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Joined articles, corrosion-resistant joining materials and process for producing joined articles 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C04B-037/02
  • B23K-035/28
  • B32B-015/04
출원번호 US-0594655 (1996-02-02)
우선권정보 JP-0024835 (1996-01-19)
발명자 / 주소
  • Fujii Tomoyuki,JPX
  • Ushikoshi Ryusuke,JPX
출원인 / 주소
  • NGK Insulators, Ltd., JPX
대리인 / 주소
    Parkhurst & Wendel, L.L.P.
인용정보 피인용 횟수 : 12  인용 특허 : 15

초록

A joined article is constituted by a first member made of aluminum nitride joined to each other through a joining layer, wherein a second member is made of a material selected from a ceramic material or a metal, and the joining layer involves a continuous phase made of a metal selected from the grou

대표청구항

[ What is claimed is:] [2.] A joined article comprisinga first member made of aluminum nitride, anda second member made of nickel, said first and second members being joined to each other through a joining layer, wherein said joining layer comprises aluminum as a main component, 1 to 12 weight % sil

이 특허에 인용된 특허 (15)

  1. Iyogi Kiyoshi (Kawasaki JPX) Nakahashi Masako (Tokyo JPX) Takeda Hiromitsu (Tokyo JPX) Shirokane Makoto (Tokyo JPX), Brazing paste for bonding metal and ceramic.
  2. Yoshida Hideaki (Saitama JPX) Toriumi Makoto (Saitama JPX) Tanaka Hirokazu (Saitama JPX) Umezawa Masao (Saitama JPX) Yuzawa Michio (Saitama JPX) Kuromitsu Yoshirou (Saitama JPX), Ceramic substrate used for fabricating electric or electronic circuit.
  3. Cheung David W. (Foster City CA) Fodor Mark A. (Los Gatos CA) Lane Christopher (Sunnyvale CA) Mortensen Harold H. (Carlsbad CA), Ceramic susceptor with embedded metal electrode and eutectic connection.
  4. Mizuhara Howard (Hillsborough CA), Ductile aluminum based brazing foil containing reactive metals and copper.
  5. Mizuhara Howard (Hillsborough CA), Ductile brazing alloy of copper-nickel-silicon-titanium.
  6. Mizuhara Howard (Hillsborough CA), Ductile titanium-copper brazing alloy.
  7. Smith Peter C. (Burlingame CA), Electrostatic chuck.
  8. Nagase Toshiyuki (Omiya JPX) Kanda Yoshio (Omiya JPX) Kuromitu Yoshiro (Omiya JPX) Hatsushika Masafumi (Omiya JPX) Tanaka Hirokazu (Omiya JPX), Highly heat-radiating ceramic package.
  9. Do-Thoi Tha (Rthenbach/Pegnitz DEX) Meier Gerd (Leinburg DEX) Popp Klaus (Kalchreuth-Rckenhof DEX) Stingl Peter (Lauf DEX), Internal soldering in metal/ceramic composites.
  10. Fushii Yasuhito (Omuta JPX) Nakamura Miyuki (Omuta JPX) Nakajima Yukihiko (Omuta JPX) Kato Kazuo (Machida JPX) Miyai Akira (Machida JPX) Hiruta Kazuyuki (Machida JPX), Method for forming a ceramic circuit board.
  11. Nakahashi Masako (Kawasaki JPX) Shirokane Makoto (Tokyo JPX) Yamazaki Tatsuo (Tokyo JPX) Yoshino Hisashi (Yokohama JPX) Hori Akio (Kawasaki JPX) Takeda Hiromitsu (Tokyo JPX), Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same.
  12. Moorhead Arthur J. (Knoxville TN), Oxidation resistant filler metals for direct brazing of structural ceramics.
  13. Miyahara Kenichiro (Tokuyama JPX), Package for semiconductor device.
  14. Yamamoto Akihiko (Ibaraki JPX) Kohno Akiomi (Ibaraki JPX) Yamada Toshihiri (Ibaraki JPX) Satou Motohiro (Ibaraki JPX) Taguchi Keiji (Ibaraki JPX) Yokoi Kazuaki (Ibaraki JPX), Sealing structure, method of soldering and process for preparing sealing structure.
  15. Glaeser Andreas M. (Berkeley CA), Transient liquid phase ceramic bonding.

이 특허를 인용한 특허 (12)

  1. Elliot, Alfred Grant; Elliot, Brent Donald Alfred; Balma, Frank; Schuster, Richard Erich; Rex, Dennis George; Veytser, Alexander, High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using same.
  2. Fujii, Tomoyuki, Joined article of a supporting member for a semiconductor wafer and a method of producing the same.
  3. Elliot, Alfred Grant; Elliot, Brent Donald Alfred; Balma, Frank; Schuster, Richard Erich; Rex, Dennis George; Veytser, Alexander, Method for manufacture of a multi-layer plate device.
  4. Fujii,Tomoyuki; Imai,Yasuyoshi; Kawajiri,Tetsuya, Method of fabricating substrate placing stage.
  5. Sato, Mitsuru; Yamamoto, Takatoshi, Method of forming bonded body and bonded body.
  6. Sato, Mitsuru; Yamamoto, Takatoshi, Method of forming bonded body and bonded body.
  7. Kumar, Sundeep; Calla, Eklavya; Rahmane, Mohamed, Methods for joining ceramic and metallic structures.
  8. Elliot, Alfred Grant; Elliot, Brent Donald Alfred; Balma, Frank; Schuster, Richard Erich; Rex, Dennis George; Veytser, Alexander, Multi-layer plate device.
  9. Goto, Takayuki; Utsumi, Jun; Ide, Kensuke; Takagi, Hideki; Funayama, Masahiro, Room temperature bonding using sputtering.
  10. Goto, Takayuki; Utsumi, Jun; Ide, Kensuke; Takagi, Hideki; Funayama, Masahiro, Room-temperature bonding method and room-temperature bonding apparatus including sputtering.
  11. Lee, Wonhaeng; Ha, Kang Rae, Supporting unit and substrate treating apparatus including the same.
  12. Barnes, John E., System, method, and apparatus for metallic-composite joint with compliant, non-corrosive interface.
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