초록 ▼

A system for cooling electronic components in the downhole assembly of a drill string through which a drilling fluid flows. The cooling system includes a thermoelectric cooler that conducts heat from the electronic component to a first heat transfer surface of a thermal conductor. The heat received

A system for cooling electronic components in the downhole assembly of a drill string through which a drilling fluid flows. The cooling system includes a thermoelectric cooler that conducts heat from the electronic component to a first heat transfer surface of a thermal conductor. The heat received by the first heat transfer surface is transferred within the thermal conductor to a second heat transfer surface that then transfers the heat to a housing. The housing transfers the heat to the drilling fluid flowing over the housing. To ensure good conductive heat transfer between the electronic component, the thermoelectric cooler, the thermal conductor and the housing, and to absorb shock, vibration and differential thermal expansion, these components are supported on a spring mechanism that generates a force that biases the electronic component against the thermoelectric cooler, the thermoelectric cooler against the thermal conductor and the thermal conductor against the housing.

대표청구항 ▼

[ What is claimed:] [12.] A cooled electronic system for use in a well containing a fluid, said cooled electronic system comprising:a) a housing having first and second surfaces and adapted to be disposed within said well, whereby said first surface of said housing is exposed to said fluid and is in

[ What is claimed:] [12.] A cooled electronic system for use in a well containing a fluid, said cooled electronic system comprising:a) a housing having first and second surfaces and adapted to be disposed within said well, whereby said first surface of said housing is exposed to said fluid and is in convective heat transfer therewith;b) at least a first thermoelectric cooler, said first thermoelectric cooler comprising (i) a hot plate on one side thereof, (ii) a cold plate on another side thereof, and (iii) means for transferring heat from said cold plate to said hot plate;c) an electronic component, said electronic component being in heat flow communication with said cold plate of said first thermoelectric cooler, whereby said cold plate receives heat from said electronic component and transfers said received heat to said hot plate;d) an elastically deformable support for supporting said electronic component and said thermoelectric cooler within said housing, said elastically deformable support having means for generating an elastic force biasing said electronic component and said thermoelectric cooler toward a first portion of said housing inner surface.