초록 ▼

The present invention provides a microwave curable adhesive comprising a polymer composition (e.g., a thermoplastic or thermoset polymer) and first and second microwave susceptible components. The first and second microwave susceptible components have a respective preselected size, preselected shape

The present invention provides a microwave curable adhesive comprising a polymer composition (e.g., a thermoplastic or thermoset polymer) and first and second microwave susceptible components. The first and second microwave susceptible components have a respective preselected size, preselected shape or preselected conductivity or combination thereof. These properties are selected to provide a multi-modal distribution of first and second microwave susceptible components and to increase microwave adsorption within said polymer composition.

대표청구항 ▼

[ That which is claimed:] [1.] A microwave curable adhesive comprising a polymer composition and a mixture of first and second microwave susceptible components, said first microwave susceptible component having a first preselected property selected from the group consisting of size, shape or conduct

[ That which is claimed:] [1.] A microwave curable adhesive comprising a polymer composition and a mixture of first and second microwave susceptible components, said first microwave susceptible component having a first preselected property selected from the group consisting of size, shape or conductivity or combination thereof, and said second microwave susceptible component having a second preselected property selected from the group consisting of size, shape or conductivity or combination thereof, said preselected first and second properties providing a multi-modal distribution of the first and second microwave susceptible components to increase microwave absorption within said polymer composition.