초록 ▼

An integrated circuit is provided. The integrated circuit includes a substrate and at least one dielectric layer and a metal layer formed upon the substrate. The at least one dielectric layer includes a terminal dielectric layer. The integrated circuit further includes a planar passivating layer for

An integrated circuit is provided. The integrated circuit includes a substrate and at least one dielectric layer and a metal layer formed upon the substrate. The at least one dielectric layer includes a terminal dielectric layer. The integrated circuit further includes a planar passivating layer formed upon the terminal dielectric layer.

대표청구항 ▼

[ What is claimed is:] [1.] An integrated circuit (IC) comprising:a substrate including a plurality of devices disposed in an active area of said substrate and a plurality of layers of interconnect metallization, a portion of said devices coupled to one another through a terminal interconnect;a guar

[ What is claimed is:] [1.] An integrated circuit (IC) comprising:a substrate including a plurality of devices disposed in an active area of said substrate and a plurality of layers of interconnect metallization, a portion of said devices coupled to one another through a terminal interconnect;a guard wall formed of a via to said terminal interconnect on said substrate, said guard wall surrounding a periphery of said active area;a terminal dielectric layer formed on said guard wall; anda hard planar passivating layer formed upon said terminal dielectric layer and a soft planar passivating layer formed upon said hard planar passivating layer.