초록 ▼

A retaining ring is configured for use with an apparatus for polishing a substrate. The substrate has upper and lower faces and a perimeter. The apparatus has a movable polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retaining ring has

A retaining ring is configured for use with an apparatus for polishing a substrate. The substrate has upper and lower faces and a perimeter. The apparatus has a movable polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retaining ring has a retaining face for engaging and retaining the substrate against lateral movement and a bottom face for contacting the polishing surface of the polishing pad. The bottom face of the retaining ring extends downward from an inner portion adjacent the retaining face to a lowermost portion radially outboard of the retaining face.

대표청구항 ▼

[ What is claimed is:] [7.] A retaining ring for use in conjunction with an apparatus for polishing a substrate, the substrate having upper and lower faces and a lateral perimeter, the apparatus having a polishing pad with an upper polishing surface for contacting and polishing the lower face of the

[ What is claimed is:] [7.] A retaining ring for use in conjunction with an apparatus for polishing a substrate, the substrate having upper and lower faces and a lateral perimeter, the apparatus having a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate, the retaining ring comprising:an inner face for surrounding and engaging the substrate perimeter; anda bottom face extending outward from the inner face for contacting the polishing surface of the polishing pad, the bottom face of the ring having an annular downward facing convex region.