초록 ▼

The present invention provides a multilayered wafer 10 such as an SOI wafer having a novel implanted layer. This implanted layer is removable and provides a resulting wafer having a substantially uniform surface. The wafer includes a bulk substrate 11 and an insulating layer 13 formed overlying the

The present invention provides a multilayered wafer 10 such as an SOI wafer having a novel implanted layer. This implanted layer is removable and provides a resulting wafer having a substantially uniform surface. The wafer includes a bulk substrate 11 and an insulating layer 13 formed overlying the bulk substrate 15. A film of semiconductor material is formed overlying the insulating layer. Surface non-uniformities are formed overlying and in the film of semiconductor material. The non-uniformities are implanted, and are bordered by a substantially uniform interface 17 at a selected depth underlying the surface non-uniformities. The substantially uniform interface provides a substantially uniform resulting surface for the SOI wafer.

대표청구항 ▼

[ What is claimed is:] [1.] A method for fabricating a substrate, said method comprising steps of:providing a substrate comprising a thickness of material having a non-uniform surface, said thickness of material being implant damaged and having a substantially planar interface region at a selected d

[ What is claimed is:] [1.] A method for fabricating a substrate, said method comprising steps of:providing a substrate comprising a thickness of material having a non-uniform surface, said thickness of material being implant damaged and having a substantially planar interface region at a selected depth underying said non-uniform surface;converting said implant damaged thickness of material that is at a lower density up to said substantially planar interface region into an insulating material; andselectively removing said insulating material from said substrate using at least an etching process to expose said substantially uniform interface region to provide a substantially uniform surface;wherein said separation process is provided by a Smart Cut.TM. process or controlled cleaving process.