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Adhesive of epoxy resin, amine-terminated polyamide and polyamine 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08G-059/60
  • C08K-003/26
  • C08K-003/36
  • C08L-063/02
  • C08L-077/08
출원번호 US-0449870 (1999-11-29)
발명자 / 주소
  • Stewart Steven Lee
  • Kincaid Derek Scott
출원인 / 주소
  • Shell Oil Company
대리인 / 주소
    Holguin
인용정보 피인용 횟수 : 23  인용 특허 : 25

초록

wherein the tensile modulus of the flexible industrial adhesive composition is less than 500,000 psi and the tensile elongation of the flexible industrial adhesive composition is greater than 10%. The flexible industrial adhesive compositions of the present invention can be used in industrial assemb

대표청구항

[ What is claimed is:] [1.] A flexible industrial adhesive composition which bonds thermoplastic polymer substrates and substrates having low stiffness, to materials selected from the group consisting of metals, fabrics, rubbers, engineered materials and concrete, said flexible industrial adhesive c

이 특허에 인용된 특허 (25)

  1. Leoni Roberto (Milan ITX) Rossini Angela (Milan ITX) Taccani Massimo (Arcore ITX), Adhesion promoters of plastisols, capable of maintaining plastisol color stable towards the effect of the application th.
  2. Frihart Charles R. (Lawrenceville NJ) Gordon Ronald L. (Springfield GA), Adhesive of amine-terminated polyamide and epoxy resin.
  3. Frihart Charles R. (Lawrenceville NJ) Gordon Ronald L. (Springfield GA), Adhesive of amine-terminated, piperazine-containing polyamide and epoxy resin.
  4. Mehta ; Ramesh, Adhesive systems comprising a bisamino piperazine-containing polyamide.
  5. Walker Frederick H. (Doylestown PA), Amide-containing self-emulsifying epoxy curing agent.
  6. Corley Larry Steven ; Kincaid Derek Scott ; Young Glenda Carole, Amine-terminated polyamide in oil-in-water emulsion.
  7. Corley Larry Steven ; Kincaid Derek Scott ; Young Glenda Carole, Aqueous dispersions of polyamide-amine derived from aminoalkylpiperazine with epoxy resin.
  8. Seki Takao (Gifu JPX) Sano Yasuo (Osaka JPX), Baseball bat and production thereof.
  9. Ray-Chaudhuri Dilip K. (Bridgewater NJ) Chiao Wen B. (Somerville NJ) Schoenberg Jules E. (Scotch Plains NJ), Co-curing agents for epoxy resins.
  10. Frihart Charles R. (Lawrenceville NJ), Curable adhesive compositions containing polyamide resins.
  11. Drawert Manfred (Froendenberg DEX) Krase Horst (Hamm DEX) Skoda Hans D. (Kamen DEX), Hardenable synthetic resin mixtures.
  12. Marten Manfred (Mainz DEX) Stengel-Rutkowski Bernhard (Wiesbaden DEX) Godau Claus (Kiedrich DEX), Hardener for epoxy resins comprising reaction products of polyamidoamines, secondary polyamines and epoxy-polyol adducts.
  13. Bouche ; Claude ; Lenclud ; Francois, Hardeners for epoxy resins.
  14. Sasse H. Rainer (Aachen DEX) Conrad Karl-Hermann (Moers DEX) Herzog Rolf (Bottrop DEX) Klein Hans (Hubert DEX) Meier Bert (Wesel-Blumenkamp DEX), Hardeners for epoxy resins.
  15. Kooijmans Petrus G. (Amsterdam NLX) Raudenbusch Werner T. (Amsterdam NLX) Van Steenis Adrianus M. C. (Amsterdam NLX) Kunze Wolfgang (Amsterdam NLX) Seelen-Kruijssen Josepha M. E. (Amsterdam NLX), Heat-curable thermosetting resin binder compositions comprising a non-acidic resinous compound, a non-acidic polyester c.
  16. Heebner Gerald W. (Savannah GA), Heat-resistant adhesive for use especially in making sterilizable packaging.
  17. Batdorf ; Vernon H., Method of using structural adhesive.
  18. Smith George A. (Newtown PA) Frihart Charles R. (Lawrenceville NJ), One-component, curable epoxy/polyamide resin dispersions with enhanced stability containing one or more amino acids.
  19. Nanpei Masaru (Otsu JPX) Fujimura Toshiaki (Otsu JPX) Kouda Hajime (Otsu JPX) Kasho Yoshihiro (Otsu JPX) Etoh Kuniomi (Otsu JPX), Photosensitive polyamide resin composition useful for making relief printing plate.
  20. Andrews ; Christopher Michael, Polyhalocarboxylic acid salts as accelerators for curing epoxide resins.
  21. Drawert Manfred (Froendenberg DEX) Krase Horst (Rhynern DEX), Synthetic resin mixtures.
  22. Kooymans Petrus G. (Amsterdam NLX) Wintraecken Johannes J. M. H. (Amsterdam NLX) Raudenbusch Werner T. (Amsterdam NLX) Seelen-Kruijssen Josepha M. E. (Amsterdam NLX) Schreurs Gerardus C. M. (Amsterda, Thermosetting resinous binder compositions, their preparation and use as coating materials.
  23. Frihart Charles R. (Lawrenceville NJ), Three-component curable resin compositions.
  24. Frihart Charles R. (Lawrenceville NJ), Two-component curable hot melt compositions.
  25. Marten Manfred (Mainz DEX) Godau Claus (Kiedrich DEX) Schmelzer Heinz (Rmmelsheim DEX), Use of polyamidoamines as curing agents for epoxy resins and curable mixtures containing these substances wherein the ac.

