초록 ▼

A magnetoresistive sensor fabricated by creating first antiferromagnetic layers on the upper surfaces of a lower-gap layer the antiferromagnetic layer having first and second exposed portions separated by a track width formed by the upper surface of the lower-gap layer. Then, a free magnetic layer,

A magnetoresistive sensor fabricated by creating first antiferromagnetic layers on the upper surfaces of a lower-gap layer the antiferromagnetic layer having first and second exposed portions separated by a track width formed by the upper surface of the lower-gap layer. Then, a free magnetic layer, a nonmagnetic electrically conductive layer, a pinned magnetic layer and a second antiferromagnetic layer are stacked on the first antiferromagnetic layers and a portion on the track width one after another. Since the free magnetic layer is created after the first antiferromagnetic layer, the free magnetic layer and the first antiferromagnetic layer are adhered to each other with a high degree of reliability. When the direction of magnetization in the free magnetic layer is changed by an external magnetic field, the electrical resistance of the magnetoresistive sensor also changes. The change in electrical resistance is, in turn, used for detecting the external magnetic field. Since the first antiferromagnetic layers put the free magnetic layer in a single-domain state in the X direction, the amount of Barkhausen noise can be reduced.

대표청구항 ▼

[ What is claimed is:] [1.] A method of manufacturing a magnetoresistive sensor, comprising:forming a resist layer corresponding to a width of a track overlying an upper surface of a lower-gap layer, wherein the lower-gap layer is an insulating material and forming first and second portions in which

[ What is claimed is:] [1.] A method of manufacturing a magnetoresistive sensor, comprising:forming a resist layer corresponding to a width of a track overlying an upper surface of a lower-gap layer, wherein the lower-gap layer is an insulating material and forming first and second portions in which the upper surface of the lower-gap layer is exposed on both sides of the resist layer;removing by etching a surface portion of the first and second portions of the lower-gap layer thereby forming first and second recessed portions;removing the resist layer thereby forming an exposed section above the upper surface of the lower-gap layer;forming an antiferromagnetic layer in the first and second recessed portions of the lower-gap layer such that the antiferromagnetic layer includes first and second portions separated by the exposed section of the upper surface of the lower-gap layer;forming a free magnetic layer over the first and second portions of the antiferromagnetic layer and over the exposed section of the lower-gap layer, a direction of magnetization of the free magnetic layer being oriented through exchange anisotropic coupling with the first and second portions of the first antiferromagnetic layer;forming a nonmagnetic electrically conductive layer on an upper surface of the free magnetic layer;forming a pinned magnetic layer on an upper surface of the nonmagnetic electrically conductive layer; andforming a pinning layer on an upper surface of the pinned magnetic layer, wherein a direction of magnetization of the pinned magnetic layer is pinned through exchange anisotropic coupling with the pinning layer such that the pinned direction of magnetization crosses the orientated direction of magnetization of the free magnetic layer.