초록 ▼

A microcooling device and a method for its manufacture. The microcooling device has a high heat conductivity, is designed to accommodate electronic components on its exterior surface, and has a channel structure in its interior through which a coolant fluid can flow to carry heat away from the compo

A microcooling device and a method for its manufacture. The microcooling device has a high heat conductivity, is designed to accommodate electronic components on its exterior surface, and has a channel structure in its interior through which a coolant fluid can flow to carry heat away from the components. The channel structure is formed by a base substrate provided with a plurality of recesses and a cover layer externally covering the recesses, the cover layer being made from an electrically insulating and heat-conducting material, and being such that the electronic components can be mounted directly thereon.

대표청구항 ▼

[ What is claimed is:] [1.] A method for producing a microcooling device having an interior channel structure therein through which a coolant can flow, said method comprising forming channel-like recesses in a face of a base substrate, and thereafter sealingly covering said recesses by vapor deposit

[ What is claimed is:] [1.] A method for producing a microcooling device having an interior channel structure therein through which a coolant can flow, said method comprising forming channel-like recesses in a face of a base substrate, and thereafter sealingly covering said recesses by vapor depositing a cover layer over said recesses to form channels of the channel structure; said recesses prior to application of the cover layer having a ratio of depth to maximum clear width of at least 0.5; and said cover layer being made of an electrically insulating and heat-conducting material which preferentially grows three-dimensionally when vapor deposited.