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Connecting board

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-009/00
출원번호 US-0313070 (1999-05-17)
우선권정보 JP-0082033 (1997-03-13)
발명자 / 주소
  • Yamasaki Kozo,JPX
  • Saiki Hajime,JPX
출원인 / 주소
  • NGK Spark Plug Co., Ltd., JPX
대리인 / 주소
    Foley & Lardner
인용정보 피인용 횟수 : 6  인용 특허 : 22

초록

A connecting board for electrically and mechanically connecting a base plate such as a circuit board having disposed thereon an IC chip to a mounting board such as a motherboard. The connecting board includes a substrate having a plurality of through holes, a plurality of soft metal bodies which are

대표청구항

[ What is claimed is:] [1.] A method of making a connecting board to be disposed between a base plate having a plurality of surface-bonding pads and a mounting board having a plurality of surface-bonding and mounting pads at corresponding positions to the surface-bonding and mounting pads of the bas

이 특허에 인용된 특허 (22)

  1. Swamy Deepak N. (Austin TX), Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards.
  2. Swamy Deepak N. (Austin TX), Anisotropic interconnect methodology for cost effective manufacture of high density printed wiring boards.
  3. Arnio Barbara E. (Middletown CT) Burdick Lynn E. (Hampton CT) Owens Mark J. (Vernon CT) St. Lawrence Mike (Thompson CT) Simpson Scott S. (Woodstock CT), Array connector.
  4. Credle Kenneth (Highland Park IL) Wolf Christopher G. (Beach Park IL) McConnell John (Zion IL), Ceramic substrates with highly conductive metal vias.
  5. Yoshizawa Tetsuo (Yokohama JPX) Kadokura Susumu (Sagamihara JPX), Electrical connecting member and electric circuit member.
  6. Maeda Ryu (Urawa JPX) Tateishi Akira (Hachioji JPX) Tazai Shunsuke (Fuchu JPX), Electrical connectors using anisotropic conductive films.
  7. Honn ; James J. ; Stuby ; Kenneth P., Electrical package for LSI devices and assembly process therefor.
  8. Trabucco Robert T. (Los Altos CA), Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device pa.
  9. Frankeny Richard F. (Austin TX) Hermann Karl (Austin TX) Imken Ronald L. (Round Rock TX) LaTorre Joseph (Austin TX), Manufacturing process of a high density substrate design.
  10. Angulas Christopher G. (Endicott NY) Flynn Patrick T. (Owego NY) Funari Joseph (Vestal NY) Kindl Thomas E. (Endwell NY) Orr Randy L. (Vestal NY), Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using differe.
  11. Yamashita Chikara (Tokyo JPX), Method for manufacturing a sheet formed connector for inspection of an integrated circuit.
  12. Gerber Joel A. (St. Paul MN) Gits Peter A. (White Bear Lake MN), Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board.
  13. Angulas Christopher G. (Endicott) Flynn Patrick T. (Owego) Funari Joseph (Vestal) Kindl Thomas E. (Endwell) Orr Randy L. (Vesal NY), Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different.
  14. Madou Marc J. (Palo Alto CA) Gaisford Scott (Hundvag NOX), Method of forming a plurality of solder connections.
  15. Rai Akiteru (Osaka JPX) Yamamura Keiji (Nara JPX) Nukii Takashi (Nara JPX), Method of making a hybrid semiconductor device.
  16. Tanaka Yasuyuki (Tsuchiura JPX) Oomachi Chikafumi (Kashiwa JPX), Method of manufacture of multilayer circuit board.
  17. Osaka Takaaki (Tokyo JPX) Matsui Norio (Tokyo JPX) Susaki Shinichi (Iruma JPX) Egawa Yutaka (Tokyo JPX), Method of manufacturing an interboard connection terminal.
  18. Ameen Joseph George ; Funari Joseph, Multi-layer-multi-chip pyramid and circuit board structure and method of forming same.
  19. Imamura Hitomi (Kokubu JPX) Matsuda Shin (Kokubu JPX) Ito Nobuyuki (Kokubu JPX) Kawabata Kazuhiro (Kokubu JPX), Package for housing semiconductor elements.
  20. Boyko Christina M. (Conklin NY) Bucek Francis J. (Binghamton NY) Carpenter Richard W. (Johnson City NY) Markovich Voya R. (Endwell NY) Mayo Darleen (Knightdale NC) Reidsema Cindy M. (Austin TX) Sabia, Printed circuit board with aligned connections and method of making same.
  21. Behun John R. (Poughkeepsie NY) Miller William R. (Poughkeepsie NY) Newman Bert H. (Carmel NY) Yankowski Edward L. (Hyde Park NY), Process of fabricating a circuit package.
  22. Kubo Masao (Kadoma JPX) Kamada Kazuo (Kadoma JPX) Ogasawara Masanobu (Kadoma JPX) Nakamura Yoshimitsu (Kadoma JPX), Terminal-carrying circuit board.

이 특허를 인용한 특허 (6)

  1. Jiang, Hongjin; Nallani, Arun Kumar C.; Sidhu, Rajen S.; Dudek, Martha A.; Tang, Weihua, Hybrid solder and filled paste in microelectronic packaging.
  2. Kang, Myung-Sam; Park, Keon-Yang; Kang, Jang-Kyu, Method for preparing high performance ball grid array board and jig applicable to said method.
  3. Saito, Yuji; Fukuzawa, Kozo, Method of mounting a BGA.
  4. Kubota, Takashi; Kitajima, Masayuki; Yamakami, Takatoyo; Kira, Hidehiko, Method of mounting semiconductor element, and semiconductor device.
  5. Hino, Hirohisa; Suzuki, Yasuhiro; Mori, Masato; Ohashi, Naomichi, Mounting structure and method for producing mounting structure.
  6. Lim Chua Ah,SGX, Printed circuit boards with cavity and method of producing the same.
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