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Removable liner design for plasma immersion ion implantation 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/00
  • C23C-016/458
  • C23C-014/50
  • C23C-014/34
출원번호 US-0216035 (1998-12-18)
발명자 / 주소
  • Chu Paul K.,HKX
  • Chan Chung
출원인 / 주소
  • Silicon Genesis Corporation
대리인 / 주소
    Townsend and Townsend and Crew LLP
인용정보 피인용 횟수 : 78  인용 특허 : 24

초록

A plasma treatment system (200) for implantation with a novel susceptor with a silicon coating (203). The system (200) has a variety of elements such as a chamber, which can have a silicon coating formed thereon, in which a plasma is generated in the chamber. The system (200) also has a susceptor di

대표청구항

[ What is claimed is:] [1.] A plasma treatment system for implantation, said system comprising:a vacuum chamber in which a plasma is generated in said chamber;a silicon coated susceptor disposed in said chamber to support a silicon substrate, said silicon coated susceptor providing fewer non-silicon

이 특허에 인용된 특허 (24)

  1. Chapek David LeRoy ; Felch Susan Benjamin ; Kissick Michael William ; Malik Shamim Muhammad ; Sheng Tienyu Terry, Apparatus for obtaining dose uniformity in plasma doping (PLAD) ion implantation processes.
  2. Moslehi Mehrdad M. (Los Altos CA), Direct gas-phase doping of semiconductor wafers using an organic dopant source of phosphorus.
  3. Rissman Paul (3509 Laguna Ct. Palo Alto CA 94306) Kruger James B. (164 Kelly Ave. Half Moon Bay CA 94019) Shohet J. Leon (1937 Arlington Pl. Madison WI 53705), Forming a buried insulator layer using plasma source ion implantation.
  4. Shohet Juda L. (Madison WI), Ion purification for plasma ion implantation.
  5. Goetz George G. (Ellicott City MD) Dawson Warren M. (Baltimore MD), Low temperature reaction bonding.
  6. Hasegawa Makoto (Kawasaki JPX) Saito Tsuyoshi (Tokyo JPX) Higuchi Fumihiko (Tokyo JPX) Amano Hideaki (Zama JPX) Naitoh Katsunori (Yamanashi-ken JPX) Tozawa Takashi (Yamanashi-ken JPX) Nakagome Tatsuy, Magnetron plasma processing system.
  7. Conrad John R. (Madison WI), Method and apparatus for plasma source ion implantation.
  8. Levy Karl B. (Los Altos CA), Method for forming capacitor in trench of semiconductor wafer by implantation of trench surfaces with oxygen.
  9. Sato Nobuhiko,JPX ; Yonehara Takao,JPX ; Sakaguchi Kiyofumi,JPX, Method for producing semiconductor substrate.
  10. Chan Chung (Newton MA) Allen Ryne C. (Framingham MA) Husein Imad (Boston MA) Zhou Yaunzhong (Malden MA), Method for the deposition and modification of thin films using a combination of vacuum arcs and plasma immersion ion imp.
  11. Matossian Jesse N. (Woodland Hills CA) Goebel Dan M. (Tarzana CA), Method of implanting ions from a plasma into an object.
  12. Foster Robert F. (Weston MA) Srinivas Damodaran (Tempe AZ), Method of nucleating tungsten on titanium nitride by CVD without silane.
  13. Tsai Chin-Chi (Oak Ridge TN) Gorbatkin Steven M. (Oak Ridge TN) Berry Lee A. (Oak Ridge TN), Plasma generating apparatus for large area plasma processing.
  14. Hama Kiichi (Chino JPX) Hata Jiro (Yamanashi-ken JPX) Hongoh Toshiaki (Yamanashi-ken JPX), Plasma process apparatus.
  15. Rose Peter H. (N. Conway NH), Producing ion beams suitable for ion implantation and improved ion implantation apparatus and techniques.
  16. Coultas Dennis K. (Hopewell Junction NY) Keller John H. (Poughkeepsie NY), Radio frequency induction/multipole plasma processing tool.
  17. Atherton Robert W. (1694 Miller Ave. Los Altos CA 94024), Real world modeling and control process for integrated manufacturing equipment.
  18. Moniwa Masahiro (Hachioji JPX) Miyao Masanobu (Tokorozawa JPX) Shukuri Shoji (Koganei JPX) Murakami Eiichi (Kokubunji JPX) Warabisako Terunori (Tokyo JPX) Tamura Masao (Tokorozawa JPX) Natsuaki Nobuy, SOI process for forming a thin film transistor using solid phase epitaxy.
  19. Nakato Tatsuo (Vancouver WA) Meyyappan Narayanan (Woburn MA), Shallow SIMOX processing method using molecular ion implantation.
  20. Wittkower Andrew B. (Rockport MA), Simox materials through energy variation.
  21. Katsura Toshihiko (Yokohama JPX) Abe Masahiro (Yokohama JPX), Sputtering device.
  22. Glavish Hilton F. (Incline Village NV), System and method for producing oscillating magnetic fields in working gaps useful for irradiating a surface with atomic.
  23. Chan Chung (8 Pontiac Rd. Newton MA 02168), System for the plasma treatment of large area substrates.
  24. Edwards Richard C. (Ringwood NJ) Kolesa Michael S. (Suffern NY) Ishikawa Hiroichi (Mahwah NJ), Wafer processing cluster tool batch preheating and degassing method.

이 특허를 인용한 특허 (78)

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  70. Adibi, Babak; Murrer, Edward S., Solar cell fabrication with faceting and ion implantation.
  71. Holman, Thomas J.; Atanasoska, Liliana, Stent with embedded material.
  72. Weber, Jan, Stents with ceramic drug reservoir layer and methods of making and using the same.
  73. Pederson, Terry; Hieslmair, Henry; Chun, Moon; Prabhakar, Vinay; Adibi, Babak; Bluck, Terry, Substrate processing system and method.
  74. Pederson, Terry; Hieslmair, Henry; Chun, Moon; Prabhakar, Vinay; Adibi, Babak; Bluck, Terry, Substrate processing system and method.
  75. Miller, Michael A.; Wei, Ronghua; Hatton, Gregory, Superhydrophobic compositions and coating process for the internal surface of tubular structures.
  76. Miller, Michael A.; Wei, Ronghua; Hatton, Gregory J., Superhydrophobic compositions and coating process for the internal surface of tubular structures.
  77. Miller, Michael A.; Wei, Ronghua; Hatton, Gregory J., Superhydrophobic compositions and coating process for the internal surface of tubular structures.
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