초록 ▼

An integrated circuit device comprised of a backlapped integrated circuit (IC) and a molding compound. The molding compound is deemed to be secure if it is made of a material which, when tampered, increases the likelihood of damaging a portion of the IC. Otherwise, the molding compound is deemed to

An integrated circuit device comprised of a backlapped integrated circuit (IC) and a molding compound. The molding compound is deemed to be secure if it is made of a material which, when tampered, increases the likelihood of damaging a portion of the IC. Otherwise, the molding compound is deemed to be non-secure. This molding compound substantially surrounds the backlapped IC in order to prevent unwanted and unauthorized physical analysis.

대표청구항 ▼

[ What we claim is:] [1.] A secure integrated circuit comprising:a backlapped integrated circuit having a top surface and a bottom surface, the backlapped integrated circuit includes an original set of pads and a redundant set of pads corresponding in number to the original set of pads, each pad of

[ What we claim is:] [1.] A secure integrated circuit comprising:a backlapped integrated circuit having a top surface and a bottom surface, the backlapped integrated circuit includes an original set of pads and a redundant set of pads corresponding in number to the original set of pads, each pad of the redundant set of pads is electrically coupled to at least one corresponding pad of the original set of pads and accessible by a lead wire from the top surface; anda molding compound substantially covering the original set of pads, the redundant set of pads and at least the top surface and the bottom surface of the backlapped integrated.