux William F. (Austin TX), Molded plastic package with wire protection.
  13. Goldberg Monroe B. (Huntington Station NY) Voorhis William B. (Levittown NY), Passivated and encapsulated semiconductors and method of making same.
  14. Sasaki Isao (Hiroshima JPX) Mukai Nobuhiro (Hiroshima JPX) Ige Hitoshi (Ohtake JPX), Photopolymerizable dental composition.
  15. Sasaki Isao (Hiroshima JPX) Mukai Nobuhiro (Hiroshima JPX) Ige Hitoshi (Ohtake JPX), Photopolymerizable dental composition.
  16. Sasaki Isao (Saeki JPX) Mukai Nobuhiro (Hiroshima JPX) Ige Hitoshi (Ohtake JPX), Photopolymerizable dental composition containing a hexafunctional urethane methacrylate based on isocyanuric acid.
  17. Hayase Rumiko (Kawasaki JPX) Oba Masayuki (Yokohama JPX) Kihara Naoko (Matsudo JPX) Mikogami Yukihiro (Yokohama JPX), Photosensitive composition and resin-encapsulated semiconductor device.
  18. Ohta Hideo (Tokyo JPX) Okuyama Tetsuo (Yokohama JPX) Fujieda Shinetsu (Kawasaki JPX) Kajiura Sadao (Kanagawa-ken JPX) Yoshizumi Akira (Yokohama JPX), Plastic-encapsulated semiconductor device.
  19. Goff David L. (Springfield PA) Yuan Edward L. (Philadelphia PA) Proskow Stephen (Wilmington DE), Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors.
  20. Neckers Douglas C. (Perrysburg OH) Valdes-Aguilera Oscar (Bowling Green OH) Raghuveer Krishan S. (Bartlesville OK) Watson Darrell G. (Flint MI), Production of three dimensional bodies by photopolymerization.
  21. Sagami Yosuke (Yokohama JPX) Yamamoto Akira (Yachiyo JPX) Watanabe Shoji (Otake JPX) Isobe Tomohisa (Iwakuni JPX) Funato Susumu (Otake JPX), Resin composition to seal electronic device.
  22. Ikeya Hirotoshi (Yokosuka JPX) Higashi Michiya (Kawasaki JPX), Resin encapsulation type semiconductor device by use of epoxy resin composition.
  23. Asano Eiichi,JPX ; Aoki Takayuki,JPX ; Shiobara Toshio,JPX ; Flury Peter,CHX ; Scharf Wolfgang,DEX ; Okada Tadashi,CHX, Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith.
  24. Gilmore Peter B. (Plantation FL) Thompson Kenneth R. (Sunrise FL), Shielded semiconductor device package.

이 특허를 인용한 특허 (31)

  1. Havens, John R.; Onofrey, Thomas J.; Greef, Charles H.; Kevorkian, Gregory J.; Krotz, Jain; Lykstad, Kristie L.; Raymond, Daniel E.; Reese, Howard R.; Rooney, Regina; Scott, John J., Biomolecular attachment sites on microelectronic arrays and methods thereof.
  2. Light, II, James P.; Nguyen, Kenny V., Compositions and methods for preserving permeation layers for use on active electronic matrix devices.
  3. Ishigaki, Toshimasa; Sonoda, Daisuke; Ide, Tatsuya; Ishizaki, Koji; Watanabe, Yoshihiro; Kurasawa, Hayato; Ikeda, Masanobu, Display device and manufacturing method thereof.
  4. Ishigaki, Toshimasa; Sonoda, Daisuke; Ide, Tatsuya; Ishizaki, Koji; Watanabe, Yoshihiro; Kurasawa, Hayato; Ikeda, Masanobu, Display device and manufacturing method thereof.
  5. Liu, Lung-Chang; Chung, Ming-Hua; Chen, Jen-Hao, Encapsulant composition and method for fabricating encapsulant material.
