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Silicon carbide barrier layers for porous low dielectric constant materials 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H07L-023/485
  • H01L-021/4763
출원번호 US-0383753 (1999-08-26)
발명자 / 주소
  • Merchant Sailesh Mansinh
  • Misra Sudhanshu
  • Roy Pradip Kumar
출원인 / 주소
  • Lucent Technologies Inc.
인용정보 피인용 횟수 : 39  인용 특허 : 15

초록 ▼

Interconnects in porous dielectric materials are coated with a SiC-containing material to inhibit moisture penetration and retention within the dielectric material. Specifically, SiC coatings doped with boron such as SiC(BN) show particularly good results as barrier layers for dielectric interconnec

대표청구항 ▼

[ What is claimed is:] [1.] A semiconductor comprising:a substrate having a conductor;a dielectric formed on the substrate, said dielectric made from a porous material having a via extending through the dielectric and exposing a surface of the conductor;a silicon carbide-containing coating deposited

이 특허에 인용된 특허 (15)

  1. Morimoto Kiyoshi (Mobara JPX) Takagi Toshinori (Nagaokakyo JPX), Boron nitride film and process for preparing same.
    상세보기
  2. Hayakawa Yukihiro (Atsugi JPX) Kawasumi Yasushi (Fujisawa JPX) Makino Kenji (Yokohama JPX) Kataoka Yuzo (Atsugi JPX), Chemical vapor deposition method.
    상세보기
  3. Metter Robert Howard ; Hathcock Joseph David ; Winsek Peter M., High purity carbon/carbon composite useful as a crucible susceptor.
    상세보기
  4. Lu Jiong-Ping ; Jin Changming, Integrated circuit dielectric and method.
    상세보기
  5. Lee Jean Ling ; Ma Yi ; Merchant Sailesh Mansinh, Integrated circuit fabrication.
    상세보기
  6. Harris Christopher (Sollentuna SEX) Konstantinov Andrei (Linkoping SEX) Janzen Erik (Borensberg SEX), Method for producing a semiconductor device having a semiconductor layer of SiC comprising a masking step.
    상세보기
  7. Hong Qi-Zhong ; Hsu Wei-Yung ; Jeng Shin-puu, Method for producing barrier-less plug structures.
    상세보기
  8. Johnson D. Lynn (Wilmette IL) Jennings Hamlin M. (Wilmette IL) Spotz Mark S. (Chicago IL) Skamser Daniel J. (Northbrook IL), Method of making chemical vapor infiltrated composites.
    상세보기
  9. Suzuki Shogo (Yamato JPX), Method of manufacturing composite ceramics of silicon nitride and zirconia.
    상세보기
  10. Bates Carl H. (Worcester MA), Non-porous diffusion furnace components.
    상세보기
  11. Parrillo Louis C. (Austin TX) Klein Jeffrey L. (Austin TX), Process for fabricating a semiconductor device having an improved metal interconnect structure.
    상세보기
  12. Gelatos Avgerinos V. (Austin TX) Fiordalice Robert W. (Austin TX), Process for forming copper interconnect structure.
    상세보기
  13. French James E., Process for production of low dielectric ceramic composites.
    상세보기
  14. French James E., Process for production of low dielectric ceramic composites.
    상세보기
  15. Wong Lawrence D. ; Banerjee Indrajit ; Towie Steven, Unique .alpha.-C:N:H/.alpha.-C:N.sub.x film liner/barrier to prevent fluorine outdiffusion from .alpha.-FC chemical vapo.
    상세보기

이 특허를 인용한 특허 (39)

