초록 ▼

A deposit film forming apparatus is characterized in that a temperature control member for controlling the temperature of a wall of deposition chamber is in contact with an outer wall of a deposition chamber through a heat conductivity adjusting plate, which can prevent overcooling while suppressing

A deposit film forming apparatus is characterized in that a temperature control member for controlling the temperature of a wall of deposition chamber is in contact with an outer wall of a deposition chamber through a heat conductivity adjusting plate, which can prevent overcooling while suppressing an increase in the temperature of the wall of deposition chamber during film formation and which can maintain the temperature of the wall of deposition chamber at a preferable temperature for deposition of film for a long time, thereby forming a deposit film. As a result, the apparatus can mass-produce deposit films of stable quality, especially, large-area and good-quality photovoltaic elements utilizing amorphous semiconductors, over a long period.

대표청구항 ▼

[ What is claimed is:] [1.] A deposit film forming apparatus comprising a temperature control member, for controlling a temperature of awall of a deposition chamber, in contact with an outer wall of said deposition chamber through a heat conductivity adjusting plate wherein said heat conductivity ad

[ What is claimed is:] [1.] A deposit film forming apparatus comprising a temperature control member, for controlling a temperature of awall of a deposition chamber, in contact with an outer wall of said deposition chamber through a heat conductivity adjusting plate wherein said heat conductivity adjusting plate establishes a temperature difference between said outer wall and said temperature control member, is provided interchangeably, and is treated by a process selected from the group consisting of mirror finish, drilling or knurling.