이 특허를 인용한 특허 (23)

  1. Czaplicki, Michael J.; Kosal, David, Activatable material.
  2. Czaplicki,Michael J.; Hable,Christopher; Carlson,David, Activatable material for sealing, baffling or reinforcing and method of forming same.
  3. Sheasley,David; Kosal,David; Antrim,Jeanne, Activatable material for sealing, baffling or reinforcing and method of forming same.
  4. Werner, Dietmar, Cavity filling.
  5. Dettloff, Marvin L.; Lowrey, James R.; Naik, Hemant A.; Marks, Maurice J., Curable compositions containing cyclic diamine and cured products therefrom.
  6. Hadley, Philip C.; Irons, Michelle M.; Cawse, John, Cure accelerators.
  7. Kassa,Abraham; Harthcock,Matthew; Apfel,Jeffrey, Expandable material.
  8. Roberts,Jennifer Lynn, Fastener tapes.
  9. Kassa, Abraham; Apfel, Jeffrey R., Magnetic composition.
  10. Finerman, Terry; Carlson, David; Harthcock, Matthew; Knepper, Craig; Chmielewski, Craig; Ferng, William B.; Hable, Christopher; Kassa, Abraham; Jensen, Blair, Method of sealing an interface.
  11. Czaplicki, Michael J.; Bradley, Renee; Bradley, Jeff, Paintable material.
  12. Kassa, Abraham; Bradley, Renee, Paintable seal system.
  13. Kassa,Abraham; Bradley,Renee, Paintable seal system.
  14. Carlson, David; Madaus, Brandon; Harthcock, Matthew; Barton, Kearney; Taylor, Charles L.; Walker, Jason, Panel structure.
  15. Finerman, Terry; Kassa, Abraham, Sealant material.
  16. Chmielewski, Craig; Madaus, Brandon, Structural composite laminates.
  17. Czaplicki, Michael J.; Kosal, David J.; Antrim, Jeanne, Structural hot melt material and methods.
  18. Center, Curtis R; Tao, Yuefei; Thompson, Jennifer L; Wilczek, Lech; Zhao, Chen Qian; Duncan, Andrew Jay, Thermoplastic melt-mixed composition with amino acid heat stabilizer.
  19. Tao, Yuefei; Wilczek, Lech; Thompson, Jennifer Leigh, Thermoplastic melt-mixed composition with epoxy-amino acid compound heat stabilizer and processes for their preparation.
  20. Tao, Yuefei; Wilczek, Lech, Thermoplastic melt-mixed composition with polyetherol heat stabilizer.
  21. Czaplicki, Michael J.; Kosal, David J.; Madaus, Keith, Two component (epoxy/amine) structural foam-in-place material.
  22. Czaplicki,Michael J.; Kosal,David J.; Hicks,Kevin, Two component (epoxy/amine) structural foam-in-place material.
  23. Czaplicki, Michael J.; Kosal, David J.; Madaus, Keith, Two-component (epoxy/amine) structural foam-in-place material.
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