  1. Dimeo, Jr., Frank; Chen, Philip S. H.; Neuner, Jeffrey W.; Welch, James; Stawasz, Michele; Baum, Thomas H.; King, Mackenzie E.; Chen, Ing-Shin; Roeder, Jeffrey F., Apparatus and process for sensing fluoro species in semiconductor processing systems.
    상세보기
  2. Dimeo, Jr.,Frank; Chen,Philip S. H.; Neuner,Jeffrey W.; Welch,James; Stawacz,Michele; Baum,Thomas H.; King,Mackenzie E.; Chen,Ing Shin; Roeder,Jeffrey F., Apparatus and process for sensing fluoro species in semiconductor processing systems.
    상세보기
  3. Dimeo, Jr.,Frank; Chen,Philip S. H.; Neuner,Jeffrey W.; Welch,James; Stawasz,Michele; Baum,Thomas H.; King,Mackenzie E.; Chen,Ing Shin; Roeder,Jeffrey F., Apparatus and process for sensing fluoro species in semiconductor processing systems.
    상세보기
  4. Yu,Yongsik; Gupta,Atul; Billington,Karen; Carris,Michael; Crew,William; Mountsier,Thomas W., Boron-doped SIC copper diffusion barrier films.
    상세보기
  5. Huang, Richard J.; Wang, Pin-Chin C.; Erb, Darrell M., Continuous barrier for interconnect structure formed in porous dielectric material with minimized electromigration.
    상세보기
  6. Varadarajan, Bhadri N.; Gong, Bo; Yuan, Guangbi; Gui, Zhe; Lai, Fengyuan, Densification of silicon carbide film using remote plasma treatment.
    상세보기
  7. Yu, Yongsik; Subramonium, Pramod; Fang, Zhiyuan; Henri, Jon; Apen, Elizabeth; Vitkavage, Dan, Diffusion barrier and etch stop films.
    상세보기
  8. Yu,Yongsik; Billington,Karen; Hepburn,Robert; Carris,Michael; Crew,William, Film for copper diffusion barrier.
    상세보기
  9. Rangarajan, Vishwanathan; Antonelli, George Andrew; Banerji, Ananda; Van Schravendijk, Bart, Hardmask materials.
    상세보기
  10. Rangarajan, Vishwanathan; Antonelli, George Andrew; Banerji, Ananda; van Schravendijk, Bart, Hardmask materials.
    상세보기
  11. Fu, Haiying; Wong, Ka Shun; Tang, Xingyuan; Huang, Judy Hsiu-Chih; van Schravendijk, Bart Jan, Hermetic silicon carbide.
    상세보기
  12. Yu, Yongsik; Billington, Karen; Tang, Xingyuan; Fu, Haiying; Carris, Michael; Crew, William, Low-K SiC copper diffusion barrier films.
    상세보기
  13. Yu,Yongsik; Gupta,Atul; Billington,Karen; Carris,Michael; Crew,William; Mountsier,Thomas W., Low-k B-doped SiC copper diffusion barrier films.
    상세보기
  14. Yu, Yongsik; Billington, Karen; Tang, Xingyuan; Fu, Haiying; Carris, Michael; Crew, William, Low-k SiC copper diffusion barrier films.
    상세보기
  15. Yu,Yongsik; Billington,Karen; Tang,Xingyuan; Fu,Haiying; Carris,Michael; Crew,William, Low-k SiC copper diffusion barrier films.
    상세보기
  16. Yu, Yongsik; Gupta, Atul; Billington, Karen; Carris, Michael; Crew, William; Mountsier, Thomas W., Low-k b-doped SiC copper diffusion barrier films.
    상세보기
  17. Fei Wang ; Lynne A. Okada ; Ramkumar Subramanian ; Calvin T. Gabriel, Method for making a slot via filled dual damascene low k interconnect structure without middle stop layer.
    상세보기
  18. Wei,Jun; Wong,Stephen Chee Khuen; Wu,Yongling; Ng,Fern Lan, Method of fabricating microelectromechanical system structures.
    상세보기
  19. Wei,Jun; Wong,Stephen Chee Khuen; Wu,Yongling; Ng,Fern Lan, Method of fabricating microelectromechanical system structures.
    상세보기
  20. Varadarajan, Bhadri N., Method to obtain SiC class of films of desired composition and film properties.
    상세보기
  21. Chattopadhyay, Kaushik; Fox, Keith; Mountsier, Tom; Wu, Hui-Jung; van Schravendijk, Bart; Branshaw, Kimberly, Methods for reducing UV and dielectric diffusion barrier interaction.