  6. Liu, Lung-Chang; Chung, Ming-Hua; Hsu, Tsung-Ju; Chang, Chih-Fen; Chen, Jen-Hao, Encapsulant compositions and method for fabricating encapsulant materials.
  7. Shin, Kyungjae; Kim, Kiwoong, Integrated silicone for protecting electronic devices, circuit module using the same and manufacturing method of circuit module.
  8. Thompson, D. Scott; Boardman, Larry D.; Leatherdale, Catherine A., Light emitting device with multilayer silicon-containing encapsulant.
  9. Krotz, Jainamma; Smolko, Daniel; Reese, Howard R.; Onofrey, Thomas J.; Wang, Daguang; Winger, Theodore M.; Havens, John R., Mesoporous permeation layers for use on active electronic matrix devices.
  10. Krotz, Jainamma; Smolko, Daniel; Reese, Howard R.; Onofrey, Thomas J.; Wang, Daguang; Winger, Theodore M.; Havens, John R., Mesoporous permeation layers for use on active electronic matrix devices.
  11. Krotz,Jainamma; Smolko,Daniel J.; Reese,Howard R.; Onofrey,Thomas J.; Wang,Daguang; Winger,Theodore M.; Havens,John R., Mesoporous permeation layers for use on active electronic matrix devices.
  12. Thompson, D. Scott; Boardman, Larry D.; Leatherdale, Catherine A., Method of making a light emitting device having a molded encapsulant.
  13. Thompson, D. Scott; Boardman, Larry D.; Leatherdale, Catherine A., Method of making a light emitting device having a molded encapsulant.
  14. Thompson, D. Scott; Leatherdale, Catherine A.; Boardman, Larry D.; Ouderkirk, Andrew J.; Kecman, Fedja, Method of making light emitting device having a molded encapsulant.
  15. Thompson, D. Scott; Boardman, Larry D.; Leatherdale, Catherine A., Method of making light emitting device with multilayer silicon-containing encapsulant.
  16. Boardman,Larry D.; Thompson,D. Scott; Leatherdale,Catherine A., Method of making light emitting device with silicon-containing encapsulant.
  17. Boardman,Larry D.; Thompson,D. Scott; Leatherdale,Catherine A.; Ouderkirk,Andrew J., Method of making light emitting device with silicon-containing encapsulant.
  18. Karmaker, Ajit; Karlak, Mike; Jia, Weitao, Method of manufacturing high strength dental restorations.
  19. John, Havens R.; Smolko, Dan; Krotz, Jain; Scott, John J., Methods for molding and grafting highly uniform polymer layers onto electronic microchips.
  20. Wood, Alan G.; Farnworth, Warren M.; Watkins, Charles M.; Benson, Peter A., Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material.
  21. Wood,Alan G.; Farnworth,Warren M.; Watkins,Charles M.; Benson,Peter A., Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials.
  22. Wood,Alan G.; Farnworth,Warren M.; Watkins,Charles M.; Benson,Peter A., Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same.
  23. John, Havens R.; Winger, Theodore M.; Krotz, Jain; Dan, Smolko; Onofrey, Thomas J., Platinum silicide permeation layer device with microlocaions.
  24. Ellis,Thomas S.; Novak,Glen E.; Myers,Bruce A.; Brandenburg,Scott D.; Tsai,Jeenhuei S., Polymer encapsulated electrical devices.
  25. Hembree,David R.; Farnworth,Warren M., Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material.
  26. Bulluck, John W., Ultraviolet light curing compositions for composite repair.
  27. Bulluck,John W.; Rix,Brad A., Ultraviolet light curing compositions for composite repair.
  28. Bulluck,John W.; Rix,Brad A., Ultraviolet light curing compositions for composite repair.
  29. Bulluck,John W.; Rix,Brad A., Ultraviolet light curing compositions for composite repair.
  30. Bulluck,John W.; Rix,Brad A., Ultraviolet light curing compositions for composite repair.
  31. Hembree, David R.; Farnworth, Warren M., Underfill and encapsulation of semiconductor assemblies with materials having differing properties.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트