초록 ▼

An improved cooling apparatus and related method are disclosed for air-cooling an array of electronic components mounted on a substrate. The cooling apparatus directs high-speed jets of cooling air directly at special heat sinks bonded to the particular electronic components that generate the most h

An improved cooling apparatus and related method are disclosed for air-cooling an array of electronic components mounted on a substrate. The cooling apparatus directs high-speed jets of cooling air directly at special heat sinks bonded to the particular electronic components that generate the most heat (e.g., microprocessors), with the air thereafter being directed to flow tangentially across the remaining components, to air-cool those components, as well. This configuration enables the requisite component cooling to be achieved with substantially reduced air flow rates and with heat sinks of substantially reduced size, as compared to prior cooling apparatus.

대표청구항 ▼

[ We claim:] [1.] An air-cooled electronic system, comprising:a substrate;first and second groups of electronic devices mounted on the substrate, wherein each electronic device in the first group is configured to generate an amount of heat greater than a first predetermined threshold and each electr

[ We claim:] [1.] An air-cooled electronic system, comprising:a substrate;first and second groups of electronic devices mounted on the substrate, wherein each electronic device in the first group is configured to generate an amount of heat greater than a first predetermined threshold and each electronic device in the second group is configured to generate an amount of heat less than a second predetermined threshold;a plurality of heat sinks, each secured to a separate one of the electronic devices in the first group of devices, in a manner by which heat can be transported from each such device to the corresponding heat sink, wherein each heat sink is configured to include a central recess, a lateral periphery, and a plurality of air paths connecting the central recess with the lateral periphery; andan air source including a plurality of ducts, each duct configured to emit a separate jet of cooling air and to direct this air jet into the central recess of a separate one of the plurality of heat sinks, whereupon the air exits therefrom via the plurality of air paths, to cool the heat sinks and thereby the associated electronic devices in the first group of devices with non-preheated air, after which the air is directed to flow past the electronic devices in the second group of devices, to cool those devices, as well;wherein each of the plurality of ducts terminates at a location spaced from its associated heat sink, such that air located between the duct and the heat sink is entrained by the air jet emitted by the duct and directed with the air jet toward the heat sink, to enhance the cooling effect.