    상세보기
  22. Chen, Ling; Ganguli, Seshadri; Cao, Wei; Marcadal, Christophe, Multi-step barrier deposition method.
    상세보기
  23. Dimeo, Jr.,Frank; Chen,Philip S. H.; Chen,Ing Shin; Neuner,Jeffrey W.; Welch,James, Nickel-coated free-standing silicon carbide structure for sensing fluoro or halogen species in semiconductor processing systems, and processes of making and using same.
    상세보기
  24. Sun, Shi-Chung; Tsai, Hao-Yi, Optimized TaCN thin film diffusion barrier for copper metallization.
    상세보기
  25. Antonelli, George Andrew; Hollister, Alice; Reddy, Sirish, Oxygen-containing ceramic hard masks and associated wet-cleans.
    상세보기
  26. Wu, Hui-Jung; Shafi, Kimberly; Chattopadhyay, Kaushik; Fox, Keith; Mountsier, Tom; Dixit, Girish; van Schravendijk, Bart; Apen, Elizabeth, Reducing UV and dielectric diffusion barrier interaction through the modulation of optical properties.
    상세보기
  27. Varadarajan, Bhadri, Remote plasma based deposition of SiOC class of films.
    상세보기
  28. Gopalraja, Praburam; Fu, Jianming; Tang, Xianmin; Forster, John C.; Kelkar, Umesh, Self-ionized and capacitively-coupled plasma for sputtering and resputtering.
    상세보기
  29. Gopalraja,Praburam; Fu,Jianming; Tang,Xianmin; Forster,John C.; Kelkar,Umesh, Self-ionized and capacitively-coupled plasma for sputtering and resputtering.
    상세보기
  30. Ding, Peijun; Tao, Rong; Xu, Zheng; Lubben, Daniel C.; Rengarajan, Suraj; Miller, Michael A.; Sundarrajan, Arvind; Tang, Xianmin; Forster, John C.; Fu, Jianming; Mosely, Roderick C.; Chen, Fusen; Gopalraja, Praburam, Self-ionized and inductively-coupled plasma for sputtering and resputtering.
    상세보기
  31. Ding, Peijun; Tao, Rong; Xu, Zheng; Lubben, Daniel C.; Rengarajan, Suraj; Miller, Michael A.; Sundarrajan, Arvind; Tang, Xianmin; Forster, John C.; Fu, Jianming; Mosely, Roderick C.; Chen, Fusen; Gopalraja, Praburam, Self-ionized and inductively-coupled plasma for sputtering and resputtering.
    상세보기
  32. Ding, Peijun; Tao, Rong; Xu, Zheng; Lubben, Daniel C.; Rengarajan, Suraj; Miller, Michael A.; Sundarrajan, Arvind; Tang, Xianmin; Forster, John C.; Fu, Jianming; Mosely, Roderick C.; Chen, Fusen; Gopalraja, Praburam, Self-ionized and inductively-coupled plasma for sputtering and resputtering.
    상세보기
  33. Wang, Fei; Okada, Lynne A.; Subramanian, Ramkumar; Gabriel, Calvin T., Slot via filled dual damascene interconnect structure without middle etch stop layer.
    상세보기
  34. Yu, Yongsik; van Schravendijk, Bart J.; Shankar, Nagraj; Varadarajan, Bhadri N., Staircase encapsulation in 3D NAND fabrication.
    상세보기
  35. Wong,Lawrence D., Structural reinforcement of highly porous low k dielectric films by Cu diffusion barrier structures.
    상세보기
  36. Chen, Ling; Ganguli, Seshadri; Cao, Wei; Marcadal, Christophe, Tantalum barrier layer for copper metallization.
    상세보기
  37. Chen, Bi-Trong; Li, Lain-Jong; Jang, Syun-Ming; Ku, Shu E; Bao, Tien I.; Li, Lih-Ping, Thin interface layer to improve copper etch stop.
    상세보기
  38. Chen, Bi-Trong; Li, Lain-Jong; Jang, Syun-Ming; Ku, Shu E; Bao, Tien I.; Li, Lih-Ping, Thin interface layer to improve copper etch stop.
    상세보기
  39. You, Lu; Wang, Fei; Ngo, Minh Van, Use of sic for preventing copper contamination of dielectric layer.
    상세보기

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