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Heat exchanger for a portable computing device and docking station 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/20
  • H05K-007/20
출원번호 US-0844801 (1997-04-22)
발명자 / 주소
  • Bhatia Rakesh
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Draeger
인용정보 피인용 횟수 : 45  인용 특허 : 31

초록

A heat exchanger for a computing device and a docking station. The heat exchanger includes a first heat transfer element and a second heat transfer element. The first heat transfer element has a portion thermally coupled to an electronic component. The first and the second heat transfer element conf

대표청구항

[ What is claimed is:] [4.] An apparatus comprising:a computing device comprising:a base containing an electronic component and having a top surface, a bottom surface, a front edge, and a rear edge that is a mating edge;a first heat transfer element having an elongated shape and a sealed end and hav

이 특허에 인용된 특허 (31)

  1. Hoedl Fritz,ATX, Accommodating device for a portable PC.
  2. Erler William F. ; O'Hagan Timothy P. ; Grzelak Keith D., Active cooling system for cradle of portable electronic devices.
  3. Haley Kevin (San Jose CA) Aghazadeh Mostafa (Chandler AZ) Xie Hong (Chandler AZ), Apparatus for dissipating heat in a hinged computing device.
  4. Kinjo Morishige (Tokyo JPX) Ohmori Akimitu (Tokyo JPX), Apparatus having a printed circuit board assembly.
  5. Hsieh Chih-Ho (Taipei TWX) Lee Ing-Jen (Hsin Tien TWX), Computer CPU heat dissipating and protecting device.
  6. Gunnerson Fred S. (Oviedo FL) Sanderlin F. Dave (Lakeland FL) Iurato Joy R. (Tampa FL) Padilla Antonio A. (Tampa FL), Controllable heat pipes for thermal energy transfer.
  7. Hisano Katsumi (Kanagawa) Sasaki Tomiya (Kanagawa) Ishizuka Masaru (Kanagawa JPX), Cooling apparatus.
  8. Kondou Yoshihiro (Ibaraki JPX) Matsushima Hitoshi (Ryugasaki JPX) Hatada Toshio (Tsuchiura JPX) Inouye Hiroshi (Ibaraki JPX) Komatsu Toshihiro (Ibaraki JPX) Ohba Takao (Hadano JPX) Yamagiwa Akira (Ha, Cooling apparatus of electronic equipment.
  9. Xie Hong (Chandler AZ) Aghazadeh Mostafa (Chandler AZ) Turturro Gregory (Chandler AZ) Chiu Chia-Pin (Chandler AZ), Dissipation of heat through keyboard using a heat pipe.
  10. Gagnon Kevin M. (1668 Larwood Rd. Lemon Grove CA 91945) Goulter Victor H. (485 Molimo Dr. San Francisco CA 94127-1655), Dual filtered airflow systems for cooling computer components, with optimally placed air vents and switchboard control p.
  11. Ohashi Shigeo (Tsuchiura JPX) Hatada Toshio (Tsuchiura JPX) Tanaka Takeo (Minori-machi JPX) Iwai Susumu (Hadano JPX), Electronic equipment and lap-top type electronic equipment.
