초록 ▼

An electronic apparatus includes a circuit board, a connector provided on the circuit board, an integrated circuit module attached to the connector, and a heat sink attached to the integrated circuit module. A heat transfer device is disposed at a position separate from the heat sink and arranged in

An electronic apparatus includes a circuit board, a connector provided on the circuit board, an integrated circuit module attached to the connector, and a heat sink attached to the integrated circuit module. A heat transfer device is disposed at a position separate from the heat sink and arranged in a cooling air passageway. A heat conduction path thermally connects the heat sink with the heat transfer device. Since the heat transfer device can be arranged outside the frame of the apparatus, the heat transfer device can be constructed to have a sufficient cooling capacity, while the integrated circuit module and the heat sink can be constructed in a relatively compact design.

대표청구항 ▼

[ What is claimed is:] [1.] An electronic apparatus comprising:a circuit board;a connector provided on the circuit board;an integrated circuit module attached to the connector;a heat sink attached to the integrated circuit module;heat transfer means disposed at a position separate from the heat sink

[ What is claimed is:] [1.] An electronic apparatus comprising:a circuit board;a connector provided on the circuit board;an integrated circuit module attached to the connector;a heat sink attached to the integrated circuit module;heat transfer means disposed at a position separate from the heat sink and arranged in a cooling air passageway for transferring heat, wherein the connector the integrated circuit module and the heat sink are arranged on one side of the circuit board, and the heat transfer means is arranged on the other side of the circuit board; anda heat conduction path for thermally connecting the heat sink to the heat transfer means.