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Heat conductive interface material 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F28F-027/00
출원번호 US-0008758 (1998-01-19)
발명자 / 주소
  • Kelley Lawrence R.
출원인 / 주소
  • TRW Inc.
대리인 / 주소
    Yatsko
인용정보 피인용 횟수 : 34  인용 특허 : 14

초록

There is provided a technique for removing unwanted heat from a heat generating device 12 operating aboard a space vehicle orbiting in outer space by placing a heat conductive interface 10 between the device and a support platform 14. The interface 10 comprises an array of spaced apart strips 16 mad

대표청구항

[ What is claimed is:] [1.] A heat transfer apparatus comprising:a heat generating device having a heat dissipating surface, said heat generating device including a first flange on one side of the device and a second flange on an opposite side of the device;a platform;a heat conductive interface dis

이 특허에 인용된 특허 (14)

  1. Elliott Patrick H. (Lancaster OH) Funk James L. (Lancaster OH), Adjustable multilayer thermal mirror insulation.
  2. Haushalter Frederick W. (Kenton OH), Compressed fin heat sink.
  3. Martin Jacob H. (Wellesley MA), Conforming heat sink assembly.
  4. Foley John P. (Greenwich CT) Millas Gary P. (Windsor CT) Elliott Daniel L. (Southington CT), Cooling arrangement.
  5. Chapman Sydney G. (Winchester GBX), Flexible printed circuit package and flexible printed circuit for incorporating in such a package.
  6. Jones Jack A. (Los Angeles CA) Petrick S. Walter (La Canada CA) Bard Steven (Northridge CA), Flexible thermal apparatus for mounting of thermoelectric cooler.
  7. Ragland Raymond E. (Union MO), Insulating apparatus and method for attaching an insulating pad to a support.
  8. Chall ; Jr. Louis E. (Costa Mesa CA), Interconnection system for integrated circuit chips.
  9. Altoz Frank E. (Catonsville MD) Winn William H. (Linthicum MD), Mechanical heat transfer device.
  10. Fluegel Kyle G. (Greenville TX), Modular liquid skin heat exchanger.
  11. Takahashi Nobuaki (Tokyo JPX), Package with improved heat transfer structure for semiconductor device.
  12. Sheridan William M. (St. Louis MO) Ragland Raymond E. (Union MO), Pad including heat sink and thermal insulation areas.
  13. Daszkowski Joseph M. (New Hyde Park NY), Thermal link.
  14. Yamada Kenji (Chiryu JPX) Tomatsu Yoshitaka (Nagoya JPX) Oike Tatsuya (Okazaki JPX) Nishizawa Kazutoshi (Toyoake JPX), Thermoelectric transducer apparatus comprising N- and P-type semiconductors and having electronic control capabilities.

이 특허를 인용한 특허 (34)

  1. Hardin, Randall; Keihl, John; Lytle, Duane, Anchoring inserts, electrode assemblies, and plasma processing chambers.
  2. Hardin, Randall; Keihl, Jonathan; Lytle, Duane, Anchoring inserts, electrode assemblies, and plasma processing chambers.
  3. Motohashi, Toshiyuki; Otsuka, Takashi; Sakuma, Satoshi; Kawaguchi, Tatsunari; Shimonosono, Hitoshi; Sonou, Yoshito; Hanada, Tomoyuki, Assembled battery.
  4. Farrow,Timothy Samuel; Makley,Albert Vincent, Compliant thermal interface for electronic equipment.
  5. Thompson, Alex; Ward, Terence G., Conformable interface device for improved electrical joint.
  6. Prinz, Dominik; Koester, Stephan; Emmerich, Andreas; Talmon, Jens, Device for cooling batteries.
  7. Patrick, Roger; Dhindsa, Raj; Bettencourt, Greg; Marakhtanov, Alexei, Electrode assembly and plasma processing chamber utilizing thermally conductive gasket.
  8. Patrick, Roger; Dhindsa, Raj; Bettencourt, Greg; Marakhtanov, Alexei, Electrode assembly and plasma processing chamber utilizing thermally conductive gasket and o-rings.
  9. Yang, Wei; Hilton, Leonard; Gu, Yuandong; Park, Jong, Fin fabrication process for entrainment heat sink.
  10. Kilroy, Kevin Donald; Miller, Darren L.; Wavering, Jeffrey T., Flexible thermal transfer strips.
  11. Gregory T. Wyler ; Peter B. Favini ; Blaine C. Wotring ; Bibek Chapagain, Folded fin heat sink and fan attachment.
  12. Gu, Yuandong; Yang, Wei, Heat sink fin including angular dimples.
  13. Paquette, Jeffrey; Cheyne, Scott R.; Ellsworth, Joseph R.; Martinez, Michael P.; Trahan, Michael R., Heat sink interface having three-dimensional tolerance compensation.
  14. Thompson, Alex; Ward, Terence G., Heat transfer plate.
  15. Ochi, Yuzo; Oguchi, Kentaro; Kubomura, Shoji, Heat-dissipating structure for optical isolator.
  16. Dando, III, Charles H.; Larcheveque, Jon; Vos, David L., High performance large tolerance heat sink.
  17. Hartke, David J; Dibene, II, Joseph T.; Derian, Edward J.; Broder, James M., Integrated power delivery and cooling system for high power microprocessors.
  18. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  19. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.
  20. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
  21. Akihiro Fukatsu JP; Kan Kinouchi JP; Mitsuhiro Saito JP; Yoshiharu Harada JP, Semiconductor device having heat radiating member.
  22. Derian, Edward J.; DiBene, II, Joseph Ted; Hartke, David H., Separable power delivery connector.
  23. Mathur,Achint P.; Fulmer,Jason Michael, Shell and plate heat exchanger.
  24. Bettencourt, Greg; Dhindsa, Raj; Diercks, George; Hardin, Randall A.; Keihl, Jon; Lytle, Duane; Marakhtanov, Alexei; Patrick, Roger; Pegg, John; Spencer, Shannon, Showerhead electrode assemblies and plasma processing chambers incorporating the same.
  25. Stevenson, Tom; Dhindsa, Rajinder, Showerhead electrode assemblies for plasma processing apparatuses.
  26. Stevenson, Tom; Dhindsa, Rajinder, Showerhead electrode assemblies for plasma processing apparatuses.
  27. Bettencourt, Greg; Dhindsa, Raj; Diercks, George; Hardin, Randall A.; Keihl, Jon; Lytle, Duane; Marakhtanov, Alexei; Patrick, Roger; Pegg, John; Spencer, Shannon, Showerhead electrodes.
  28. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
  29. Jarrett, Robert N.; Merritt, Craig K., Technique for forming a thermally conductive interface with patterned metal foil.
  30. Dhindsa, Rajinder, Temperature controlled hot edge ring assembly.
  31. Solbrekken, Gary L.; Simmons, Craig B.; Chiu, Chia-Pin, Thermal interface material on a mesh carrier.
  32. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
  33. Nair, Rajesh; Obinelo, Izundu F., Uniform heat dissipating and cooling heat sink.
  34. Groll, William A., Vacuum cooking or warming appliance.
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