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An inexpensive low contact resistance electrical bonding interconnect having a metal bond pad portion and conductive epoxy portion. The conductive epoxy portion comprises a metal oxide reducing agent for reducing oxides formed before and/or during the fabrication of the bonding interconnect. The bon

An inexpensive low contact resistance electrical bonding interconnect having a metal bond pad portion and conductive epoxy portion. The conductive epoxy portion comprises a metal oxide reducing agent for reducing oxides formed before and/or during the fabrication of the bonding interconnect. The bonding interconnect is used to bond a die pad to a supporting substrate thereby forming a surface mount device.

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[ What is claimed is:] [1.] A method of forming an electrical bonding interconnect to a substrate, comprising:providing an electrically conductive metal contact area on a substrate;oxidizing the metal of the metal contact area to form a metal oxide material;applying an electrically conductive epoxy

[ What is claimed is:] [1.] A method of forming an electrical bonding interconnect to a substrate, comprising:providing an electrically conductive metal contact area on a substrate;oxidizing the metal of the metal contact area to form a metal oxide material;applying an electrically conductive epoxy in physical contact with the metal oxide material, the epoxy comprising a reducing agent;reducing the metal oxide material back to conductive metal using the reducing agent present in the conductive epoxy; andcuring the conductive epoxy into a conductive hardened material to form a conductive interconnect between the epoxy and contact area.