초록 ▼

Supply means 6,7 for supplying a liquid heat transfer medium 21 against a side of a substrate with N-type semiconductor layers and P-type semiconductor layers supported thereon, said side being opposite to a semiconductor-layer-supporting side of the substrate, is arranged so that the liquid heat tr

Supply means 6,7 for supplying a liquid heat transfer medium 21 against a side of a substrate with N-type semiconductor layers and P-type semiconductor layers supported thereon, said side being opposite to a semiconductor-layer-supporting side of the substrate, is arranged so that the liquid heat transfer medium 21 strikes against the opposite side of the substrate.

대표청구항 ▼

[ What is claimed is:] [1.] A thermoelectric apparatus comprising:a group of thermoelectric elements having N-type semiconductor layers and P-type semiconductor layers,a heat-absorbing-side substrate arranged in contact with a side of said group of thermoelectric elements,a heat-dissipating-side sub

[ What is claimed is:] [1.] A thermoelectric apparatus comprising:a group of thermoelectric elements having N-type semiconductor layers and P-type semiconductor layers,a heat-absorbing-side substrate arranged in contact with a side of said group of thermoelectric elements,a heat-dissipating-side substrate arranged in contact with an opposite side of said group of thermoelectric elements and having a thickness smaller than said heat-absorbing-side substrate,a cover member having a space there inside and provided along a periphery thereof with a peripheral wall, said peripheral wall being closed on an end thereof and being open on an opposite end thereof to define an opening, anda distributing member provided with a number of spouting nozzles;wherein said opening of said cover member is closed by said heat-dissipating-side substrate,said distributing member is arranged inside said peripheral wall of said cover member, whereby said space of said cover member is divided by said distributing member into a flattened first space and a flattened second space and said first space and said second space are communicated with each other via said spouting nozzles of said distributing member; anda liquid heat transfer medium which has been supplied into said first space is allowed to spread within said first space, is distributed to said individual spouting nozzles and is then spouted toward a surface of said heat-dissipating-side substrate, said surface being on a side opposite to a surface of said heat-dissipating-side substrate where said heat-dissipating-side substrate is maintained in contact with said group of thermoelectric elements, and said liquid heat transfer medium which has struck against said opposite surface is allowed to spread within said second space.