  12. Hudson Scott A. (Cedar Falls IA), Fan shroud aspirator.
  13. Klein Dean A. (Lake City MN), Heat dissipating LCD display.
  14. Bhatia Rakesh (Sunnyvale CA) Haley Kevin (San Jose CA), Heat pipe exchanger system for cooling a hinged computing device.
  15. Tanaka Suemi (Yokohama JPX) Sotani Junji (Yokohama JPX) Nanba Kenichi (Tokyo JPX), Heat pipe type radiation for electronic apparatus.
  16. Ishida Yoshio (Osaka JPX), Heat radiating apparatus.
  17. Swindler Dan (Austin TX), Heat sink/component access door for portable computers.
  18. Kitahara Takashi (Kahoku-gun JPX) Shimanuki Tadayoshi (Kahoku-gun JPX), Heat-generating element cooling device.
  19. Baum Walter (Hanover DEX) Still Michael (Langenhagen DEX) Becker Erich (Seeheim-Jugenheim DEX), Heat-producing elements with heat pipes.
  20. Hatada Toshio (Tsuchiura) Matsushima Hitoshi (Ibaraki) Kondou Yoshihiro (Ibaraki) Inoue Hiroshi (Ibaraki) Otsuka Kanji (Higashiyamato) Shirai Yuji (Kodaira) Ohba Takao (Hadano) Yamagiwa Akira (Hadano, LSI cooling apparatus and computer cooling apparatus.
  21. Winn Ray (320 W. Carob St. Compton CA 90220), Low-powered cooling fan for dissipating heat.
  22. Kimura Hideyuki (Tsuchiura JPX) Takahashi Tsuyoshi (Odawara JPX) Suzuki Tomio (Hiratsuka JPX) Ohdaira Toshio (Odawara JPX) Uefune Kouki (Minamiashigara JPX) Nishimura Yuji (Odawara JPX), Magnetic disk storage system.
  23. Kikinis Dan (20264 Ljepava Dr. Satatoga CA 95070), Microprocessor cooling in a portable computer.
  24. Donahoe Daniel N. (13416 Jones Rd. Spring TX) Mecredy ; III Henry E. (13416 Jones Rd. Houston TX 77070), PCMCIA card heat removal apparatus and methods.
  25. Rahamim Uriel (Palo Alto CA) Minobe Randy (San Jose CA) Chahrour Ahmad A. (Santa Clara CA) Ben-Zur Raanan (Campbell CA), Packaging and cooling structure for the personal processor module.
  26. Hatada Toshio (Tsuchiura JPX) Inouye Hiroshi (Ibaraki JPX) Ohba Takao (Hadano JPX) Iwai Susumu (Hadano JPX), Packaging structure of small-sized computer.
  27. Cheng Chun-Che,TWX, Portable computer docking base with ducted interior cooling air passsage.
  28. Paulsel Jason Q. (Conroe TX) Smith Kelly K. (Spring TX) Ruch Mark H. (The Woodlands TX), Portable computer docking station with removable support shelf apparatus.
  29. Toedtman Thomas (Lake Forest CA) Welch Randall S. (Lake Forest CA), Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices.
  30. Bierschenk James L. (4805 Highgate La. Rowlett TX 75088) Howarth Richard A. (915 Spring Brook Allen TX 75002) Socolowski Norbert J. (215 Fox Hill Rd. Denville NJ 07834-2507), Thermoelectric cooler.
  31. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL), Two-phase component cooler.

