초록 ▼

A process for improving the adhesion of a copper surface to a resinous layer, the process comprising contacting the copper layer with an adhesion promoting composition comprising a reducing agent and a metal selected from the group consisting of gold, silver, palladium, ruthenium, rhodium, zinc, nic

A process for improving the adhesion of a copper surface to a resinous layer, the process comprising contacting the copper layer with an adhesion promoting composition comprising a reducing agent and a metal selected from the group consisting of gold, silver, palladium, ruthenium, rhodium, zinc, nickel, cobalt, iron and alloys of the foregoing metals.

대표청구항 ▼

[ We claim:] [1.] A process for improving the adhesion of a copper surface to a resinous layer, said process comprising:a. contacting said copper surface directly with an adhesion promoting composition comprising a reducing agent and a metal selected from the group consisting of, palladium, and ruth

[ We claim:] [1.] A process for improving the adhesion of a copper surface to a resinous layer, said process comprising:a. contacting said copper surface directly with an adhesion promoting composition comprising a reducing agent and a metal selected from the group consisting of, palladium, and ruthenium, such that the adhesion promoting composition plates a layer of the metal selected from the group consisting of palladium and ruthenium directly upon the copper surface thereby creating a metal plated layer upon the copper surface; and thereafterb. adhering said metal plated layer directly to said resinous layer;wherein said process occurs without the chemical function of a copper oxide conversion coating on the copper surface prior to contacting said copper surface with the adhesion promoting composition.