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Thermal transfer element for forming multilayer devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G03F-007/34
  • G03F-070/95
  • G03F-007/09
출원번호 US-0231723 (1999-01-15)
발명자 / 주소
  • Wolk Martin B.
  • Baude Paul F.
  • Florczak Jeffrey M.
  • McCormick Fred B.
  • Hsu Yong
출원인 / 주소
  • 3M Innovative Properties Company
대리인 / 주소
    Pechman
인용정보 피인용 횟수 : 150  인용 특허 : 43

초록

A thermal transfer element for forming a multilayer device may include a substrate and a multicomponent transfer unit that, when transferred to a receptor, is configured and arranged to form a first operational layer and a second operational layer of a multilayer device. In at least some instances,

대표청구항

[ We claim:] [1.] A thermal transfer element comprising:a substrate; anda multicomponent transfer unit that, when transferred to a receptor, is configured and arranged to form a first operational layer and a second operational layer of a multilayer device, wherein the first operational layer is conf

이 특허에 인용된 특허 (43)

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