이 특허를 인용한 특허 (45)

  1. Crippen, Martin Joseph; Makley, Albert Vincent; Matteson, Jason Aaron; Piazza, William Joseph, Air re-cool for electronic equipment.
  2. Mongia, Rajiv K., Apparatus and docking station for cooling of computing devices.
  3. Faneuf, Barrett M.; De Lorenzo, David S., Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system.
  4. Zimmermann, Augusto Jose Pereira; Possamai, Fabricio Caldeira; Santini, Jr., Otavio, Computer docking station.
  5. Montgomery, Stephen W.; Faneuf, Barrett M., Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component.
  6. Faneuf, Barrett M.; De Lorenzo, David S.; Montgomery, Stephen W., Computer system having a chassis-level thermal interface component and a frame-level thermal interface component that are thermally engageable with and disengageable from one another.
  7. Faneuf, Barrett M.; Holalkere, Ven R.; Montgomery, Stephen W., Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure.
  8. Pokharna, Himanshu; Distefano, Eric; Walters, Joseph D., Computer system having a refrigeration cycle utilizing an adsorber/desorber for purposes of compression.
  9. Berry, William E.; De Lorenzo, David S.; Montgomery, Stephen W.; Faneuf, Barrett M., Computer system which locks a server unit subassembly in a selected position in a support frame.
  10. Dennis R Esterberg, Cooling module for portable computer.
  11. Karr, Ben, Device bay heat exchanger for a portable computing device.
  12. Liu, Chung-Luen; Pan, Jenq-Haur; Wu, Chang-Yuan; Tu, Ching-Ya; Chen, Ching-Chung, Docking station.
  13. Patel,Chandrakant; Bash,Cullen E., Docking station cooling system including liquid-filled hollow structure.
  14. Reisfeld, Gideon, Efficient heat pumping from mobile platforms using on platform assembled heat pipe.
  15. Hattori, Masahiko; Ohnishi, Masuo; Tachikawa, Tadanori; Nishizawa, Masatoshi; Harada, Tomoki; Nakagai, Goro; Kato, Toyohiro, Electronic apparatus including removable dust catcher.
  16. May Gregory J ; Sterner John R, Electronic device having external surface thermal feedback.
  17. Marlon Cardenas, External attached heat sink fold out.
  18. Huang, Shih-Wei; Tsai, Shui-Fa, External function extension device.
  19. Mitchell Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
  20. Faneuf,Barrett M.; De Lorenzo,David S., Frame-level thermal interface component for transfer of heat from an electronic component of a computer system.
  21. Faneuf,Barrett M.; De Lorenzo,David S., Frame-level thermal interface component for transfer of heat from an electronic component of a computer system.
  22. Nagasawa, Hideo, Heat pipe docking system.
  23. Jacqu?,Bernard; Texier,Emmanuel; Cluzet,G?rard; Tjiptahardja,Tisna; Amidieu,Marcel, Heat transfer system for a satellite including an evaporator.
  24. Maruno Yasuo,JPX, Heat-transfer connector.
  25. Pokharna,Himanshu; Distefano,Eric, Increased thermal capability of portable electronic device in stationary or docked mode.
  26. Iijima, Takashi, Liquid cooling arrangement for electronic apparatus.
  27. David J. Koenen, Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink.
  28. Igarashi, Takeshi, Method of cooling system for a personal computer and personal computer.
  29. Winkler, David A.; Bowers, Morris B.; Sehmbey, Maninder S., Mobile computing device dock station with headset jack heat pipe interface.
  30. Son, Hyun Wung, Mobile terminal holder.
  31. Chesser, Jason B.; Faneuf, Barrett M.; Montgomery, Stephen W., Modular capillary pumped loop cooling system.
  32. Chesser,Jason B.; Faneuf,Barrett M.; Montgomery,Stephen W., Modular capillary pumped loop cooling system.
  33. Shih-Hsuan Wang TW; Chih-Cheng Tsen TW; Chun-Huang Lee TW, Notebook computer with exchangeable LCD unit.
  34. Kelty, Matthew James, Optical module blind mating heat relay system.
  35. Chiba,Osamu; Moriwaki,Shohei, Peripheral device and electronic device.
  36. Cupps,Bryan T.; Glass,Timothy J., Personal electronics device with display switching.
  37. Xie, Hong, Portable and plugable thermal and power solution for a notebook or handheld device.
  38. DeHoff, Robert E.; Grubb, Kevin A., Portable computer and docking station cooling.
  39. Nakanishi Tohru,JPX ; Nishio Toshihiko,JPX, Portable computer cooling method and computer holder.
  40. Liao, Reynold L.; O'Neal, Sean P., Portable computer docking station for horizontal or vertical use.
  41. Sharrah, Raymond L.; Ziegenfuss, Peter J., Portable light having a heat dissipater with an integral cooling device.
  42. Pokharna,Himanshu; DiStefano,Eric, Pumped loop cooling with remote heat exchanger and display cooling.
  43. Couto, Paulo Rogerio Carrara; Ribeiro, Guilherme Borges, Refrigeration system for compact equipment.
  44. O'Connor Michael ; Haley Kevin J., Thermal connector for joining mobile electronic devices to docking stations.
  45. Centola, Bruno; Gomez, Claude, Thermal connector for transferring heat between removable printed circuit boards.
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