초록 ▼

This invention relates to fixed abrasive articles and abrasive constructions containing at least one fluorochemical agent. The fixed abrasive articles and abrasive constructions are used in semiconductor wafer surface modification processes during the fabrication of semiconductor devices. Specifical

This invention relates to fixed abrasive articles and abrasive constructions containing at least one fluorochemical agent. The fixed abrasive articles and abrasive constructions are used in semiconductor wafer surface modification processes during the fabrication of semiconductor devices. Specifically, fixed abrasive articles comprise an abrasive composite that is coextensive with a backing and at least one fluorochemical agent associated with the composite. The invention further relates to methods of making fixed abrasive articles comprising at least one fluorochemical agent.

대표청구항 ▼

[ We claim:] [1.] A fixed abrasive article comprising a fluorochemical agent for the modification of a surface of a semiconductor wafer, comprising:(a) three-dimensional abrasive composites, each composite comprising a plurality of abrasive particles fixed and dispersed in a binder providing a textu

[ We claim:] [1.] A fixed abrasive article comprising a fluorochemical agent for the modification of a surface of a semiconductor wafer, comprising:(a) three-dimensional abrasive composites, each composite comprising a plurality of abrasive particles fixed and dispersed in a binder providing a textured exposed major surface of a fixed abrasive article;(b) at least one fluorochemical agent associated with the abrasive composites; and(c) a backing coextensive with the abrasive composites. [17.] A method of modifying an exposed surface of a semiconductor wafer, comprising the steps of:(a) contacting the surface with a fixed abrasive article comprising three-dimensional abrasive composites, each composite comprising a plurality of abrasive particles fixed and dispersed in a binder wherein the abrasive composites are associated with at least one fluorochemical agent and are coextensive with a backing; and(b) moving the wafer and the abrasive article relative to each other to modify the surface of the wafer. The method of claim 17, wherein the at least one fluorochemical agent is dispersed in a working liquid prior to the fluorochemical's association with the abrasive composite. The method of claim 17, wherein the surface of the wafer comprises metal.